JPS63160204A - Slide contactor - Google Patents

Slide contactor

Info

Publication number
JPS63160204A
JPS63160204A JP61306988A JP30698886A JPS63160204A JP S63160204 A JPS63160204 A JP S63160204A JP 61306988 A JP61306988 A JP 61306988A JP 30698886 A JP30698886 A JP 30698886A JP S63160204 A JPS63160204 A JP S63160204A
Authority
JP
Japan
Prior art keywords
thick film
sliding contact
contact
pattern
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61306988A
Other languages
Japanese (ja)
Inventor
水上 繁夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP61306988A priority Critical patent/JPS63160204A/en
Publication of JPS63160204A publication Critical patent/JPS63160204A/en
Pending legal-status Critical Current

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  • Contacts (AREA)
  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー(可変抵抗器の一種)
等で用いられる摺動接点装置の改良に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(従来の技術とその問題点) 従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン(C)や酸化ルテニウム(RuO□
)などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ag接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易くて寿命が短く、接
触信頼性にやや欠けるものであった。
(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuO□
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. It was easy to use, short-lived, and somewhat lacking in contact reliability.

この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、A
g−Pd系の導体ペーストに置き換えて焼成するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にAg
−Pd系導体ペーストを重ねて焼成することにより、接
触信軌性を改善し、又すり接点のAg接点材を硫化防止
の為、Ag−Pd30〜50w L%に置き換えている
For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with g-Pd-based conductor paste and bake it, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- By stacking and firing Pd-based conductor paste, contact reliability is improved, and the Ag contact material of the sliding contact is replaced with 30 to 50 wL% of Ag-Pd to prevent sulfurization.

然し乍ら、厚膜導体パターンと接点材が同種の組合せの
為、容゛易に凝着、剥離が起こり、摩耗が促進される。
However, since the thick film conductor pattern and the contact material are the same type of combination, adhesion and peeling easily occur, accelerating wear.

又Ag−Pd30〜50−L%の接点材はHv160〜
200で硬すぎるのに対し、Ag−Pd系の導体ペース
トの焼成物である厚膜導体パターンが軟らかい為、摩耗
が多くなり、早期に寿命となる。更にAg−Pd30〜
50wt%接点材は、電気伝導度(IAC33,8〜5
.5)が低い為、発熱する等の問題点があった。
Also, the contact material of Ag-Pd 30-50-L% is Hv160~
200 is too hard, whereas the thick film conductor pattern, which is a baked product of Ag-Pd-based conductor paste, is soft, resulting in increased wear and premature end of life. Furthermore, Ag-Pd30~
The 50wt% contact material has an electrical conductivity (IAC33,8~5
.. 5), there were problems such as heat generation.

(発明の目的) 本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。
(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(問題点を解決するための手段) 前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを焼成して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てAg−Pt系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされA g −M 
o IQ〜5Cht t%の接点材がスプリング端子材
に取付けられて成るすり接点とにより構成されているこ
とを特徴とする。
(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by firing a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by connecting to a resistor pattern and forming a thick film conductor pattern by firing an Ag-Pt based conductor paste, and a wiring board configured to be able to slide against the thick film conductor pattern of this wiring board. -M
o It is characterized in that it is constituted by a contact material of IQ~5Cht t% and a sliding contact formed by being attached to a spring terminal material.

本発明の摺動接点装置に於いて、すり接点の接点材をA
g−Mo10〜50w t%とした理由は、Ag中のM
Oが10−1%未満だと潤滑効果が薄く、そのすり接点
がセラミックス基板上のAg−Pt系の厚膜導体パター
ンとの接触に於いて凝着、剥離が生じ、50w t%を
超えると、ノイズの発生原因となるからであ°る。
In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-Mo to 10 to 50 wt% is that M in Ag
If the O content is less than 10-1%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Ag-Pt thick film conductor pattern on the ceramic substrate. This is because it becomes a cause of noise generation.

(作用) 上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のAg−Mo10〜50wt%接点材の硬
さくHV80〜140)が軟らかく滑りやすいので、接
触抵抗が低く安定していて、Ag−pt系系膜膜導体パ
ターン損耗することが無く、又凝着、剥離が殆んど無く
なり、摩耗が減少するので、良好な接触が得られる。更
にすり接点のAg−MOIO〜50wt%接点材の電気
伝導度がlAC340〜60%と良好であるので、発熱
しない。
(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-Mo 10 to 50 wt% contact material of the sliding contact is HV80 to 140). Since it is soft and slippery, the contact resistance is low and stable, the Ag-PT film conductor pattern does not wear out, and there is almost no adhesion or peeling, reducing wear, resulting in good contact. is obtained. Furthermore, since the electrical conductivity of the Ag-MOIO~50wt% contact material of the sliding contact is as good as 340~60% lAC, no heat is generated.

(実施例) 本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚0 、6 am、直径30關の純度98%のA
l2O3基板1上の外周に幅3鶴でRu Otの抵抗ペ
ーストをスクリーン印刷し、800℃で焼成して厚さ1
0μの厚膜抵抗パターン2を形成し、この厚膜抵抗パタ
ーン2に接続して、周方向に、AgPt3wt%導体ペ
ーストをスクリーン印刷し、800℃で焼成して、0.
2龍間隔に幅0.2鶴、長さ7■l、厚さ10μの厚膜
導体パターン3を形成して配線板4とした。一方、この
配線板4の厚膜導体パターン3に対向して夫々摺動する
ようになされた2種のすり接点5は、Ag  Mo20
wt%とAgMo30wt%の2種の接点線材(直径1
 、5 war )から作製した頭部径3龍、頭部厚さ
0.6mm、脚部径1.51慮、脚部長1.5Hの2種
のリベント接点6を、夫々幅4m、厚さ0.15mmの
l3e−Cuより成るスプリング端子材7の接点取付穴
に挿入しかしめて成るものである。
(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, a 98% pure A with a plate thickness of 0.6 am and a diameter of 30 mm is used.
Screen-print RuOt resistance paste with a width of 3 squares on the outer periphery of the l2O3 substrate 1, and bake it at 800℃ to a thickness of 1 inch.
A 0μ thick film resistor pattern 2 is formed, connected to this thick film resistor pattern 2, a 3wt% AgPt conductor paste is screen printed in the circumferential direction, and baked at 800°C to form a 0μ thick film resistor pattern 2.
A wiring board 4 was prepared by forming a thick film conductor pattern 3 having a width of 0.2 mm, a length of 7 liters, and a thickness of 10 .mu.m at intervals of 2 circles. On the other hand, the two types of sliding contacts 5, which are made to slide against the thick film conductor pattern 3 of the wiring board 4, are made of AgMo20
Two types of contact wires (diameter 1
, 5 WAR) with a head diameter of 3 mm, a head thickness of 0.6 mm, a leg diameter of 1.51 mm, and a leg length of 1.5 H, respectively, with a width of 4 m and a thickness of 0. It is inserted into a contact mounting hole of a spring terminal material 7 made of l3e-Cu with a thickness of 15 mm.

このように構成された実施例1.2の摺動接点装置と、
A g −P d30wt%接点材を有するすり接点を
配線板のA g−P d30wt%の厚膜導体パターン
と対向させて成る従来の摺動接点装置とを、下記の試験
条件にて摺動開閉試験を行った処、下記の表に示すよう
な結果を得た。
The sliding contact device of Example 1.2 configured in this way,
A conventional sliding contact device consisting of a sliding contact having a contact material of 30 wt% A g -P d facing a thick film conductor pattern of 30 wt % A g -P d on a wiring board was subjected to sliding opening and closing under the following test conditions. When the test was conducted, the results shown in the table below were obtained.

試験条件 接触カニ10g、動作一回転往復型(55度)、駆動=
60ストローク/min、通電=12■、loOmA上
記の表で明らかなように実施例1.2の摺動接点装置は
、従来例の摺動装置に比し、寿命が大概倍増しているこ
とが判る。これはひとえにすり接点5のAg−Mo10
〜50wt%接点材の硬さが軟らかく滑りやすい為、対
向するAg−Pt系の厚膜導体パターン3を損耗するこ
とが無く、又凝着、剥離することが無く、摩耗が減少し
、更にAg−Mo10〜50wt%の接点材の電気伝導
度が良好で発熱することが無いからである。
Test conditions: Contact crab 10g, motion one rotation reciprocating type (55 degrees), drive =
60 strokes/min, energization = 12■, loOmA As is clear from the table above, the sliding contact device of Example 1.2 has almost twice the lifespan compared to the conventional sliding device. I understand. This is just Ag-Mo10 with sliding contact 5.
~50wt% Since the contact material has a soft hardness and is slippery, it does not damage the opposing Ag-Pt thick film conductor pattern 3, and does not adhere or peel off, reducing wear. This is because the contact material containing 10 to 50 wt% of -Mo has good electrical conductivity and does not generate heat.

尚、前記の寿命は、厚膜導体パターン3の摩耗により、
すり接点5がA1zO’s基板との接触となって、オー
プン状態(接触抵抗無限大)となった場合と1.厚膜導
体パターン3間のスリット部の目詰まりによりショート
した場合で判定した。
Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
1. When the sliding contact 5 comes into contact with the A1zO's board and becomes open (infinite contact resistance). The judgment was made based on the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.

尚、上記実施例の摺動接点装置の配線板4は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてずり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。
Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The shear contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.

(発明の効果) 以上の説明で判るように本発明の摺動接点装置は、すり
接点のAg−酸化すず6〜12wt%が硬さくIIV8
0〜140)が軟らか(滑りやすいので、接触作用にお
いてセラミックス基板上のAg−PL系系膜膜導体パタ
ーン損耗することが無く、又凝着、Tj1離が殆んど無
くなり、摩耗が減少するので、良好な接触が得られる。
(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 6 to 12 wt % of Ag-tin oxide in the sliding contact.
0 to 140) is soft (slippery), so the Ag-PL based film conductor pattern on the ceramic substrate will not be worn out during contact action, and adhesion and Tj1 separation are almost eliminated, reducing wear. , good contact can be obtained.

従って、接触信頼性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のAg−Mo10〜50w
 t%接点材の電気伝導度が良好であるので、接触作用
において、発熱せず、溶着が起こりにくい。従って、摺
動接点装置の耐溶着性が著しく向上する。
Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag-Mo10~50w of sliding contact
Since the electrical conductivity of the t% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。
The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.

Claims (1)

【特許請求の範囲】[Claims]  セラミックス基板上に、抵抗ペーストを焼成して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てAg−Pt系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされAg−Mo10
〜50wt%の接点材がスプリング端子材に取り付けら
れて成るすり接点とにより構成されていることを特徴と
する摺動接点装置。
A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting to the thick film resistor pattern and firing an Ag-Pt based conductor paste to form a thick film conductor pattern. , Ag-Mo10 is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which ~50wt% of contact material is attached to a spring terminal material.
JP61306988A 1986-12-23 1986-12-23 Slide contactor Pending JPS63160204A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61306988A JPS63160204A (en) 1986-12-23 1986-12-23 Slide contactor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61306988A JPS63160204A (en) 1986-12-23 1986-12-23 Slide contactor

Publications (1)

Publication Number Publication Date
JPS63160204A true JPS63160204A (en) 1988-07-04

Family

ID=17963661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61306988A Pending JPS63160204A (en) 1986-12-23 1986-12-23 Slide contactor

Country Status (1)

Country Link
JP (1) JPS63160204A (en)

Cited By (4)

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US10683169B2 (en) 2010-12-15 2020-06-16 Symbotic, LLC Automated bot transfer arm drive system
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US10894663B2 (en) 2013-09-13 2021-01-19 Symbotic Llc Automated storage and retrieval system
US11078017B2 (en) 2010-12-15 2021-08-03 Symbotic Llc Automated bot with transfer arm

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10759600B2 (en) 2009-04-10 2020-09-01 Symbotic Llc Autonomous transports for storage and retrieval systems
US10683169B2 (en) 2010-12-15 2020-06-16 Symbotic, LLC Automated bot transfer arm drive system
US11078017B2 (en) 2010-12-15 2021-08-03 Symbotic Llc Automated bot with transfer arm
US11273981B2 (en) 2010-12-15 2022-03-15 Symbolic Llc Automated bot transfer arm drive system
US10894663B2 (en) 2013-09-13 2021-01-19 Symbotic Llc Automated storage and retrieval system

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