JPS63160305A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63160305A JPS63160305A JP61314045A JP31404586A JPS63160305A JP S63160305 A JPS63160305 A JP S63160305A JP 61314045 A JP61314045 A JP 61314045A JP 31404586 A JP31404586 A JP 31404586A JP S63160305 A JPS63160305 A JP S63160305A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000010304 firing Methods 0.000 claims description 2
- 229910017937 Ag-Ni Inorganic materials 0.000 description 4
- 229910017984 Ag—Ni Inorganic materials 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910017727 AgNi Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
゛等で用いられる摺動接点装置の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements in sliding contact devices used in such applications.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボレ（Ｃ）や酸化ルテニウム（ＲｕＯ□
）などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易くて寿命が短く、接
触信軌性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon dioxide (C) or ruthenium oxide (RuO□) on a ceramic substrate.
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. It was easy to use, short-lived, and had somewhat poor contact reliability.
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ａ
ｇ−樹脂系の導体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にＡｇ
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のＡｇ接点材を硫化防止
の為、Ａｇ−Ｐｄ３０〜５０ｗ ｔ％に置き換えている
。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
g-Replace with resin-based conductive paste and harden, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50 wt% of Ag-Pd to prevent sulfurization.
然し乍ら、Ａ ｇ −Ｐ ｄ ３０〜５ｈｔ％の接点材
はＨｖ１６０〜２００で硬すぎるのに対し、Ａｇ−樹脂
系の導体ペーストの硬化物である厚膜導体パターンが軟
らかい為、摩耗が多くなり、早期に寿命となる。However, the contact material with Ag-Pd of 30-5ht% is too hard at Hv160-200, whereas the thick film conductor pattern, which is a hardened product of Ag-resin conductor paste, is soft, resulting in increased wear. It reaches the end of its lifespan early.
更にＡｇ−Ｐｄ３０〜５０ｗｔ％接点材は、電気伝導度
（ＩＡＣ３３，８〜５．５）が低い為、発熱する等の問
題点があった。Furthermore, since the Ag-Pd 30-50 wt% contact material has a low electrical conductivity (IAC33.8-5.5), there are problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｎｉ５〜
２０ｗ ｔ％の接点材がスプリング端子材に取付けられ
て成るすり接点とにより構成されていることを特徴とす
る。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing an Ag-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- Ni5～
It is characterized in that it is constituted by a sliding contact formed by attaching a 20wt% contact material to a spring terminal material.
本発明の摺動接点装置に於いて、すり接点の接点材をＡ
ｇ−Ｎｉ５〜２０ｗ ｔ％とした理由は、Ａｇ中のＮｊ
が５ｗｔ％未満だと潤滑効、果が薄く、そのすり接点が
セラミックス基板上のＡｇ−樹脂系の厚膜導体パターン
との接触に於いて凝着、剥離が生じ、２０ｗｔ％を超え
ると、酸化物の生成量が多くなりノイズの発生原因とな
るからである。In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-Ni to 5 to 20 wt% is that Nj in Ag
If it is less than 5wt%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Ag-resin thick film conductor pattern on the ceramic substrate.If it exceeds 20wt%, oxidation will occur. This is because the amount of material generated increases, causing noise.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のＡｇ−Ｎｔ５〜２０ｗｔ％接点材の硬さ
くＨＶ８０〜１１０）が軟らかく滑りやすいので、接触
抵抗が低く安定していて、Ａｇ−樹脂系厚膜導体パター
ンを損耗することが無く、又凝着、剥離が殆んど無くな
り、摩耗が減少するので、良好な接触が得られる。更に
すり接点のＡｇ−Ｎｉ５〜２０ｗｔ％接点材の電気伝導
度がｌＡＣ３８０〜９５％と良好であるので、発熱しな
い。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-Nt 5 to 20 wt% contact material of the sliding contact is HV80 to 110). Since it is soft and slippery, the contact resistance is low and stable, and the Ag-resin thick film conductor pattern is not damaged, and there is almost no adhesion or peeling, reducing wear, resulting in good contact. is obtained. Furthermore, since the electrical conductivity of the Ag-Ni 5-20wt% contact material of the sliding contact is as good as 380-95% lAC, no heat is generated.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚０ 、６ ｍｍ、直径３０ｍ１の純度９８％の
ＡＡ！ｚ（）＋基板１上の外周に幅３ ＋ｔｍでＲｕ
Ｏ２の抵抗ペーストをスクリーン印刷し、８００℃で焼
成して厚さ１０μの厚膜抵抗パターン２を形成し、この
厚膜抵抗パターン２に接続して、周方向に、Ａｇ−樹脂
系導体ペーストをスクリーン印刷し、１３０℃で硬化し
て、０．２１璽間隔に幅０．２１１１１．長さ７１璽、
厚さ１０μの厚膜導体パターン（Ａｇ−樹脂２６ｗｔ％
）３を形成して配線板４とした。一方、この配線板４の
厚膜導体パターン３に対向して夫々摺動するようになさ
れた２種のすり接点５は、Ａｇ−Ｎｉ１０ｗｔ％とＡｇ
−Ｎｉ１５ｗｔ％の２種の接点線材（直径１ 、５１ｍ
）から作製した頭部径３龍−１頭部厚さ０，６鶴、脚
部径１．５鶴、脚部長１．５鶴の２種のリベット接点６
を、夫々幅４鰭、厚さ０．１５１層のＢｅ−Ｃｕより成
るスプリング端子材７の接点取付穴に挿入しかしめて成
るものである。(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, a 98% pure AA plate with a plate thickness of 0.6 mm and a diameter of 30 m1 is used. z() + Ru on the outer periphery of the substrate 1 with a width of 3 + tm
A thick film resistor pattern 2 with a thickness of 10μ is formed by screen printing O2 resistor paste and baking it at 800°C.Ag-resin conductor paste is connected to the thick film resistor pattern 2 in the circumferential direction. Screen printed and cured at 130°C, with a width of 0.21111 mm at 0.21 stitch intervals. Length 71 letters,
Thick film conductor pattern with a thickness of 10μ (Ag-resin 26wt%)
) 3 to form a wiring board 4. On the other hand, the two types of sliding contacts 5, which are made to slide against the thick film conductor pattern 3 of the wiring board 4, are composed of Ag-Ni 10wt% and Ag-Ni 10wt%.
- Two types of contact wires with 15wt% Ni (diameter 1, 51m)
) 2 types of rivet contacts 6 made from head diameter 3 dragon-1 head thickness 0.6 tsuru, leg diameter 1.5 tsuru, leg length 1.5 tsuru
are inserted into the contact mounting holes of a spring terminal material 7 made of Be-Cu having a width of 4 fins and a thickness of 0.151 layers.
このように構成された実施例１．２の摺動接点装置と、
Ａｇ Ｐｄ３０〜５０接点材を有するすり接点を配線
板のＡｇ−樹脂の厚膜導体パターンと対向させて成る従
来の摺動接点装置とを、下記の試験条件にて摺動開閉試
験を行った処、下記の表に示すような結果を得た。The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions on a conventional sliding contact device consisting of a sliding contact having a contact material of 30 to 50 AgPd facing a thick film conductor pattern made of Ag-resin on a wiring board. , we obtained the results shown in the table below.
試験条件
接触カニ１０ｇ、動作：回転往復型（５５度）、駆動：
６０ストロ一ク／ｍｉｎ、通電＝１２■、１００ｍＡ上
記の表で明らかなように実施例１．２の摺動接点装置は
、従来例の摺動装置に比し、寿命が大概倍増しているこ
とが判る。これはひとえにすり接点５のＡｇ−Ｎｉ５〜
２０ｗｔ％接点材の硬さが軟らかく滑りやすい為、対向
するＡｇ−樹脂系の厚膜導体パターン３を損耗すること
が無く、又凝着、剥離することが無く、摩耗が減少し、
′更にＡｇ−Ｎｉ５〜２０ｗｔ％の接点材の電気伝導度
が良好で発熱することが無いからである。Test conditions Contact crab 10g, operation: rotating reciprocating type (55 degrees), drive:
60 strokes/min, current flow = 12 mm, 100 mA As is clear from the above table, the sliding contact device of Example 1.2 has almost twice the lifespan as compared to the conventional sliding device. I understand that. This is just the Ag-Ni5 of the sliding contact 5~
Since the hardness of the 20wt% contact material is soft and slippery, the opposing Ag-resin thick film conductor pattern 3 will not be damaged, and will not adhere or peel off, reducing wear.
'Furthermore, the electrical conductivity of the contact material containing 5 to 20 wt% Ag-Ni is good and no heat is generated.
尚、前記の寿命は、厚膜温体パターン３の摩耗により、
すり接点５がＡ １ ｚ ０３基板との接触となって、
オーブン状態（接触抵抗無限大）となった場合と、厚膜
導体パターン３間のスリット部の目詰まりによりショー
トした場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film hot body pattern 3.
The sliding contact 5 comes into contact with the A 1 z 03 board,
Judgments were made based on the oven state (infinite contact resistance) and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一例端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配′！ｓ仮の厚膜導体パターンに対向して
摺動するようにしたすり接点とより成る慴動接点装置と
しても良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed at one end of a rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed parallel to it at regular intervals in its longitudinal direction. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern reciprocated back and forth in a bellows shape is formed on a ceramic substrate, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals. It may also be a sliding contact device consisting of a sliding contact that slides in opposition to the temporary thick film conductor pattern.
（発明の効果）
以上の説明で判るように本発明ゐ摺動接点装置は、すり
接点のＡｇ Ｎｉ５〜２０ｗｔ％が硬さくＨＶ８０〜
１１０）が軟らかく滑りやすいので、接触作用において
、セラミックス基板上のＡｇ−樹脂系厚膜導体パターン
が損耗することが無く、又擬着、剥離が殆んど無くなり
、摩耗が減少するので、良好な接触が得られる。(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 5 to 20 wt% of AgNi in the sliding contact and a hardness of HV80 to
110) is soft and slippery, so the Ag-resin thick film conductor pattern on the ceramic substrate will not be worn out during contact action, and there will be almost no adhesion or peeling, reducing wear. Contact can be obtained.
従って、接触信頼性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のＡｇ Ｎｉ５〜２０ｉ
ｖ ｔ％接点材の電気伝導度が良好であるので、接触作
用において、発熱せず、溶着が起こりにくい。従って、
摺動接点装置の耐溶着性が著しく向上する。Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag Ni5~20i of the sliding contact
Since the electrical conductivity of the vt% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore,
The welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｎｉ５〜
２０ｗｔ％の接点材がスプリング端子材に取り付けられ
て成るすり接点とにより構成されていることを特徴とす
る摺動接点装置。A wiring board is formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting it to the thick film resistor pattern to harden an Ag-resin conductor paste to form a thick film conductor pattern. , Ag-Ni5~ is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which 20 wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314045A JPH077730B2 (en) | 1986-12-24 | 1986-12-24 | Sliding contact device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314045A JPH077730B2 (en) | 1986-12-24 | 1986-12-24 | Sliding contact device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63160305A true JPS63160305A (en) | 1988-07-04 |
| JPH077730B2 JPH077730B2 (en) | 1995-01-30 |
Family
ID=18048550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61314045A Expired - Lifetime JPH077730B2 (en) | 1986-12-24 | 1986-12-24 | Sliding contact device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077730B2 (en) |
-
1986
- 1986-12-24 JP JP61314045A patent/JPH077730B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH077730B2 (en) | 1995-01-30 |
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