JPS63196007A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63196007A JPS63196007A JP62028477A JP2847787A JPS63196007A JP S63196007 A JPS63196007 A JP S63196007A JP 62028477 A JP62028477 A JP 62028477A JP 2847787 A JP2847787 A JP 2847787A JP S63196007 A JPS63196007 A JP S63196007A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
等で用いられる摺動接点装置の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン（Ｃ）や酸化ルテニウム（ＲｕＯ□
）などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易くて寿命が短（、接
触信頼性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuO□
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. It was easy to use and had a short lifespan (and contact reliability was somewhat lacking).
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ｃ
ｕ’−樹脂系の導体ペーストに置き換えて硬化するかあ
るいは厚膜抵抗パターンのすり接点と摺動する部分にＣ
ｕ−樹脂系導体ペーストを重ねて硬化することにより、
接触信韻性を改善し、又すり接点のＡｇ接点材を硫化防
止の為、Ａｇ−Ｐｄ３０〜５０ｗｔ％に置き換えている
。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
u' - Replace with resin-based conductive paste and harden, or add C to the part that slides with the sliding contact of the thick film resistor pattern.
By layering and curing the u-resin conductor paste,
In order to improve contact reliability and prevent sulfurization, the Ag contact material of the sliding contact is replaced with 30 to 50 wt% of Ag-Pd.
然し乍ら、Ａ ｇ −Ｐ ｄ ３０〜５０ｗｔ％の接点
材はＨｖ１６０〜２００で硬すぎるのに対し、Ｃｕ−樹
脂系の導体ペーストの硬化物である厚膜導体パターンが
軟らかい為、摩耗が多くなり、早期に寿命となる。However, the contact material with A g -P d 30 to 50 wt% is too hard at Hv 160 to 200, whereas the thick film conductor pattern, which is a cured product of Cu-resin conductor paste, is soft, resulting in increased wear. It reaches the end of its lifespan early.
更にＡｇ−Ｐｄ３０〜５０ｗｔ％接点材は、電気伝導度
（ＩＡＣ３３，８〜５．５）が低い為、発熱する等の問
題点があった。Furthermore, since the Ag-Pd 30-50 wt% contact material has a low electrical conductivity (IAC33.8-5.5), there are problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＣｕ−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｃｕ３〜
２０ｗｔ％の接点材がスプリング端子材に取付けられて
成るすり接点とにより構成されていることを特徴とする
。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing a Cu-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- Cu3~
It is characterized in that it is constituted by a sliding contact formed by attaching 20 wt % of contact material to a spring terminal material.
本発明の摺動接点装置に於いて、すり接点の接点材をＡ
ｇ Ｃｕ３〜２０ｗｔ％とした理由は、Ａｇ中のＣｕ
が３ｗｔ％未満だと潤滑効果が薄く、そのすり接点がセ
ラミックス基板上のＣｕ−樹脂系の厚膜導体パターンと
の接触に於いて凝着、剥離が生じ、２０ｗｔ％を超える
と、酸化物の生成量が多くなりノイズの発生原因となる
からである。In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting Cu to 3 to 20 wt% is that Cu in Ag
If it is less than 3wt%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Cu-resin thick film conductor pattern on the ceramic substrate.If it exceeds 20wt%, oxide This is because the generated amount increases, causing noise.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のＡｇ−Ｃｕ３〜２〇ｗｔ％接点材の硬さ
くＨｖｌｌＯ〜１５０）が軟らかく滑りやすいので、接
触抵抗が低く安定していて、Ｃｕ−樹脂系厚膜導体パタ
ーンを損耗することが無く、又凝着、剥離が殆んど無く
なり、摩耗が減少するので、良好な接触が得られる。更
にすり接点のＡｇ−Ｃｕ３〜２０ｗｔ％接点材の電気伝
導度がｌＡＣ３８０〜９５％と良好であるので、発熱し
ない。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-Cu 3-20 wt% contact material of the sliding contact is HvllO ~ 150) is soft and slippery, so the contact resistance is low and stable, and the Cu-resin thick film conductor pattern is not damaged, and there is almost no adhesion or peeling, reducing wear, so it is good. You can get good contact. Furthermore, since the electrical conductivity of the Ag-Cu 3-20wt% contact material of the sliding contact is as good as 380-95% lAC, no heat is generated.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚０ 、６ ｎ、直径３０簡の純度９８％のＡｌ
ｔ０４板ｌ上の外周に幅３鶴でＲｕ Ｏｚの抵抗ペース
トをスクリーン印刷し、８００℃で焼成して厚さ１０μ
の厚膜抵抗パターン２を形成し、この厚膜抵抗パターン
２に接続して、周方向に、Ｃｕ−樹脂系導体ペーストを
スクリーン印刷し、１３０℃で硬化して、０．２Ｍ間隔
に幅０．２ｍ、長さ７ｆｉ、厚さ１０μの厚膜導体パタ
ーン（Ｃｕ−樹脂２６ｗｔ％）３を形成して配線板４と
した。一方、この配線板４の厚膜導体パターン３に対向
して夫々摺動するようになされた２種のすり接点５は、
Ａｇ−Ｃｕ７．５ｗｔ％とＡ ｇ −Ｃｕ １６ｗｔ％
−−’−７ケル０．１ｗｔ％の２種の接点線材（直径１
．５Ｍ）から作製した頭部径３ｆｉ、頭部厚さ０．６ｍ
ｍ、脚部径１．５鶴、脚部長１．５鶴の２種のリベット
接点６を、夫々幅４鶴、厚さ０．１５鶴のＢｅ−Ｃｕよ
り成るスプリング端子材７の接点取付穴に挿入しかしめ
て成るものである。(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, a 98% pure Al plate with a plate thickness of 0.6 nm and a diameter of 30 mm is used.
Screen-print RuOz resistance paste with a width of 3 squares on the outer periphery of the T04 plate L, and bake it at 800℃ to a thickness of 10μ.
A thick film resistor pattern 2 of A wiring board 4 was prepared by forming a thick film conductor pattern (Cu-resin 26 wt %) 3 having a length of .2 m, a length of 7 fi, and a thickness of 10 μ. On the other hand, the two types of sliding contacts 5 that are configured to slide against the thick film conductor pattern 3 of the wiring board 4 are as follows:
Ag-Cu 7.5wt% and Ag-Cu 16wt%
--'-7 Kel 0.1wt% two types of contact wire (diameter 1
．． 5M) head diameter 3fi, head thickness 0.6m
Two types of rivet contacts 6 with a leg diameter of 1.5 mm and a leg length of 1.5 mm are installed in the contact mounting holes of the spring terminal material 7 made of Be-Cu with a width of 4 mm and a thickness of 0.15 mm, respectively. It is made only by inserting it into the .
このように構成された実施例１．２の摺動接点装置と、
Ａ ｇ −Ｐ ｄ３０ｗｔ％接点材を有するすり接点を
配線板のＣｕ−樹脂の厚膜導体パターンと対向させて成
る従来の摺動接点装置とを、下記の試験条件にて摺動開
閉試験を行った処、下記の表に示すような結果を得た。The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% contact material and facing a thick film conductor pattern made of Cu-resin on a wiring board. However, we obtained the results shown in the table below.
試験条件
接触カニ１０ｇ、動作；回転往復型（５５度）、駆動＝
６０ストローク／ｌａ ｉ ｎ 、通電：１２ｖ、１０
０ｍＡ上記の表で明らかなように実施例１．２の摺動接
点装置は、従来例の摺動装置に比し、寿命が大概倍増し
ていることが判る。これはひとえにすり接点５のＡｇ−
Ｃｕ３〜２０ｗ ｔ％接点材の硬さが軟らか（滑りやす
い為、対向するＣｕ−Ｑｌ脂系の厚膜導体パターン３を
損耗することが無く、又凝着、剥離することが無く、摩
耗が減少し、更にＡｇ−Ｃｕ３〜２０ｗ ｔ％の接点材
の電気伝導度が良好で発熱することが無いからである。Test conditions Contact crab 10g, operation: rotating reciprocating type (55 degrees), drive =
60 strokes/la in, energization: 12v, 10
0 mA As is clear from the table above, the sliding contact device of Example 1.2 has a lifespan almost twice as long as that of the conventional sliding contact device. This is just the Ag- of the sliding contact 5.
The hardness of the Cu3-20wt% contact material is soft (it is easy to slip, so it does not damage the opposing Cu-Ql fat-based thick film conductor pattern 3, and it does not adhere or peel off, reducing wear. Furthermore, the electrical conductivity of the Ag-Cu contact material of 3 to 20 wt % is good and no heat is generated.
尚、前記の寿命は、厚膜導体パターン３の摩耗により、
すり接点５がＡｌｌ！０３基板との接触となって、オー
プン状態（接触抵抗無限大）となった場合と、厚膜導体
パターン３間のスリット部の目詰まりによりショートし
た場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
All sliding contacts 5! The judgment was made based on the case where the contact with the 03 substrate resulted in an open state (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.
さらに実施例２のようにＣｕの一部を０．０１〜１ｗｔ
％の範囲で鉄族元素で置き替えてもよいものである。Furthermore, as in Example 2, a portion of Cu is added in an amount of 0.01 to 1 wt.
It may be replaced with an iron group element within a range of %.
（発明の効果）
以上の説明で判るように本発明の摺動接点装置は、すり
接点のＡｇ−Ｃｕ３〜２０ｗｔ％が硬さくＨＶ１１０〜
１５０）が軟らかく滑りやすいので、接触作用において
セラミックス基板上のＣｕ−樹脂系厚膜導体パターンが
損耗することが無く、又凝着、剥離が殆んど無くなり、
摩耗が減少するので、良好な接触が得られる。(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 3 to 20 wt% of Ag-Cu in the sliding contact, and has a hardness of HV110 to
150) is soft and slippery, so the Cu-resin thick film conductor pattern on the ceramic substrate will not be damaged by contact action, and there will be almost no adhesion or peeling.
Good contact is obtained as wear is reduced.
従って、接触信頼性が向上し、摺動接点°装置の寿命が
著しく増長する。更にすり接点のＡｇ−Ｃｕ３〜２０ｗ
ｔ％接点材の電気伝導度が良好であるので、接触作用に
おいて、発熱せず、溶着が起こりにくい。従って、摺動
接点装置の耐溶着性が著しく向上する。Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag-Cu3~20w of the sliding contact
Since the electrical conductivity of the t% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。
出願人 田中貴金属工業株式会社
ｌ゛・・ス７ソンγ文６子寥ｔThe figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention. Applicant: Tanaka Kikinzoku Kogyo Co., Ltd.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＣｕ−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−ｃｕ３〜
２０ｗｔ％の接点材がスプリング端子材に取り付けられ
て成るすり接点とにより構成されていることを特徴とす
る摺動接点装置。A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting the thick film resistor pattern to harden a Cu-resin conductor paste to form a thick film conductor pattern. , Ag-cu3~ is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which 20 wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62028477A JPS63196007A (en) | 1987-02-10 | 1987-02-10 | Slide contactor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62028477A JPS63196007A (en) | 1987-02-10 | 1987-02-10 | Slide contactor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63196007A true JPS63196007A (en) | 1988-08-15 |
Family
ID=12249726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62028477A Pending JPS63196007A (en) | 1987-02-10 | 1987-02-10 | Slide contactor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63196007A (en) |
-
1987
- 1987-02-10 JP JP62028477A patent/JPS63196007A/en active Pending
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