JPS63160301A - Slide contactor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuOz) on a ceramic substrate.
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. It was easy to use, short-lived, and somewhat lacking in contact reliability.

For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
g-Replace with resin-based conductive paste and harden, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- By stacking and curing resin-based conductor paste, the contact properties are improved, and the Ag contact material of the sliding contact is replaced with 30 to 50 wt% of Ag-Pd to prevent sulfurization.

However, the contact material containing 30 to 50 wt% of Ag-Pd is too hard at Hv160 to 200, whereas the thick film conductor pattern, which is a cured product of Ag-resin conductor paste, is soft, resulting in increased wear. It reaches the end of its lifespan early.

Furthermore, since the Ag-Pd 30-50 wt% contact material has a low electrical conductivity (IAC33.8-5.5), there are problems such as heat generation.

(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(Means for Solving the Problem 4) The sliding contact device of the present invention for solving the above-mentioned problem is to form a thick film resistance pattern by firing a resistance paste on a ceramic substrate, and to form a thick film resistance pattern on a ceramic substrate. A wiring board formed by connecting to a film resistance pattern and forming a thick film conductor pattern by curing an Ag-resin conductor paste, and an Ag wire which can be slid against the thick film conductor pattern of the wiring board. -Cd0.
It is characterized in that it is constituted by a sliding contact formed by attaching 5 to 15 wt% of contact material to a spring terminal material.

In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-CdQ to 5 to 15 wt% is that C in Ag
If d is less than 0.5 wt%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Ag-resin thick film conductor pattern on the ceramic substrate.If d exceeds 15 wt%, However, the amount of oxides produced increases, causing noise.

(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-Cd 0.5 to 15 wt% contact material of the sliding contact is Hv 80. ~110) is soft and slippery, so the contact resistance is low and stable, there is no damage to the Ag-resin thick film conductor pattern, and there is almost no adhesion or peeling, reducing wear. Therefore, good contact can be obtained. Furthermore, since the electrical conductivity of the Ag-Cd 0.5-15 wt% contact material of the sliding contact is as good as 340-60% lAC, no heat is generated.

(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, the plate thickness Q is 5 mm, the diameter is 30 m, and the purity is 98%.
Ru on the outer periphery of the A 1 z 03 substrate 1 with a width of 3 mm.
0z resistor paste is screen printed and baked at 800°C to form a thick film resistor pattern 2 with a thickness of 10 μm. Connected to this thick film resistor pattern 2, an Ag-resin conductor paste is applied in the circumferential direction. Screen print and cure at 130℃, width 0.2 cranes at 0.2 crane intervals, length 7 x H1 thickness 1
A wiring board 4 was formed by forming a thick film conductor pattern (Ag-resin 26 wt %) 3 having a thickness of 0 μm. On the other hand, the 2 parts are slidably arranged to face the thick film conductor pattern 3 of the wiring board 4, respectively.
The seed sliding contact 5 is composed of 1wt% Ag-Cd and Ag-Cd.
3-Two types of contact wires containing 0.1 wt% nickel (diameter 1
, 5 n+) with a head diameter of 3 cranes and a head thickness of 0.
Two types of rivet contacts 6 with a diameter of 6 mm, a leg diameter of 1 and 5 vrs, and a leg length of 1.5 + u, each with a width of 4 fins and a thickness of 0.15 w.
The contact mounting hole of the spring terminal material 7 made of Be-Cu is inserted into and tightened.

The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% A g -P d contact material facing a thick film conductor pattern made of Ag-resin on a wiring board. However, we obtained the results shown in the table below.

Test conditions Contact crab 10g, action 2 rotation reciprocating type (55 degrees), drive:
60 strokes/min, current flow: 12 mm, 100 mA As is clear from the above table, the sliding contact device of Example 1.2 has almost double the lifespan compared to the conventional sliding device. I understand that. This is simply due to the Ag-Cd0 of the sliding contact 5.
5-15wt% The hardness of the contact material is soft and slippery, so
The opposing thick film conductor pattern 3 made of Ag-resin is not damaged, and there is no adhesion or peeling, reducing wear, and the electrical conductivity of the contact material of 0.5 to 15 wt% Ag-Cd. This is because it has good properties and does not generate heat.

Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
Judgments were made based on the cases where the sliding contact 5 came into contact with the L, O, and substrate, resulting in an open state (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3. .

Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed at one end of the rectangular wiring board, and the thick H-shaped conductor patterns are preferably connected to the thick film resistor pattern and formed parallel to it at regular intervals in its longitudinal direction. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on the ceramic substrate, reciprocating back and forth in a bellows shape.
A sliding contact device may be provided which includes a wiring board on which thick film conductor patterns are formed at regular intervals, and a sliding contact that slides in opposition to the thick film conductor patterns of the wiring board.

Furthermore, as in Example 2, a part of Cd is added in an amount of 0.01 to 1 wt.
It may be replaced with an iron group element within a range of %.

(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 0.5 to 15 t% of Ag-Cd in the sliding contact, and has a hardness of HV80.
~110) is soft and slippery, so there is no wear of the Ag=resin thick film conductor pattern on the ceramic substrate during contact action (and there is almost no adhesion or separation (
This reduces wear and provides good contact.

Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, the Ag-Cd of the sliding contact is 0.5 to 15.
Since the electrical conductivity of the wt% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.

[Brief explanation of the drawing]

The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.

Claims (1)

[Claims] A wiring board is formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting it to the thick film resistor pattern to harden an Ag-resin conductor paste to form a thick film conductor pattern. , Ag-Cd0. is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which 5 to 15 wt% of contact material is attached to a spring terminal material.