JPS63160310A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63160310A JPS63160310A JP61314050A JP31405086A JPS63160310A JP S63160310 A JPS63160310 A JP S63160310A JP 61314050 A JP61314050 A JP 61314050A JP 31405086 A JP31405086 A JP 31405086A JP S63160310 A JPS63160310 A JP S63160310A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
等で用いられる摺動接点装置の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン（Ｃ）や酸化ルテニウム（ＲｕＯ□
）などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接゛点とに
より構成されているが、この摺動接点装置は、ノイズが
発生し易く、又接触抵抗がやや高く且つ幾分ばらつきが
あって不安定であり、しかも摩耗し易くて寿命が短く、
接触信頼性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuO□
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. This sliding contact device is constructed with a sliding contact point made by caulking or welding, but this sliding contact device tends to generate noise, has a somewhat high contact resistance, and is unstable due to some variation. It wears out easily and has a short lifespan.
Contact reliability was somewhat lacking.
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ａ
ｇ−樹脂系の導体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にＡｇ
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のＡｇ接点材を硫化防止
の為、Ａｇ−Ｐｄ３０〜５０ｗ ｔ％に置き換えている
。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
g-Replace with resin-based conductive paste and harden, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50 wt% of Ag-Pd to prevent sulfurization.
然し乍ら、Ａ ｇ ｌ’ ｄ３０〜５０ｗｔ％の接点
材はＨｖ１６０〜２００で硬すぎるのに対し、Ａｇ−樹
脂系の導体ペーストの硬化物である厚膜導体パターンが
軟らかい為、摩耗が多くなり、早期に寿命となる。However, contact materials with A g l' d of 30 to 50 wt% are too hard at Hv 160 to 200, whereas the thick film conductor pattern, which is a hardened product of Ag-resin conductor paste, is soft, resulting in increased wear and premature wear. The lifespan is .
更にＡｇ−Ｐｄ３０〜５０−ｔ％接点材は、電気伝導度
（ＩＡＣ５３，８〜５．５）が低い為、発熱する等の問
題点があった。Furthermore, since the Ag-Pd 30-50-t% contact material has a low electrical conductivity (IAC53.8-5.5), there are problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを焼成して厚膜翼体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−ＷＣ４０
〜８０−ｔ％の接点材がスプリング端子材に取付けられ
て成るすり接点とにより構成されていることを特徴とす
る。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing an Ag-resin conductor paste to form a thick film wing pattern connected to a resistor pattern, and an Ag wire capable of sliding against the thick film conductor pattern of the wiring board. -WC40
It is characterized in that ~80-t% of the contact material is constituted by a sliding contact formed by being attached to a spring terminal material.
本発明の摺動接点装置に於いて、すり接点の接点材をＡ
ｇ−ＷＣ４０〜８０匈Ｌ％とした理由は、Ａｇ中のＷＣ
，が４０ｗｔ％未満だと潤滑効果が薄く、そのすり接点
がセラミックス基板上のＡｇ−樹脂系の厚膜導体パター
ンとの接触に於いて凝着、剥離が生じ、８０ｗ ｔ％を
超えると、酸化物の生成量が多くなりノイズの発生原因
となるからである。In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-WC to 40 to 80 匈L% is that WC in Ag
If , is less than 40wt%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Ag-resin thick film conductor pattern on the ceramic substrate.If it exceeds 80wt%, oxidation will occur. This is because the amount of material generated increases, causing noise.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のＡｇ−ＷＣ４０〜８０ｗｔ％接点材の硬
さくＨＶ１００〜１５０）が軟らかく滑りやすいので、
接触抵抗が低く安定していて、Ａｇ−樹脂系厚膜導体パ
ターンを損耗することが無く、又凝着、剥離が殆んど無
くなり、摩耗が減少するので、良好な接触が得られる。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-WC40-80wt% contact material of the sliding contact is HV100-150). Because it is soft and slippery,
The contact resistance is low and stable, the Ag-resin thick film conductor pattern is not worn out, adhesion and peeling are almost eliminated, and abrasion is reduced, so good contact can be obtained.
更にすり接点のＡｇ−ＷＣ４０〜８０ｉｙｔ％接点材の
電気伝導度がｌＡＣ３５０〜７０％と良好であるので、
発熱しない。Furthermore, since the electrical conductivity of the Ag-WC40-80iyt% contact material of the sliding contact is as good as lAC350-70%,
No fever.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚０．６鰭、直径３０龍の純度９８％のＡ １２
ｚ Ｏ：１基板１上の外周に幅３ ＋ｕでＲｕＯ□の
抵抗ペーストをスクリーン印刷し、８００℃で焼成して
厚さ１０μの厚膜抵抗パターン２を形成し、この厚膜抵
抗パターン２に接続して、周方向に、Ａｇ−樹脂系導体
ペーストをスクリーン印刷し、１３０°Ｃで硬化して、
０．２＋＊璽間隔に幅０ 、２ ＋ｕ、長さ７龍、厚さ
１０μの厚膜導体パターン（Ａｇ−樹脂２６ｉｖｔ′％
）３を形成して配線板４とした。一方、この配線板４の
厚膜導体パターン３に対向して夫々摺動するようになさ
れた２種のすり接点５は、Ａ ｇ −ＷＣ５０ｗ ｔ％
とＡｇ ＷＣ６５ｗｔ％の２種の接点線材（直径１．
５＋ｎ）から作製した頭部径３龍、頭部厚さ０．６關、
脚部径１．５１、脚部長１．５鶴の２種のりベント接点
６を、夫々幅４１、厚さ０．１５＋ｕのＢｅ−Ｃｕより
成るスプリング端子材７の接点取付穴に挿入しかしめて
成るものである。(Example) To explain an example of the sliding contact device of the present invention, a 98% pure A12 plate with a thickness of 0.6 fin and a diameter of 30 mm as shown in the figure.
A resistor paste of RuO□ is screen printed on the outer periphery of the zO:1 substrate 1 with a width of 3 After connecting, screen-print Ag-resin conductor paste in the circumferential direction, harden at 130°C,
Thick film conductor pattern (Ag-resin 26ivt'%
) 3 to form a wiring board 4. On the other hand, the two types of sliding contacts 5, which are made to slide opposite to the thick film conductor pattern 3 of this wiring board 4, have A g -WC50wt%.
and Ag WC65wt% two types of contact wire (diameter 1.
5+n) head diameter 3 dragons, head thickness 0.6 mm,
Insert and tighten the two types of bent contacts 6, each with a leg diameter of 1.51 mm and a leg length of 1.5 mm, into the contact mounting hole of the spring terminal material 7 made of Be-Cu with a width of 41 mm and a thickness of 0.15+U. It is what it is.
このように構成された実施例１．２の摺動接点装置と、
Ａ ｇ −Ｐ ｄ３０ｗｔ％接点材を有するすり接点を
配線板のＡｇ−樹脂の厚膜導体パターンと対向させて成
る従来の摺動接点装置とを、下記の試験条件にて摺動開
閉試験を行った処、下記の表に示すような結果を得た。The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% A g -P d contact material facing a thick film conductor pattern made of Ag-resin on a wiring board. However, we obtained the results shown in the table below.
試験条件
接触カニ１０ｇ、動作：回転往復型（５５度）、駆動＝
６０ストローク／ｍｉｎ、通電：１２■、１００ｍＡ上
記の表で明らかなように実施例１．２の摺動接点装置は
、従来例の摺動装置に比し、寿命が大概倍増しているこ
とが判る。これはひとえにすり接点５のＡｇ−ＷＣ４０
〜８０ｗ ｔ％接点材の硬さが軟らかく滑りやすい為、
対向するＡｇ−樹脂系の厚膜導体パターン３を損耗する
ことが無く、又凝着、剥離することが無く、摩耗が減少
し、更にＡｇ−ＷＣ４０〜８０ｗｔ％の接点材の電気伝
導度が良好で発熱することが無いからである。Test conditions Contact crab 10g, operation: rotating reciprocating type (55 degrees), drive =
60 strokes/min, energization: 12■, 100mA As is clear from the table above, the sliding contact device of Example 1.2 has a lifespan almost double that of the conventional sliding device. I understand. This is just Ag-WC40 with 5 sliding contacts.
~80wt% Because the hardness of the contact material is soft and slippery,
There is no wear on the opposing Ag-resin thick film conductor pattern 3, there is no adhesion or peeling, and wear is reduced, and the electrical conductivity of the contact material of 40 to 80 wt% Ag-WC is good. This is because it does not generate heat.
尚、前記の寿命は、厚膜導体パターン３の摩耗により、
すり接点５がＡ（ｌｔＯ３基板との接触となって、オー
ブン状態（接触抵抗無限大）となった場合と、厚膜導体
パターン３間のスリット部の目詰まりによりショートし
た場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The evaluation was made based on the case where the sliding contact 5 came into contact with the ltO3 substrate (A), resulting in an oven state (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗バクーンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is configured to be able to slide in the longitudinal direction of the thick film resistor bag, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.
（発明の効果）
以上の説明で判るように本発明の摺動接点装置は、すり
接点のＡ ｇ −Ｗ Ｃ４０〜８０ｗｔ％が硬さくＨｖ
１００〜１５０）が軟らかく滑りやすいので、接触作用
において、セラミックス基板上のＡｇ−樹脂系厚膜導体
パターンが損耗することが無く、又凝着、剥離が殆んど
無くなり、摩耗が減少するので、良好な接触が得られる
。(Effects of the Invention) As can be seen from the above explanation, in the sliding contact device of the present invention, 40 to 80 wt% of A g -W C of the sliding contact is hard and Hv
100 to 150) is soft and slippery, so the Ag-resin thick film conductor pattern on the ceramic substrate is not worn out during contact action, and adhesion and peeling are almost eliminated, reducing wear. Good contact can be obtained.
従って、接触信頬性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のＡ ｇ −ＷＣ４０〜８
０−ｔ％接点材の電気伝導度が良好であるので、接触作
用において、発熱せず、溶着が起こりにくい。従って、
摺動接点装置の耐溶着性が著しく向上する。Therefore, contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, the sliding contact A g -WC40~8
Since the electrical conductivity of the 0-t% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore,
The welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−ＷＣ４０
〜８０ｗｔ％の接点材がスプリング端子材に取り付けら
れて成るすり接点とにより構成されていることを特徴と
する摺動接点装置。A wiring board is formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting it to the thick film resistor pattern to harden an Ag-resin conductor paste to form a thick film conductor pattern. , Ag-WC40 is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which ~80wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314050A JPS63160310A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314050A JPS63160310A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63160310A true JPS63160310A (en) | 1988-07-04 |
Family
ID=18048615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61314050A Pending JPS63160310A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63160310A (en) |
-
1986
- 1986-12-24 JP JP61314050A patent/JPS63160310A/en active Pending
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