JPS63196013A - Slide contactor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. have been made using carbon (C) or ruthenium oxide (RuO) on a ceramic substrate.
A wiring board made of a thick film resistor pattern formed by firing a resistance paste such as However, this sliding contact device tends to generate noise, has somewhat high contact resistance (and is unstable due to some variation), and It wears out easily and has a short lifespan.
Contact reliability was somewhat lacking.

For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with a U-resin conductor paste and cure it, or add Cu to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is changed to 30 to 50 wt% Ag-Pd to prevent sulfurization.

However, the contact material with A g-P d of 30 to 50 wt% is too hard at Hv 160 to 200, whereas the thick film conductor pattern, which is a cured product of Cu-resin conductor paste, is soft, resulting in increased wear. It reaches the end of its lifespan early.

Furthermore, since the Ag-Pd 30-50-t% contact material has a low electrical conductivity (IAC 33.8-5.5), there are problems such as heat generation.

(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by firing a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by connecting to a resistor pattern and forming a thick film conductor pattern by hardening Cu-resin conductor paste, and a wiring board that can be slid against the thick film conductor pattern of the wiring board. It is characterized in that it is constituted by a sliding contact formed by attaching a contact material containing 0.5 to 15 wt% of Ag-bismuth oxide to a spring terminal material.

In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-bismuth oxide to 0.5 to 15 wt% is that A
If the bismuth oxide in g is less than 0.5 wt%, the lubricating effect will be weak, and when the sliding contact contacts the Cu-resin thick film conductor pattern on the ceramic substrate, adhesion and peeling will occur, and the bismuth oxide This is because if it exceeds 15 wt%, it will cause noise generation.

(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the sliding contact has an Ag-bismuth oxide content of 0.5 to 15 wt%.
The hardness of the contact material (Hv 110-150) is soft and slippery, so the contact resistance is low and stable, and the Cu-resin thick film conductor pattern will not be damaged, and there will be no adhesion or
Since there is almost no peeling and wear is reduced, good contact can be obtained.Furthermore, the Ag-bismuth oxide of the sliding contact is 0.
Electrical conductivity of 5-15wt% contact material is lAC370-8
Since it is good at 0%, it does not generate heat.

(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, the plate thickness is 0.6111. 98% pure AI with a diameter of 30 cranes
Rung's resistance paste was screen printed on the outer periphery of the Z03 board 1 with a width of 31 mm, and baked at 800°C to a thickness of 10 mm.
A thick film resistor pattern 2 with a diameter of
Thick film conductor patterns (C, U-resin 26 wt %) 3 having a width of 0.2 mm, a length of 7 mm and a thickness of 10 μm were formed at intervals to form a wiring board 4 . On the other hand, the 22 types of sliding contacts 5, which are made to slide against the thick film conductor pattern 3 of the wiring board 4, are composed of 3 wt% Ag bismuth oxide, 6 wt% Ag-bismuth oxide-0.1 nickel oxide. Head diameter 3 ms, head thickness 0.6 mm, leg diameter 1 and 5 m, leg length 1.5 M made from two types of contact wires (diameter 1.5 m) of wt%
Two types of rivet contacts 6 are used, each with a width of 4 mm and a thickness of 0 mm and 1 mm.
The spring terminal member 7 is made of No. 518 Be-Cu and is inserted into a contact mounting hole with a snap.

The sliding contact devices of Examples 1 and 2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% contact material and facing a thick film conductor pattern made of Cu-resin on a wiring board. However, we obtained the results shown in the table below.

Test conditions Contact crab 10g, Operation: Rotating and reciprocating type (55 degrees), 2 Drive: 60X troc/win, Electricity: 12V, 100
mA [ " [ As is clear from the above table, the life of the sliding contact device of Example 1.2 is almost twice as long as that of the sliding contact device of the conventional example. This is because the sliding contact device Since the hardness of the Ag-bismuth oxide 0.5-15-t% contact material in No. 5 is soft and slippery, the opposing Cu-resin thick film conductor pattern 3
There is no damage to the material, no adhesion or peeling,
Wear is reduced, and Ag-Bismuth oxide 0.5~10w
This is because the electrical conductivity of the t% contact material is good and no heat is generated.

Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The evaluation was made based on the case where the sliding contact 5 came into contact with the Al, 03 substrate, resulting in an open state B (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.

Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.

Furthermore, as in Example 2, a part of bismuth oxide was added to 0.01
It may be replaced with an oxide of an iron group element in a range of 1 wt%.

(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a contact effect because the Ag-bismuth oxide (0.5-15wt%) of the sliding contact is hard and the HvllO-150) is soft and slippery. In this case, the Cu-resin thick film conductor pattern on the ceramic substrate is not worn out, and there is almost no adhesion or peeling, and wear is reduced, so good contact can be obtained.

Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, the sliding contact Ag-bismuth oxide 0.
Since the electrical conductivity of the contact material is good from 5 to 15 wt%,
During contact action, no heat is generated and welding does not occur (therefore, the welding resistance of the sliding contact device is significantly improved).

[Brief explanation of the drawing]

The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.

Claims (1)

[Claims] A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting the thick film resistor pattern to harden a Cu-resin conductor paste to form a thick film conductor pattern. , and a sliding contact in which a contact material containing 0.5 to 15 wt % of Ag-bismuth oxide is attached to a spring terminal material so as to be able to slide against the thick film conductor pattern of the wiring board. A sliding contact device characterized by: