JPS63160309A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63160309A JPS63160309A JP61314049A JP31404986A JPS63160309A JP S63160309 A JPS63160309 A JP S63160309A JP 61314049 A JP61314049 A JP 61314049A JP 31404986 A JP31404986 A JP 31404986A JP S63160309 A JPS63160309 A JP S63160309A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
等で用いられる摺動接点袋「の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
Concerning improvements in sliding contact bags used in, etc.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン（Ｃ）や酸化ルテニウム（ＲｕＯｚ
）などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易（て寿命が短く、接
触信頼性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuOz) on a ceramic substrate.
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. However, it had a short lifespan and was somewhat lacking in contact reliability.
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ａ
ｇ−樹脂系の導体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にＡｇ
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のＡｇ接点材を硫化防止
の為、Ａｇ−Ｐｄ３０〜５０ｗ ｔ％に置き換えている
。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
g-Replace with resin-based conductive paste and harden, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50 wt% of Ag-Pd to prevent sulfurization.
然し乍ら、Ａ ｇ −Ｐ ｄ ３０〜５０ｗｔ％の接点
材はＨｖ１６０〜２００で硬すぎるのに対し、Ａｇ−樹
脂系の導体ペーストの硬化物である厚膜導体パターンが
軟らかい為、摩耗が多くなり、早期に寿命となる。However, the contact material containing 30 to 50 wt% of Ag-Pd is too hard at Hv160 to 200, whereas the thick film conductor pattern, which is a cured product of Ag-resin conductor paste, is soft, resulting in increased wear. It reaches the end of its lifespan early.
更にＡｇ−Ｐｄ３０〜５０ｗ ｔ％接点材は、電気伝導
度（ＩＡＣ３３，８〜５．５）が低い為、発熱する等の
問題点があった。Furthermore, since the Ag-Pd 30-50wt% contact material has a low electrical conductivity (IAC33, 8-5.5), there are problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｗ４０〜
７５４％の１４点材がスプリング端子材に取付けられて
成るすり接点とにより構成されていることを特徴とする
。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing an Ag-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- W40～
754% of the 14-point material is comprised of a sliding contact formed by being attached to a spring terminal material.
本発明の摺動接点装置に於いて゛、すり接点の接点材を
Ａ ｇ −Ｗ４０〜７５ｗｔ％とした理由は、Ａｇ中の
Ｗが４０ｗｔ％未満だと潤滑効果が薄く、そのすり接点
が負うミックス基板上のＡｇ−樹脂系の厚膜扉体パター
ンとの接触に於いて凝着、剥離が生じ、７５ｗｔ％を超
えると、酸化物の生成量が多くなりノイズの発生原因と
なるからである。In the sliding contact device of the present invention, the reason why the contact material of the sliding contact is set to 40 to 75 wt% of Ag-W is that if the W content in Ag is less than 40 wt%, the lubricating effect is weak, and the contact material of the sliding contact is This is because adhesion and peeling occur upon contact with the Ag-resin thick film door pattern on the substrate, and if it exceeds 75 wt%, the amount of oxide produced increases, causing noise.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点（７）Ａｇ−Ｗ４０〜７５ｗｔ％接点材の
硬さくＨｖｌＯＯ〜１３０）が軟らかく滑りやすいので
、接触抵抗が低く安定していて、Ａｇ−樹脂系厚膜導体
パターンを損耗することが無く、又凝着、剥離が殆んど
無くなり、摩耗が減少するので、良好な接触が得られる
。更にすり接点のＡｇ−Ｗ４０〜７５賀ｔ％接点材の電
気伝導度がｌＡＣ３４０〜６０％と良好であるので、・
発熱しない。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the sliding contact (7) Ag-W40-75wt% contact material 130) is soft and slippery, so the contact resistance is low and stable, and the Ag-resin thick film conductor pattern is not damaged, and there is almost no adhesion or peeling, reducing wear, so it is good. You can get good contact. Furthermore, the electrical conductivity of the Ag-W 40-75% contact material for the sliding contact is as good as 340-60% lAC, so...
No fever.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚０．６ｎ、直径３０ｍ麿の純度９８％のＡＪｚ
Ｏ＝基板１上の外周に幅３龍でＲｕ Ｏｚの抵抗ペース
トをスクリーン印刷し、８００℃で焼成して厚さｌＯμ
の厚膜抵抗パターン２を形成し、この厚膜抵抗パターン
２に接続して、周方向に、Ａｇ−樹脂系導体ペーストを
スクリーン印刷し、１３０°Ｃで硬化して、０ 、２
ｍｍ間隔に幅０．２鴎、長さ７龍、厚さＩＯμの厚膜導
体パターン（Ａｇ−樹脂２６ｗｔ％）３を形成して配線
板４とした。一方、この配線板４の厚膜導体パターン３
に対向して夫々摺動するようになされた２種のすり接点
５は、Ａｇ−Ｗ５０ｗｔ％とＡｇ Ｗ６５ｗｔ％の２
種の接点線材（直径１ 、５ ｍｍ ）から作製した頭
部径３龍、頭部厚さ０．６ｍｍ、脚部径１．５鶴、脚部
長１．５電の２種のリベット接点６を、夫々幅４龍、厚
さＯ，１５ｍｍのＢｅ−Ｃｕより成るスプリング端子材
゛７の接点取付穴に挿入しかしめて成るものである。(Example) To explain an example of the sliding contact device of the present invention, a 98% pure AJz with a plate thickness of 0.6n and a diameter of 30m as shown in the figure.
O=Screen print RuOz resistor paste with a width of 3 on the outer periphery of the substrate 1, and bake it at 800℃ to a thickness of lOμ
A thick film resistance pattern 2 of
A wiring board 4 was prepared by forming thick film conductor patterns (Ag-resin 26 wt%) 3 having a width of 0.2 mm, a length of 7 mm, and a thickness of IOμ. On the other hand, thick film conductor pattern 3 of this wiring board 4
The two types of sliding contacts 5 are made of Ag-W 50 wt% and Ag-W 65 wt%.
Two types of rivet contacts 6 were made from seed contact wires (diameters 1 and 5 mm): one with a head diameter of 3 mm, a head thickness of 0.6 mm, a leg diameter of 1.5 mm, and a leg length of 1.5 mm. , are inserted into the contact mounting holes of spring terminal materials 7 made of Be-Cu, each having a width of 4 mm, a thickness of 0, and 15 mm.
このように構成された実施例１．２の摺動接点装置と、
Ａｇ Ｐｄ３０ｗｔ％接点材を有するすり接点を配線
板のＡｇ−樹脂の厚膜導体パターンと対向させて成る従
来の摺動接点装置とを、下記の試験条件にて摺動開閉試
験を行った処、下記の表に示すような結果を得た。The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions on a conventional sliding contact device consisting of a sliding contact having a contact material of 30 wt% AgPd and facing a thick film conductor pattern made of Ag-resin on a wiring board. The results shown in the table below were obtained.
試験条件。Test condition.
接触カニ１０ｇ、動作：回転往復型（５５度）、駆動二
６０ストローク／ｍｉｎ、通電：１２■、１００ｍＡ上
記の表で明らかなように実施例１．２の摺動接点装置は
、従来例の摺動装置に比し、寿命が大概倍増しているこ
とが判る。これはひとえにすり接点５のＡ ｇ −Ｗ４
０〜７５４％接点材の硬さが軟らかく滑りやすい為、対
向するＡｇ−樹脂系の厚膜導体パターン３を損耗するこ
とが無く、又凝着、剥離することが無く、摩耗が減少し
、更にＡｇ−Ｗ４０〜７５ｗｔ％の接点材の電気伝導度
が良好で発熱することが無いからである。Contact crab 10g, operation: rotating reciprocating type (55 degrees), drive 260 strokes/min, energization: 12cm, 100mA As is clear from the table above, the sliding contact device of Example 1.2 is different from the conventional example. It can be seen that the lifespan is almost twice as long as that of a sliding device. This is simply the A g -W4 of the sliding contact 5.
0 to 754% Since the hardness of the contact material is soft and slippery, the opposing Ag-resin thick film conductor pattern 3 will not be damaged, and will not adhere or peel off, reducing wear. This is because the contact material containing 40 to 75 wt% of Ag-W has good electrical conductivity and does not generate heat.
尚、前記の寿命は、厚膜導体パターン３の摩耗により、
すり接点５がＡｊ２ｚＯ：＋基板との接触となって、オ
ープン状態（接触抵抗無限大）となった場合と、厚膜導
体パターン３間のスリット部の目詰まりによりショート
した場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The evaluation was made based on the case where the sliding contact 5 came into contact with the Aj2zO:+ substrate and became an open state (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜温体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern reciprocated back and forth in a bellows shape is formed on a ceramic substrate, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film hot body pattern. It is also possible to use a sliding contact device consisting of a sliding contact that slides.
（発明の効果）
以上の説明で判るように本発明の摺動接点装置は、すり
接点のＡｇ−Ｗ４０〜７５−を殉が硬さくＨｖ１００〜
１３０）が軟らかく滑りやすいので、接触作用において
セラミックス基板上のＡｇ−樹脂系厚膜導体パターンが
損耗することが無く、又凝着、剥離が殆んど無くなり、
摩耗が減少するので、良好な接触が得られる。(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention can harden Ag-W40 to 75, which is a sliding contact, with a hardness of Hv100 to
130) is soft and slippery, so the Ag-resin thick film conductor pattern on the ceramic substrate will not be damaged by contact action, and there will be almost no adhesion or peeling.
Good contact is obtained as wear is reduced.
従って、接触信頼性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のＡｇ−Ｗ〜７５ｗ ｔ％
接点材の電気伝導度が良好であるので、接触作用におい
て、発熱せず、溶着が起こりにくい。従って、摺動接点
装置の耐溶着性が著しく向上する。Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag-W of the sliding contact ~75wt%
Since the contact material has good electrical conductivity, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｗ４０〜
７５ｗｔ％の接点材がスプリング端子材に取り付けられ
て成るすり接点とにより構成されていることを特徴とす
る摺動接点装置。A wiring board is formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting it to the thick film resistor pattern to harden an Ag-resin conductor paste to form a thick film conductor pattern. , made to be able to slide against the thick film conductor pattern of this wiring board, Ag-W40~
A sliding contact device comprising a sliding contact in which 75 wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314049A JPS63160309A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314049A JPS63160309A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63160309A true JPS63160309A (en) | 1988-07-04 |
Family
ID=18048600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61314049A Pending JPS63160309A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63160309A (en) |
-
1986
- 1986-12-24 JP JP61314049A patent/JPS63160309A/en active Pending
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