JPS63160304A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63160304A JPS63160304A JP61314044A JP31404486A JPS63160304A JP S63160304 A JPS63160304 A JP S63160304A JP 61314044 A JP61314044 A JP 61314044A JP 31404486 A JP31404486 A JP 31404486A JP S63160304 A JPS63160304 A JP S63160304A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
- Contacts (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
等で用いられる摺動接点装置の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン（Ｃ）や酸化ルテニウム（ＲｕＯ□
）などの抵抗ペーストを焼成してＷ膜抵抗パターンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易くて寿命が短く、接
触信頼性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (RuO□
), etc., to form a W film resistance pattern, and a spring terminal material that can slide against the thick film resistance pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. It was easy to use, short-lived, and somewhat lacking in contact reliability.
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ａ
ｇ−樹脂系の温体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にＡｇ
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のＡｇ接点材を硫化防止
の為、Ａｇ−Ｐｄ３０〜５０−ｔ％に置き換えている。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
g- Either replace it with a resin-based hot body paste and cure it, or add Ag to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50-t% Ag-Pd to prevent sulfurization.
然し乍ら、Ａ ｇ −Ｐ ｄ ３０〜５ｈｔ％の接点材
は）（ｖ１６０〜２００で硬すぎるのに対し、Ａｇ−樹
脂系の導体ペーストの硬化物である厚膜導体パターンが
軟らかい為、摩耗が多くなり、早期に寿命となる。However, contact materials with Ag-Pd of 30 to 5 ht% (v160 to 200) are too hard, whereas the thick film conductor pattern, which is a hardened product of Ag-resin conductor paste, is soft and causes a lot of wear. Therefore, the life span will be reached early.
更にＡｇ−Ｐｄ３０〜５０−ｔ％接点材は、電気伝導度
（ＩＡＣ３３，８〜５．５）が低い為、発熱する等の問
題点があった。Furthermore, since the Ag-Pd 30-50-t% contact material has a low electrical conductivity (IAC 33.8-5.5), there are problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−炭素０．
５〜５ｗｔ％の接点材がスプリング端子材に取付けられ
て成るすり接点とにより構成されていることを特徴とす
る。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing an Ag-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- Carbon 0.
It is characterized in that it is constituted by a sliding contact formed by attaching 5 to 5 wt% of contact material to a spring terminal material.
本発明の摺動接点装置に於いて、すり接点の接点材をＡ
ｇ−炭素０．５〜５ｗｔ％とした理由は、Ａｇ中の炭素
：Ａ’ ０．５ｗｔ％未満だと潤滑効果が薄く、そのす
り接点がセラミックス基板上のＡｇ−樹脂系の厚膜導体
パターンとの接触に於いて凝着、剥離が生じ、５ｗｔ％
を超えると、ノイズの発生原因となるからである。In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-carbon to 0.5 to 5 wt% is that if carbon in Ag: A' is less than 0.5 wt%, the lubricating effect is weak, and the sliding contact is a thick film conductor pattern made of Ag-resin on a ceramic substrate. Adhesion and peeling occur during contact with
This is because if it exceeds this, it will cause noise generation.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のＡｇ−炭素０．５〜５ｉｖｔ％接点材の
硬さくＨＶ８０〜１１０）が軟らかく滑りやすいので、
接触抵抗が低く安定していて、Ａ、ｇ−樹脂系厚膜導体
パターンを損耗することが無く、又凝着、剥離が殆んど
無くなり、摩耗が減少するので、良好な接触が得られる
。更にすり接点のＡｇ−炭素０．５〜５ｗｔ％接点材の
電気伝導度がｌＡＣ３６０〜８０％と良好であるめで、
発熱しない。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-carbon 0.5 to 5 ivt% contact material of the sliding contact is HV80. ~110) is soft and slippery, so
The contact resistance is low and stable, the A, G-resin thick film conductor pattern is not damaged, adhesion and peeling are almost eliminated, and abrasion is reduced, so good contact can be obtained. Furthermore, the electrical conductivity of the Ag-carbon 0.5 to 5 wt% contact material of the sliding contact is as good as 360 to 80% lAC.
No fever.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚０．６ｍｍ、直径３０＋＋ｎの純度９８％のＡ
β２０３基板１上の外周に幅３ｍ麿でＲｕ５ｔの抵抗ペ
ーストをスクリーン印刷し、８００℃で焼成して厚さ１
０μの厚膜抵抗パターン２を形成し、この厚膜抵抗パタ
ーン２に接続して、周方向に、Ａｇ−樹脂系扉体ペース
トをスクリーン印刷し、１３０℃で硬化して、０．２ｎ
間隔に幅０．２酊、長さ７１１１厚さ１０μの厚膜導体
パターン（Ａｇ−樹脂２６ｗ ｔ％）３を形成して配線
板４とした。一方、この配線板４の厚膜導体パターン３
に対向して夫々摺動するようになされた２種のすり接点
５は、Ａｇ−グラハイド１ｔｑｔ％とＡｇ−グラハイド
３ｗｔ％の２種の接点線材（直径１．５ｎ）から作製し
た頭部径３１ｍ、頭部厚さ０．６＋＊ｍ、脚部径１ 、
５ ｉｎ、脚部長１．５鶴の２種のリベット接点６を、
夫々幅４ ｍｌ、厚さ０．１５酊のＢｅ−Ｃｕより成る
スプリング端子材７の接点取付穴に挿入しかしめて成る
ものである。(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, the plate thickness is 0.6 mm, the diameter is 30++n, and the purity is 98%.
Screen-print Ru5t resistance paste with a width of 3 m on the outer periphery of the β203 substrate 1, and bake it at 800°C to a thickness of 1
A thick film resistor pattern 2 of 0 μm is formed, connected to this thick film resistor pattern 2, an Ag-resin door body paste is screen printed in the circumferential direction, and cured at 130° C. to form a 0.2 nm thick film resistor pattern 2.
Thick film conductor patterns (Ag-resin 26 wt%) 3 having a width of 0.2 mm, a length of 7111, and a thickness of 10 μm were formed at intervals to form a wiring board 4. On the other hand, thick film conductor pattern 3 of this wiring board 4
The two types of sliding contacts 5, which were made to slide oppositely to each other, had a head diameter of 31 m and were made from two types of contact wires (diameter 1.5n) of 1 tqt% Ag-graphide and 3wt% Ag-graphide. , head thickness 0.6+*m, leg diameter 1,
Two types of rivet contacts 6, 5 inch, leg length 1.5 crane,
Each spring terminal member 7 is made of Be-Cu and has a width of 4 ml and a thickness of 0.15 ml, and is inserted into a contact mounting hole.
このように構成された実施例１．２の摺動接点装置と、
Ａ ｇ −Ｐ ｄ３０ｗｔ％接点材を有するすり接点を
配線板のＡｇ−樹脂の厚膜導体パターンと対向させて成
る従来の摺動接点装置とを、下記の試験条件に、て摺動
開閉試験を行った処、下記の表に示すような結果を得た
。The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions using a conventional sliding contact device consisting of a sliding contact having a 30wt% A g -P d contact material facing a thick film conductor pattern made of Ag-resin on a wiring board. When I did this, I got the results shown in the table below.
試験条件
接触力＝１０ｇ、動作二回転往復型（５５度）、駆動：
６０ストロ一ク／ｍｉｎ、通電：１２■、１００ｍＡ上
記の表で明らかなように実施例１．２の摺動接点装置は
、従来例の摺動装置に比し、寿命が大概倍増しているこ
とが判る。これはひとえにすり接点５のＡｇ−炭素０．
５〜５ｗｔ％接点材の硬さが軟らかく滑りやすい為、対
向するＡｇ−樹脂系の厚膜導体パターン３を損耗するこ
とが無く、又凝着、剥離することが無く、摩耗が減少し
、更にＡｇ−炭素０．５〜５ｗｔ％の接点材の電気伝導
度が良好で発熱することが無いからである。Test conditions Contact force = 10g, operation 2 rotation reciprocating type (55 degrees), drive:
60 strokes/min, current flow: 12 mm, 100 mA As is clear from the above table, the sliding contact device of Example 1.2 has almost double the lifespan compared to the conventional sliding device. I understand that. This is simply due to the Ag-carbon 0.0 of the sliding contact 5.
Since the hardness of the 5 to 5 wt% contact material is soft and slippery, the opposing Ag-resin thick film conductor pattern 3 will not be damaged, and will not adhere or peel off, reducing wear. This is because the electrical conductivity of the Ag-carbon 0.5 to 5 wt% contact material is good and does not generate heat.
尚、前記の寿命は、厚膜導体パターン３の摩耗により、
すり接点５がＡ１ｚＯｚ基板との接触となって、オープ
ン状Ｌｉ（接触抵抗無限大）となった場合と、厚膜導体
パターン３間のスリット部の目詰まりによりショートし
た場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The evaluation was made based on the case where the sliding contact 5 came into contact with the A1zOz substrate and became an open Li (contact resistance infinite), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた゛厚膜抵抗パターンを形成し、
その上に厚膜導体パターンを一定間隔に並べて形成した
配線板と、この配線板の厚膜導体パターンに対向して摺
動するようにしたすり接点とより成る摺動接点装置とし
ても良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed on the ceramic substrate, reciprocating back and forth in a bellows shape.
A sliding contact device may be provided which includes a wiring board on which thick film conductor patterns are formed at regular intervals, and a sliding contact that slides in opposition to the thick film conductor patterns of the wiring board.
（発明の効果）
以上の説明で判るように本発明の摺動接点装置は、すり
接点のＡｇ−炭素０．５〜５ｔｓｔ％が硬さくＨＶ８０
．〜１１Ｏ）が軟らかく滑りやすいので、接触作用にお
いてセラミックス基板上のＡｇ−樹脂系厚膜導体パター
ンが損耗することが無く、又凝着、剥離が殆んど無くな
り、摩耗が減少するので、良好な接触が得られる。(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a hardness of 0.5 to 5 tst% of Ag-carbon in the sliding contact, and has a hardness of HV80.
．． ~11O) is soft and slippery, so the Ag-resin thick film conductor pattern on the ceramic substrate will not be worn out during contact action, and there will be almost no adhesion or peeling, reducing wear. Contact can be obtained.
従って、接触信鯨性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のＡｇ−炭素０．５〜５１
１ｔ％接点材の電気伝導度が良好であるので、接触作用
において、発熱せず、溶着が起こりにくい。従って、摺
動接点装置の耐溶着性が著しく向上する。Therefore, contact accuracy is improved and the life of the sliding contact device is significantly extended. Furthermore, the Ag-carbon 0.5 to 51 of the sliding contact
Since the 1t% contact material has good electrical conductivity, no heat is generated during contact action, and welding is less likely to occur. Therefore, the welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＡｇ−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−炭素０．
５〜５ｗｔ％の接点材がスプリング端子材に取り付けら
れて成るすり接点とにより構成されていることを特徴と
する摺動接点装置。A wiring board is formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting it to the thick film resistor pattern to harden an Ag-resin conductor paste to form a thick film conductor pattern. , which is made of Ag-carbon 0.000.
A sliding contact device comprising a sliding contact in which 5 to 5 wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314044A JPS63160304A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61314044A JPS63160304A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63160304A true JPS63160304A (en) | 1988-07-04 |
Family
ID=18048538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61314044A Pending JPS63160304A (en) | 1986-12-24 | 1986-12-24 | Slide contactor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63160304A (en) |
-
1986
- 1986-12-24 JP JP61314044A patent/JPS63160304A/en active Pending
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