JPS63196002A - Slide contactor - Google Patents

Slide contactor

Info

Publication number
JPS63196002A
JPS63196002A JP62028472A JP2847287A JPS63196002A JP S63196002 A JPS63196002 A JP S63196002A JP 62028472 A JP62028472 A JP 62028472A JP 2847287 A JP2847287 A JP 2847287A JP S63196002 A JPS63196002 A JP S63196002A
Authority
JP
Japan
Prior art keywords
thick film
sliding contact
contact
pattern
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62028472A
Other languages
Japanese (ja)
Inventor
亮 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP62028472A priority Critical patent/JPS63196002A/en
Publication of JPS63196002A publication Critical patent/JPS63196002A/en
Pending legal-status Critical Current

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  • Details Of Resistors (AREA)
  • Adjustable Resistors (AREA)
  • Contacts (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー(可変抵抗器の一種)
等で用いられる摺動接点装置の改良に関する。
Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(従来の技術とその問題点) 従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン(C)や酸化ルテニウム(RuOz
)などの抵抗ペーストを焼成して厚膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ag接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易(、又接触抵抗がやや高(且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易くて寿命が短く、接
触信頼性にやや欠けるものであった。
(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuOz) on a ceramic substrate.
), etc., to form a thick film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. This sliding contact device is constructed with a sliding contact made by caulking or welding, but this sliding contact device tends to generate noise (and has a somewhat high contact resistance (and is unstable due to some variation). It was easy to wear out, had a short lifespan, and had somewhat poor contact reliability.

この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、C
u−樹脂系の導体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にCu
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のAg接点材を硫化防止
の為、Ag−Pd30〜50−t%に置き換えている。
For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with a u-resin conductor paste and cure it, or add Cu to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50-t% Ag-Pd to prevent sulfurization.

然し乍ら、A g −P d 30〜50wt%の接点
材はHv160〜200で硬すぎるのに対し、Cu−樹
脂系の導体ペーストの硬化物である厚膜導体パターンが
軟らかい為、摩耗が多くなり、早期に寿命となる。
However, the contact material with A g -P d 30 to 50 wt% is too hard at Hv 160 to 200, whereas the thick film conductor pattern, which is a cured product of Cu-resin conductor paste, is soft, resulting in increased wear. It reaches the end of its lifespan early.

更にAg−Pd30〜50wt%接点材は、電気伝導度
<lAC33,8〜5.5)が低い為、発熱する等の問
題点があった。
Furthermore, since the Ag-Pd 30-50 wt% contact material has a low electrical conductivity (<lAC33,8-5.5), it has problems such as heat generation.

(発明の目的) 本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。
(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(問題点を解決するための手段) 前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てCu−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされAg−酸化すず
6〜124%の接点材がスプリング端子材に取付けられ
て成るすり接点とにより構成されていることを特徴とす
る。
(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing a Cu-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- It is characterized by comprising a contact material containing 6 to 124% tin oxide and a sliding contact formed by attaching a contact material to a spring terminal material.

本発明の摺動接点装置に於いて、すり接点の接点材をA
g−酸化すず6〜12wt%とした理由は、Ag中の酸
化すずが6wt%未満だと潤滑効果が薄く、そのすり接
点がセラミックス基板上のCu−樹脂系の厚膜導体パタ
ーンとの接触に於いて凝着、剥離が生じ、12−t%を
超えると、ノイズの発生原因となるからである。
In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason why the g-tin oxide content is 6 to 12 wt% is that if the tin oxide content in Ag is less than 6 wt%, the lubricating effect will be weak, and the sliding contact will not come into contact with the Cu-resin thick film conductor pattern on the ceramic substrate. This is because adhesion and peeling occur, and if it exceeds 12-t%, it becomes a cause of noise generation.

(作用) 上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のAg−酸化すず6〜12vt%接点材の
硬さく Hv 110〜150)が軟らかく滑りやすい
ので、接触抵抗が低く安定していて、Cu−樹脂系厚膜
導体パターンを損耗することが無く、又凝着、剥離が殆
んど無くなり、摩耗が減少するので、良好な接触が得ら
れる。更にすり接点のAg−酸化すず6〜12−t%接
点材の電気伝導度がlAC370〜80%と良好である
ので、発熱しない。
(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-tin oxide contact material of the sliding contact of 6 to 12 vt% Hv 110 ~150) is soft and slippery, so the contact resistance is low and stable, and the Cu-resin thick film conductor pattern is not damaged, and adhesion and peeling are almost eliminated, reducing wear. Good contact can be obtained. Furthermore, since the electrical conductivity of the Ag-tin oxide 6-12-t% contact material of the sliding contact is as good as 370-80% lAC, no heat is generated.

(実施例) 本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚0.6論、直径30mの純度98%のAj!!
03基板1上の外周に幅3鶴でRuQ、の抵抗ペースト
をスクリーン印刷し、800℃で焼成して厚さlOμの
厚膜抵抗パターン2を形成し、この厚膜抵抗パターン2
に接続して、周方向に、Cu−樹脂系導体ペーストをス
クリーン印刷し、130℃で硬化して、0.2輪間隔に
幅0.2鶴、長さ7龍、厚さ10μの厚膜導体パターン
(Cu−樹脂26wt%)3を形成して配線板4とした
。一方、この配線板4の厚膜導体パターン3に対向して
夫々摺動するようになされた2種のすり接点5は、Ag
−酸化すず7.2wt%とAg−酸化すず9.3wt%
−酸化ニッケル0.1wt%の2種の接点線材(直径1
 、5 M )から作製した頭部径3龍、頭部厚さ0.
6fi、脚部径1 、5 mm、脚部長1.5Mの2種
のリベット接点6を、夫々幅4鶴、厚さ0.15mのB
e−Cuより成るスプリング端子材7の接点取付穴に挿
入しかしめて成るものである。
(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, Aj! with a plate thickness of 0.6 mm, a diameter of 30 m, and a purity of 98%! !
03 A RuQ resistor paste with a width of 3 squares is screen printed on the outer periphery of the substrate 1, and baked at 800°C to form a thick film resistor pattern 2 with a thickness of lOμ.
Connected to the , a Cu-resin conductor paste was screen printed in the circumferential direction, cured at 130℃, and a thick film with a width of 0.2 cranes, a length of 7 dragons, and a thickness of 10 μ was formed at 0.2 ring intervals. A conductive pattern (Cu-resin 26 wt%) 3 was formed to obtain a wiring board 4. On the other hand, the two types of sliding contacts 5, which are made to slide oppositely to the thick film conductor pattern 3 of this wiring board 4, are made of Ag.
-7.2wt% of tin oxide and 9.3wt% of Ag-tin oxide
- Two types of contact wires containing 0.1 wt% nickel oxide (diameter 1
, 5M) with a head diameter of 3mm and a head thickness of 0.
Two types of rivet contacts 6 with 6fi, leg diameters of 1 and 5 mm, and leg length of 1.5 m were each made of B with a width of 4 mm and a thickness of 0.15 m.
It is inserted into a contact mounting hole of a spring terminal material 7 made of e-Cu and is fastened.

このように構成された実施例1.2の摺動接点装置と、
A g −P d30wt%接点材を有するすり接点を
配線板のCu−樹脂の厚膜導体パターンと対向させて成
る従来の摺動接点装置とを、下記の試験条件にて摺動開
閉試験を行った処、下記の表に示すような結果を得た。
The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% contact material and facing a thick film conductor pattern made of Cu-resin on a wiring board. However, we obtained the results shown in the table below.

試験条件 接触カニ10g、動作二回転往復型(55度)、駆動:
60ストロ一ク/win、通電:12■、100mA【 上記の表で明らかなように実施例1.2の摺動接1点装
置は、従来例の摺動装置に比し、寿命が大概倍増してい
ることが判る。これはひとえにすり接点5のAg−酸化
すず6〜12wt%接点材の硬さが軟らかく滑りやすい
為、対向するCu−樹脂系の厚膜導体パターン3を損耗
することが無く、又凝着、剥離することが無く、摩耗が
減少し、更にAg−酸化すず6〜12wt%の接点材の
電気伝導度が良好で発熱することが無いからである。
Test conditions Contact crab 10g, action 2 rotation reciprocating type (55 degrees), drive:
60 strokes/win, energization: 12■, 100mA [As is clear from the table above, the sliding contact single point device of Example 1.2 has almost double the lifespan compared to the conventional sliding device. I can see that you are doing it. This is because the hardness of the Ag-tin oxide 6-12wt% contact material of the sliding contact 5 is soft and slippery, so the opposing Cu-resin thick film conductor pattern 3 will not be damaged and will not adhere or peel. This is because the electrical conductivity of the Ag-tin oxide contact material of 6 to 12 wt% is good and no heat is generated.

尚、前記の寿命は、厚膜導体パターン3の摩耗により、
すり接点5がAltos基板との接触となって、オープ
ン状B(接触抵抗無限大)となった場合と、厚膜導体パ
ターン3間のスリット部の目詰まりによりショートした
場合で判定した。
Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The evaluation was made based on the case where the sliding contact 5 came into contact with the Altos substrate and became an open state B (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.

尚、上記実施例の摺動接点装置の配線板4は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。
Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on a ceramic substrate in a bellows shape and reciprocated back and forth, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor pattern. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.

さらに実施例2のように酸化すずの一部を0.01〜1
wt%の範囲で鉄族元素の酸化物で置き替えてもよいも
のである。
Furthermore, as in Example 2, a portion of tin oxide is added to 0.01 to 1
It may be replaced with an oxide of an iron group element within a wt% range.

(発明の効果) 以上の説明で判るように本発明の摺動接点装置は、すり
接点のAg−酸化すず6〜12wt%が硬さくHvll
O〜150)が軟らかく滑りやすいので、接触作用にお
いてセラミックス基板上のCu−樹脂系厚膜導体パター
ンが損耗することが無く、又凝着、剥離が殆んど無くな
り、摩耗が減少するので、良好な接触が得られる。
(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 6 to 12 wt% of Ag-tin oxide in the sliding contact.
O~150) is soft and slippery, so the Cu-resin thick film conductor pattern on the ceramic substrate will not be worn out during contact action, and there will be almost no adhesion or peeling, reducing wear. You can get good contact.

従って、接触信頼性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のAg−酸化すず6〜12
−t%接点材の電気伝導度が良好であるので、接触作用
において、発熱せず、溶着が起こりにくい、従って、摺
動接点装置の耐溶着性が著しく向上する。
Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, Ag-tin oxide 6-12 of the sliding contact
-t% Since the electrical conductivity of the contact material is good, no heat is generated during the contact action, and welding is less likely to occur.Therefore, the welding resistance of the sliding contact device is significantly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。 出願人 田中貴金属工業株式会社 7・・・スアソン7″堝子7
The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention. Applicant: Tanaka Kikinzoku Kogyo Co., Ltd. 7... Suason 7" Sako 7

Claims (1)

【特許請求の範囲】[Claims]  セラミックス基板上に、抵抗ペーストを焼成して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てCu−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされAg−酸化すず
6〜12wt%の接点材がスプリング端子材に取り付け
られて成るすり接点とにより構成されていることを特徴
とする摺動接点装置。
A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting the thick film resistor pattern to harden a Cu-resin conductor paste to form a thick film conductor pattern. , and a sliding contact formed by attaching a contact material of 6 to 12 wt % Ag-tin oxide to a spring terminal material so as to be able to slide against the thick film conductor pattern of this wiring board. Features a sliding contact device.
JP62028472A 1987-02-10 1987-02-10 Slide contactor Pending JPS63196002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62028472A JPS63196002A (en) 1987-02-10 1987-02-10 Slide contactor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62028472A JPS63196002A (en) 1987-02-10 1987-02-10 Slide contactor

Publications (1)

Publication Number Publication Date
JPS63196002A true JPS63196002A (en) 1988-08-15

Family

ID=12249592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62028472A Pending JPS63196002A (en) 1987-02-10 1987-02-10 Slide contactor

Country Status (1)

Country Link
JP (1) JPS63196002A (en)

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