JPS63196005A - Slide contactor - Google Patents

Slide contactor

Info

Publication number
JPS63196005A
JPS63196005A JP62028475A JP2847587A JPS63196005A JP S63196005 A JPS63196005 A JP S63196005A JP 62028475 A JP62028475 A JP 62028475A JP 2847587 A JP2847587 A JP 2847587A JP S63196005 A JPS63196005 A JP S63196005A
Authority
JP
Japan
Prior art keywords
thick film
sliding contact
contact
pattern
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62028475A
Other languages
Japanese (ja)
Inventor
重雄 塩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP62028475A priority Critical patent/JPS63196005A/en
Publication of JPS63196005A publication Critical patent/JPS63196005A/en
Pending legal-status Critical Current

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  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)
  • Contacts (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー(可変抵抗器の一種)
等で用いられる摺動接点装置の改良に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(従来の技術とその問題点) 従来より上記のポリュームスイ・ノチ、ポテンシオメー
タ、トリマー等で用いられる摺動接点装置は、セラミッ
クス基板上にカーボン(C)や酸化ルテニウム(RuO
□)などの抵抗ペーストを焼成して厚膜抵抗パターンを
形成して成る配線板と、この配線板の厚膜抵抗パターン
に対向して摺動し得るようになされたスプリング端子材
にAg接点材をかしめ或いは溶接して成るすり接点とに
より構成されているが、この摺動接点装置は、ノイズが
発生し易(、又接触抵抗がやや高(且つ幾分ばらつきが
あって不安定であり、しかも摩耗し易くて寿命が短く、
接触信頼性にやや欠けるものであった。
(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned polymer switches, potentiometers, trimmers, etc. have been made using carbon (C) or ruthenium oxide (RuO
A wiring board formed by firing a resistance paste such as □) to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board and an Ag contact material However, this sliding contact device tends to generate noise (and has a somewhat high contact resistance (and is unstable due to some variation). Moreover, it is easy to wear out and has a short lifespan.
Contact reliability was somewhat lacking.

この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、C
u−樹脂系の導体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にCu
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のAg接点材を硫化防止
の為、Ag−Pd30〜50−t%に置き換えている。
For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with a u-resin conductor paste and cure it, or add Cu to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50-t% Ag-Pd to prevent sulfurization.

然し乍ら、A g  P d 30〜50wt%の接点
材はHv160〜200で硬すぎるのに対し、Cu−樹
脂系の導体ペーストの硬化物である厚膜導体パターンが
軟らかい為、摩耗が多(なり、早期に寿命となる。
However, contact materials with A g P d of 30 to 50 wt% are too hard at Hv 160 to 200, whereas the thick film conductor pattern, which is a cured product of Cu-resin conductor paste, is soft and causes a lot of wear. It reaches the end of its lifespan early.

更にAg−Pd30〜50−t%接点材は、電気伝導度
(IAC33,8〜5.5)が低い為、発熱する等の問
題点があった。
Furthermore, since the Ag-Pd 30-50-t% contact material has a low electrical conductivity (IAC 33.8-5.5), there are problems such as heat generation.

(発明の目的) 本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。
(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(問題点を解決するための手段) 前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てCu−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配vA板と、この配線板の厚膜導体パ
ターンに対向して摺動し得るようになされAg−酸化カ
ドミウム0.5〜15−t%の接点材がスプリング端子
材に取付けられて成るすり接点とにより構成されている
ことを特徴とする。
(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board made up of a thick film conductor pattern formed by firing a Cu-resin conductor paste connected to a resistor pattern, and an Ag board which can be slid against the thick film conductor pattern of this wiring board. - It is characterized in that it is constituted by a sliding contact in which a contact material containing 0.5 to 15 t% of cadmium oxide is attached to a spring terminal material.

本発明の摺動接点装置に於いて、すり接点の接点材をA
g−酸化カドミウム0.5〜15wt%とした理由は、
Ag中の酸化カドミウムが0.5wt%未満だと潤滑効
果が薄く、そのすり接点がセラミックス基板上のCu−
樹脂系の厚膜導体パターンとの接触に於いて凝着、剥離
が生じ、15−t%を超えると、ノイズの発生原因とな
るからである。
In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason why g-cadmium oxide is set at 0.5 to 15 wt% is as follows.
If the cadmium oxide content in Ag is less than 0.5 wt%, the lubricating effect will be weak, and the sliding contact will be
This is because adhesion and peeling occur upon contact with a resin-based thick film conductor pattern, and if it exceeds 15-t%, it becomes a cause of noise generation.

(作用) 上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のAg−酸化カドミウム0.5〜15wt
%接点材の硬さくHv90〜120)が軟らかく滑りや
すいので、接触抵抗が低く安定していて、Cu−樹脂系
厚膜導体パターンを損耗することが無く、又凝着、剥離
が殆んど無くなり、摩耗が減少するので、良好な接触が
得られる。更にすり接点のAg−酸化カドミウム0.5
〜15wt%接点材の電気伝導度がlAC370〜80
%と良好であるので、発熱しない。
(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the amount of Ag-cadmium oxide in the sliding contact is 0.5 to 15 wt.
% The hardness of the contact material (Hv90-120) is soft and slippery, so the contact resistance is low and stable, there is no damage to the Cu-resin thick film conductor pattern, and there is almost no adhesion or peeling. , good contact is obtained as wear is reduced. Furthermore, the Ag-cadmium oxide of the sliding contact is 0.5
The electrical conductivity of ~15wt% contact material is lAC370~80
%, so it does not generate heat.

(実施例) 本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚0.6鶴、直径30Mの純度98%のAffI
Ch基板1上の外周に幅3m1IIでRub、の抵抗ペ
ーストをスクリーン印刷し、800℃で焼成して厚さ1
0μの厚膜抵抗パターン2を形成し、この厚膜抵抗パタ
ーン2に接続して、周方向に、Ag−樹脂系導体ペース
トをスクリーン印刷し、130℃で硬化して、0.2鶴
間隔に幅0.21、長さ7鶴、厚さlOμの厚膜導体パ
ターン(Cu−樹脂26−t%)3を形成して配線板4
とした。一方、この配線板4の厚膜導体パターン3に対
向して夫々摺動するようになされた2種のすり接点5は
、Ag−酸化カドミウム1wt%とAg−酸化カドミウ
ム3wt%−酸化ニッケル0.1wt%の2種の接点線
材(直径1 、5 鶴)から作製した頭部径3鶴、頭部
厚さ0.6 mm、脚部径1.5mS脚部長1.5鶴の
2種のリベット接戸6を、夫々幅4鶴、厚さ0.15m
のBe−Cuより成るスプリング端子材7の接点取付穴
に挿入しかしめて成るものである。
(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, AffI of 98% purity with a plate thickness of 0.6 mm and a diameter of 30 M is shown in the figure.
A resistive paste of Rub is screen printed on the outer periphery of the Ch substrate 1 with a width of 3 m 1 II, and baked at 800°C to a thickness of 1
A thick film resistor pattern 2 of 0μ is formed, connected to this thick film resistor pattern 2, and screen printed with Ag-resin conductor paste in the circumferential direction, cured at 130°C, and spaced at 0.2 square intervals. A thick film conductor pattern (Cu-resin 26-t%) 3 having a width of 0.21 mm, a length of 7 mm, and a thickness of lOμ is formed to form a wiring board 4.
And so. On the other hand, two types of sliding contacts 5, which are slidably opposed to the thick film conductor pattern 3 of the wiring board 4, are composed of Ag-cadmium oxide 1wt% and Ag-cadmium oxide 3wt%-nickel oxide 0. Two types of rivets made from two types of 1wt% contact wire rods (diameters 1 and 5 mm), head diameter 3 mm, head thickness 0.6 mm, leg diameter 1.5 mS, leg length 1.5 mm. Each door 6 has a width of 4 cranes and a thickness of 0.15 m.
The contact mounting hole of the spring terminal material 7 made of Be-Cu is inserted into and tightened.

このように構成された実施例1.2の摺動接点装置と、
Cu −P d30wt%接点材を有するすり接点を配
線板のAg−樹脂の厚膜導体パターンと対向させて成る
従来の摺動接点装置とを、下記の試験条件にて摺動開閉
試験を行った処、下記の表に示すような結果を得た。
The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions on a conventional sliding contact device consisting of a sliding contact having a 30 wt% Cu-P d contact material facing a thick film conductor pattern made of Ag-resin on a wiring board. The results shown in the table below were obtained.

試験条件 接触カニ10g、動作:回転往復型(55度)、駆動:
60ストローク/+*in、、通電:12V、100m
A上記の表で明らかなように実施例1.2の摺動接点装
置は、従来例の摺動装置に比し、寿命が大: 概倍増し
ていることが判る。これはひとえにすり接点5のAg−
酸化カドミウム0.5〜15wt%接点材の硬さが軟ら
か(滑りやすい為、対向するCu−樹脂系の厚膜導体パ
ターン3を損耗することが無く、又凝着、剥離すること
が無(、摩耗が減少し、更にAg−酸化カドミウム0.
5〜15−t%の接点材の電気伝導度が良好で発熱する
ことが無いからである。
Test conditions Contact crab 10g, operation: rotating reciprocating type (55 degrees), drive:
60 stroke/+*in, energizing: 12V, 100m
A: As is clear from the table above, the sliding contact device of Example 1.2 has a long life span, approximately twice as long as that of the conventional sliding device. This is just the Ag- of the sliding contact 5.
The hardness of the cadmium oxide 0.5 to 15 wt% contact material is soft (because it is slippery, it does not damage the opposing Cu-resin thick film conductor pattern 3, and it does not adhere or peel off). Wear is reduced and Ag-Cadmium oxide 0.
This is because the electrical conductivity of the contact material of 5 to 15-t% is good and no heat is generated.

尚、前記の寿命は、厚膜導体パターン3の摩耗により、
すり接点5がAlto3基板との接触となって、オープ
ン状態(接触抵抗無限大)となった場合と、厚膜導体パ
ターン3間のスリット部の目詰まりによりショートした
場合で判定した。
Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The evaluation was made based on the case where the sliding contact 5 came into contact with the Alto3 substrate and became an open state (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.

尚、上記実施例の摺動接点装置の配線板4は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。
Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.

さらに実施例2のように酸化カドミウムの一部を0.0
1〜1wt%の範囲で鉄族元素の酸化物で置き換えても
よいものである。
Further, as in Example 2, a part of cadmium oxide was added to 0.0
It may be replaced with an oxide of an iron group element in a range of 1 to 1 wt%.

(発明の効果) 以上の説明で判るように本発明の摺動接点装置は、すり
接点のAg−酸化カドミウム0.5〜15wt%が硬さ
くHv90〜120)が軟らかく滑りやすいので、接触
作用においてセラミックス基板上のCu−樹脂系厚膜導
体パターンが損耗することが無く、又凝着、剥離が殆ん
ど無くなり、摩耗が減少するので、良好な接触が得られ
る。
(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a sliding contact in which the Ag-cadmium oxide (0.5 to 15 wt%) is hard, and the sliding contact (Hv90 to 120) is soft and slippery. Since the Cu-resin thick film conductor pattern on the ceramic substrate is not worn out, adhesion and peeling are almost eliminated, and wear is reduced, good contact can be obtained.

従って、接触信鯨性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のAg−酸化カドミウム0
.5〜15eyt%接点材の電気伝導度が良好であるの
で、接触作用において、発熱せず、溶着が起こりにくい
。従って、摺動接点装置の耐溶着性が著しく向上する。
Therefore, contact accuracy is improved and the life of the sliding contact device is significantly extended. Furthermore, the Ag-cadmium oxide of the sliding contact is 0.
.. Since the electrical conductivity of the 5-15eyt% contact material is good, no heat is generated during contact action and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。
The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.

Claims (1)

【特許請求の範囲】[Claims]  セラミックス基板上に、抵抗ペーストを焼成して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てCu−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされAg−酸化カド
ミウム0.5〜15%の接点材がスプリング端子材に取
り付けられて成るすり接点とにより構成されていること
を特徴とする摺動接点装置。
A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting the thick film resistor pattern to harden a Cu-resin conductor paste to form a thick film conductor pattern. , and a sliding contact made of a contact material of 0.5 to 15% Ag-cadmium oxide attached to a spring terminal material so as to be able to slide against the thick film conductor pattern of the wiring board. A sliding contact device characterized by:
JP62028475A 1987-02-10 1987-02-10 Slide contactor Pending JPS63196005A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62028475A JPS63196005A (en) 1987-02-10 1987-02-10 Slide contactor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62028475A JPS63196005A (en) 1987-02-10 1987-02-10 Slide contactor

Publications (1)

Publication Number Publication Date
JPS63196005A true JPS63196005A (en) 1988-08-15

Family

ID=12249669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62028475A Pending JPS63196005A (en) 1987-02-10 1987-02-10 Slide contactor

Country Status (1)

Country Link
JP (1) JPS63196005A (en)

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