JPS63196008A - Slide contactor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. have been made using carbon (C) or ruthenium oxide (RuO) on a ceramic substrate.
2) A wiring board formed by firing a resistor paste to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. However, this sliding contact device tends to generate noise, has somewhat high contact resistance and is unstable due to some variation, and is susceptible to wear. It is easy to clean and has a short lifespan.
Contact reliability was somewhat lacking.

For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with a U-resin conductor paste and cure it, or add Cu to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50-t% Ag-Pd to prevent sulfurization.

However, contact materials with A g -P d of 30 to 50 wt% are too hard at Hv 160 to 200, whereas the thick film conductor pattern, which is a cured product of Cu-resin conductor paste, is soft and causes a lot of wear. , reaching the end of its lifespan early.

Furthermore, since the Ag-Pd 30-50 wt% contact material has a low electrical conductivity (IAC33.8-5.5), there are problems such as heat generation.

(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing a Cu-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- Cu3～
The present invention is characterized in that it is composed of a contact material of 10-t%-CdO and 5 to 5 wt% and a sliding contact formed by attaching the contact material to a spring terminal material.

In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-Cu3 to 10 wt%-Cd O,5 to 5 wt% is that Cu in Ag is 3 wt% or Cd is 0.5 wt%.
If it is less than wt%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Cu-resin thick film conductor pattern on the ceramic substrate. This is because, if it exceeds 100%, the amount of oxides produced increases and becomes a cause of noise generation.

(Function) The sliding contact device configured as described above has a contact effect between the sliding contact and the thick film conductor pattern on the ceramic substrate.
The hardness of the 5-5 wt%t% material (HvllO~150) is soft and slippery, so the contact resistance is low and stable, and the Cu-resin thick film conductor pattern is not damaged, and there is no adhesion or peeling. Since there is almost no friction and wear is reduced, good contact can be obtained.Furthermore, the Ag-Cu3 sliding contact
~10-t%-Cd0.5-5wt% The electrical conductivity of the contact material is as good as 340-60% lAC, so no heat is generated.

(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, a 98% pure Al with a plate thickness of 0.61 m and a diameter of 30 mm is used.
A resistive paste of Ru5t with a width of 311 mm was screen printed on the outer periphery of the oxM board 1, and baked at 800°C to a thickness of 10 μm.
A thick film resistor pattern 2 is formed, and connected to this thick film resistor pattern 2, a Cu-resin conductor paste is screen printed in the circumferential direction, cured at 130°C, and convergent at 0.2 dragon intervals. A thick film conductor pattern (Cu-resin 26-t%) 3 having a length of 0.2 m, a length of 7 mm, and a thickness of 10 μm was formed to form a wiring board 4. On the other hand, two types of sliding contacts 5, which are made to slide oppositely to the thick film conductor pattern 3 of this wiring board 4, are A
g-Cu6wt%-Cd2wt% and Ag-Cu8wt%
-Cdl-Head diameter: 311. Made from two types of contact wires (diameter: 1.5 mm) containing 0.1 wt% nickel. Head thickness 0.
Two types of rivet contacts 6 with a diameter of 6 mm, a leg diameter of 1.5 mm, and a leg length of 1.5 mm are inserted into the contact mounting holes of the spring terminal material 7 made of Be-Cu with a width of 4 fi and a thickness of 0.151 m, respectively. However, it is only made possible.

The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% contact material and facing a thick film conductor pattern made of Cu-resin on a wiring board. However, we obtained the results shown in the table below.

Test conditions Contact crab 10g, action 2 rotation reciprocating type (55 degrees), drive:
60 strokes/win, energization: 12■, 100mA As is clear from the table above, the sliding contact device of Example 1.2 has almost double the lifespan compared to the conventional sliding device. I understand that. This is just the Ag-Cu3 of the sliding contact 5~
10 wt%-Cd O, 5 to 5 wt% The hardness of the contact material is soft (because it is slippery, it does not damage the opposing Cu-resin thick film conductor pattern 3, and does not cause adhesion or peeling. None (, wear is reduced, and Ag-Cu3~10w
This is because the contact material containing 5 to 5 wt% of t%-CdO has good electrical conductivity and does not generate heat.

Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The sliding contact 5 is A2□0. The judgment was made based on the case where the contact with the substrate resulted in an open state (infinite contact resistance) and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.

Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.

Furthermore, as in Example 2, a portion of Cu or Cd was added to 0.
It may be replaced with an iron group element in a range of 0.01 to 1 wt%.

(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a sliding contact of Ag Cu3-10wt%-CdO, 5-5w
t% is hard (Hv 110-150), but soft (slippery), so C on the ceramic substrate during contact action.
The u-resin thick film conductor pattern is not worn out, adhesion and peeling are almost eliminated, and abrasion is reduced, so good contact can be obtained.

Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag Cu3~10w of the sliding contact
Since the electrical conductivity of the t%-Cd0.5-5wt% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.

[Brief explanation of the drawing]

The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention. Applicant: Tanaka Kikinzoku Kogyo Co., Ltd. 7...Suasong 1 Boji y

Claims (1)

[Claims] A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting the thick film resistor pattern to harden a Cu-resin conductor paste to form a thick film conductor pattern. , Ag-Cu3~ is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a contact material of 10 wt% - 0.5 to 5 wt% of Cd and a sliding contact formed by attaching a contact material to a spring terminal material.