JPS63158806A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63158806A JPS63158806A JP61306984A JP30698486A JPS63158806A JP S63158806 A JPS63158806 A JP S63158806A JP 61306984 A JP61306984 A JP 61306984A JP 30698486 A JP30698486 A JP 30698486A JP S63158806 A JPS63158806 A JP S63158806A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000010304 firing Methods 0.000 claims description 5
- 229910017937 Ag-Ni Inorganic materials 0.000 description 4
- 229910017984 Ag—Ni Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
等で用いられる摺動接点装置の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン（Ｃ）や酸化ルテニウム（Ｒｕｎｇ
）などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易くて寿命が短く、接
触信頼性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (Rung oxide) on a ceramic substrate.
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. It was easy to use, short-lived, and somewhat lacking in contact reliability.
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ａ
ｇ−Ｐｄ系の導体ペーストに置き換えて焼成するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にＡｇ
−Ｐｄ系導体ペーストを重ねて焼成することにより、接
触信頼性を改善し、又すり接点のＡｇ接点材を硫化防止
の為、Ａｇ−Ｐｄ３０〜５０ｗ ｔ％に置き換えている
。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with g-Pd-based conductor paste and bake it, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by stacking and firing Pd-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50 wt% of Ag-Pd to prevent sulfurization.
然し乍ら、厚膜導体パターンと接点材が同種の組合せの
為、容易に凝着、剥離が起こり、摩耗が促進される。又
Ａｇ−Ｐｄ３０〜５０−ｔ％の接点材はＨｖ １６０〜
２００で硬すぎるのに対し、Ａｇ−Ｐｄ系の導体ペース
トの焼成物である厚膜導体パターンが軟らかい為、摩耗
が多くなり、早期に寿命となる。更にＡｇ−Ｐｄ３０〜
５０−ｔ％接点材は、電気伝導度（ＩＡＣ３３，８〜５
．５）が低い為、発熱する等の問題点があった。However, since the thick film conductor pattern and the contact material are the same type of combination, adhesion and peeling easily occur, accelerating wear. Also, the contact material of Ag-Pd 30-50-t% has Hv 160-
200 is too hard, whereas the thick film conductor pattern, which is a baked product of Ag-Pd-based conductor paste, is soft, resulting in increased wear and premature end of life. Furthermore, Ag-Pd30~
The 50-t% contact material has an electrical conductivity (IAC33,8~5
．． 5), there were problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを焼成して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−Ｐｔ系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｎｉ５〜
２０−ｔ％の接点材がスプリング端子材に取付けられて
成るすり接点とにより構成されていることを特徴とする
。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by firing a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by connecting to a resistor pattern and forming a thick film conductor pattern by firing an Ag-Pt based conductor paste, and an Ag- Ni5～
The present invention is characterized in that 20-t% of the contact material is constituted by a sliding contact formed by being attached to a spring terminal material.
本発明の摺動接点装置に於いて、すり接点の接点材をＡ
ｇ−Ｎｉ５〜２０−ｔ％とした理由は、Ａｇ中のＮｉが
５ｗｔ％未満だとそのすり接点がセラミックス基板上の
Ａｇ−Ｐ を系の厚膜導体パターンとの接触に於いて凝
着、剥離が生じ、２０ｗ ｔ％を超えると、酸化物が生
成されてノイズの発生原因となるからである。In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-Ni to 5 to 20-t% is that if Ni in Ag is less than 5 wt%, the sliding contact will cause Ag-P on the ceramic substrate to adhere to the thick film conductor pattern in the system. This is because if peeling occurs and the content exceeds 20 wt%, oxides will be generated and cause noise.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のＡｇ−Ｎｉ５〜２０ｗｔ％接点材の硬さ
くＨｖ８０〜１１０）が軟らかく滑りやすいので、接触
抵抗が低く安定していて、Ａｇ−ｐｔ系深厚膜導体パタ
ーン損耗することが無く、又凝着、剥離が殆んど無くな
り、摩耗が減少するので、良好な接触が得られる。更に
すり接点のＡｇ−Ｎｉ５〜２０ｗ ｔ％接点材の電気伝
導度がＩＡＣＳ８０〜９５％と良好であるので、発熱し
ない。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-Ni 5-20wt% contact material of the sliding contact is Hv80-110). Since it is soft and slippery, the contact resistance is low and stable, the Ag-PT deep film conductor pattern does not wear out, and there is almost no adhesion or peeling, and wear is reduced, so good contact is achieved. can get. Furthermore, since the electrical conductivity of the Ag-Ni 5-20wt% contact material of the sliding contact is as good as 80-95% IACS, no heat is generated.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚０．６ｍｍ、直径３０ｍ５の純度９８％のＡｌ
１ｙ’ｓ基板ｌ上の外周に幅３鶴でＲｕｂ、の抵抗ペー
ストをスクリーン印刷し、８００℃で焼成して厚さ１０
μの厚膜抵抗パターン２を形成し、この厚膜抵抗パター
ン２に接続して、周方向に、Ａｇ−Ｐｔ３ｗｔ％導体ペ
ーストをスクリーン印刷し、８００℃で焼成して、０
、２ ａｍ間隔に幅０ 、２ ｍｍ、長さ７ｆｌ、厚さ
１０μの厚膜導体パターン３を形成して配線板４とした
。一方、この配線板４の厚膜導体パターン３に対向して
夫々摺動するようになされた２種のすり接点５は、Ａｇ
−Ｎｉ１０ｗｔ％とＡｇ−Ｎｉ２０ｗｔ％２種の接点線
材（直径１．５鰭）から作製した頭部径３■ｌ、頭部厚
さ０ 、６ ａｍ、脚部径１．５鶴、脚部長１．５１−
の２種のりベント接点６を、夫々幅４龍、厚さ０．１５
ｗのＢｅ−Ｃｕより成るスプリング端子材７の接点取付
穴に挿入しかしめて成るものである。(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, a 98% pure Al plate with a thickness of 0.6 mm and a diameter of 30 m5 is used.
Screen print a resistive paste of Rub with a width of 3 squares on the outer periphery of the 1y's board l, and bake it at 800℃ to a thickness of 10 mm.
A thick film resistor pattern 2 of μ is formed, and connected to this thick film resistor pattern 2, an Ag-Pt 3wt% conductor paste is screen printed in the circumferential direction, and baked at 800°C.
, 2 am apart, thick film conductor patterns 3 having a width of 0.2 mm, a length of 7 fl, and a thickness of 10 μm were formed to form a wiring board 4. On the other hand, the two types of sliding contacts 5, which are made to slide oppositely to the thick film conductor pattern 3 of this wiring board 4, are made of Ag.
- Head diameter 3 μl, head thickness 0, 6 am, leg diameter 1.5 cranes, leg length 1 made from two types of contact wires (1.5 fin diameter): 10 wt% Ni and 20 wt% Ag-Ni. .51-
Two types of glue vent contacts 6 are used, each with a width of 4 mm and a thickness of 0.15 mm.
It is inserted into a contact mounting hole of a spring terminal material 7 made of Be-Cu (w) and then tightened.
このように構成された実施例１．２の摺動接点装置と、
Ａ ｇ −Ｐ ｄ３０ｗｔ％接点材を有するすり接点を
配線板のＡ ｇ −Ｐ ｄ ３０ｗｔ％の厚膜導体パタ
ーンと対向させて成る従来の摺動接点装置とを、下記の
試験条件にて摺動開閉試験を行った処、下記の表に示す
ような結果を得た。The sliding contact device of Example 1.2 configured in this way,
A conventional sliding contact device consisting of a sliding contact having a contact material of 30 wt% A g -P d and a thick film conductor pattern of 30 wt % A g -P d on a wiring board was tested under the following test conditions. When we conducted an opening/closing test, we obtained the results shown in the table below.
試験条件
接触カニ１０ｇ、動作：回転往復型（５５度）、駆動：
６０ストロ一ク／ｗｉｎ、通電： １２Ｖ 、 １００
ｍ Ａ上記の表で明らかなように実施例１．２の摺動接
点装置は、従来例の摺動装置に比し、寿命が大概倍増し
ていることが判る。これはひとえにすり接点５のＡｇ−
Ｎｉ５〜２０−ｔ％接点材の硬さが軟らかく滑りやすい
為、対向するＡｇ−Ｐ を系の厚膜導体パターン３を損
耗することが無く、又凝着、剥離することが無く、摩耗
が減少し、更にＡｇ−Ｎｉ５〜２０−ｔ％の接点材の電
気伝導度が良好で発熱することが無いからである。Test conditions Contact crab 10g, operation: rotating reciprocating type (55 degrees), drive:
60 strokes/win, energization: 12V, 100
mA As is clear from the table above, the sliding contact device of Example 1.2 has a lifespan almost twice as long as that of the conventional sliding contact device. This is just the Ag- of the sliding contact 5.
Since the hardness of the Ni5-20-t% contact material is soft and slippery, there is no damage to the opposing Ag-P thick film conductor pattern 3, and there is no adhesion or peeling, reducing wear. Furthermore, the electrical conductivity of the contact material containing 5 to 20 t% of Ag-Ni is good and no heat is generated.
尚、前記の寿命は、厚膜導体パターン３の摩耗により、
すり接点５がＡ１ｔＯｓ基板との接触となって、オープ
ン状態（接触抵抗無限大）となった場合と、厚膜導体パ
ターン３間のスリット部の目詰まりによりショートした
場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The judgment was made based on the case where the sliding contact 5 came into contact with the A1tOs substrate and became an open state (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.
（発明の効果）
以上の説明で判るように本発明の摺動接点装置は、すり
接点のＡｇ−Ｎ ｔ ５〜２０ｗｔ％が硬さくＨｖ８０
〜１１０）が軟らかく滑りやすいので、接触作用におい
てセラミックス基板上のＡｇ−Ｐ を系厚膜導体パター
ンが損耗することが無く、又凝着、剥離が殆んど無くな
り、摩耗が減少するので、良好な接触が得られる。(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 5 to 20 wt% of Ag-Nt in the sliding contact and a hardness of Hv80.
~110) is soft and slippery, so the Ag-P thick film conductor pattern on the ceramic substrate will not be worn out during contact action, and there will be almost no adhesion or peeling, reducing wear. You can get good contact.
従って、接触信鯨性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のＡｇ−Ｎｉ５〜２０−ｔ
％接点材の電気伝導度が良好であるので、接触作用にお
いて、発熱せず、溶着が起こりにくい。従って、摺動接
点装置の耐溶着性が著しく向上する。Therefore, contact accuracy is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag-Ni5~20-t of the sliding contact
% Since the electrical conductivity of the contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−Ｐｔ系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−Ｎｉ５〜
２０ｗｔ％の接点材がスプリング端子材に取り付けられ
て成るすり接点とにより構成されていることを特徴とす
る摺動接点装置。A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting to the thick film resistor pattern and firing an Ag-Pt based conductor paste to form a thick film conductor pattern. , Ag-Ni5~ is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which 20 wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61306984A JPH077727B2 (en) | 1986-12-23 | 1986-12-23 | Sliding contact device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61306984A JPH077727B2 (en) | 1986-12-23 | 1986-12-23 | Sliding contact device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63158806A true JPS63158806A (en) | 1988-07-01 |
| JPH077727B2 JPH077727B2 (en) | 1995-01-30 |
Family
ID=17963614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61306984A Expired - Lifetime JPH077727B2 (en) | 1986-12-23 | 1986-12-23 | Sliding contact device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH077727B2 (en) |
-
1986
- 1986-12-23 JP JP61306984A patent/JPH077727B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH077727B2 (en) | 1995-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |