JPS63244828A - Sliding contact apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.

(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc., have a thick film resistance pattern formed on a resin substrate using a resistance paste such as carbon (C). It consists of a wiring board made of a wiring board, and a sliding contact made by caulking or welding an Ag contact material to a spring terminal material that can slide against the thick film resistance pattern of the wiring board. This sliding contact device was prone to noise generation (also, the contact resistance was somewhat high and varied, making it unstable and lacking in contact reliability).

For this reason, the parts of the carbon thick film resistor pattern on the resin substrate that slide against the sliding contacts should be replaced with Ag-resin-based conductive paste and cured, or the parts that slide with the sliding contacts of the thick film resistor pattern Contact reliability was improved by layering and curing Ag-resin conductor paste.

However, since the thick film conductor pattern and the contact material are the same type of combination, there is a problem that adhesion and peeling easily occur, accelerating wear and shortening the service life.

(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.

(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistor pattern using a resistor paste on a resin substrate. A wiring board formed of a thick film conductor pattern formed with a Cu-resin conductor paste connected to It is characterized in that the contact material is constituted by a sliding contact which is attached to a spring terminal material.

In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason why g-bismuth oxide was set at 3 to 15 iuL% is that Ag
If the content of the oxidized steel inside is less than 3wt%, the lubricating effect will be weak (,
This is because adhesion and peeling occur when the sliding contacts come into contact with the Cu-resin thick film conductor pattern on the resin substrate, and if the bismuth oxide content exceeds 151%, it becomes a cause of noise generation.

(Function) In the sliding contact device configured as described above, the Ag-Visla 13 to 15 wt% contact material of the sliding contact easily slips during the contact action between the sliding contact and the thick film conductor pattern on the resin substrate. There is no adhesion to the Cu-resin thick film conductor pattern (there is almost no peeling of the pattern, wear is reduced, and good contact is obtained).

(Example) To explain an example of the sliding contact device of the present invention, carbon resistance paste is applied to the outer periphery of an epoxy resin substrate 1 having a thickness of 0.61 cm and a diameter of 301 m as shown in the figure. A thick film resistor pattern 2 with a thickness of 10 μm was formed by screen printing and curing at 130°C, and connected to this thick film resistor pattern 2, a Cu-resin conductor paste was screen printed in the circumferential direction and cured at 130°C. harden with 0.2 dragon spacing and width 0.2
Thick film conductor pattern (Cu
-Resin 26-1%) 3 was formed to form a wiring board 4. On the other hand, the two types of sliding contacts 5, which are slidably opposed to the thick film conductor pattern 3 of the wiring board 4, are composed of 31% Ag bismuth oxide and 6 wt% Ag-bismuth oxide-nickel oxide O,h. The head diameter is 3 cranes, the head thickness is 0.6 u, and the m part diameter is 1.
Two types of rivet contacts 6 each having a width of 4 mm and a leg length of 1.5 mm are inserted and secured into contact mounting holes of a spring terminal material 7 made of Be-Cu with a width of 4 mm and a thickness of 0.15 mm. be.

The sliding contact device of Example 1.2 configured in this way,
A conventional sliding contact device consisting of a sliding contact having an Ag contact material facing a thick film conductor pattern 3 made of 261% Cu-resin on the same wiring board 4 as in the example was subjected to sliding opening and closing under the following test conditions. When the test was conducted, the results shown in the table below were obtained.

Test conditions Contact crab 10g, action 2 rotation reciprocating type (55 degrees), drive:
60 strokes/rm ins Current: 12V,
100mA [As is clear from the table above, the sliding contact device of Example 1.2 has a longer lifespan than the sliding contact device of the conventional example. This is simply the Ag-Visla oxide 1 of the sliding contact 5.
3~15wt% Because the contact material is slippery, the opposing Cu-
This is because there is no adhesion to the resin-based thick film conductor pattern 3, and no peeling of the pattern (and abrasion is also reduced).

Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The sliding contact 5 comes into contact with the resin substrate, and an oven-like B is formed.
(contact resistance is infinite) and when a short circuit occurs due to clogging of the slit between the thick film conductor patterns 3.

Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed on one side end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. Further, a wiring board in which a thick film resistor pattern reciprocated back and forth in a bellows shape is formed on a resin substrate, and thick film conductor patterns are formed on the resin substrate by arranging them at regular intervals;
A sliding contact device comprising a sliding contact that slides opposite to the thick film conductor pattern of the wiring board may also be used.

Furthermore, as in Example 2, a part of bismuth oxide was added to 0.01
It may be replaced with an oxide of an iron group element in a range of 1 wt%.

(Effects of the Invention) As can be seen from the above explanation, in the sliding contact device of the present invention, since 3 to 15 wt% of Ag-bismuth oxide in the sliding contact is slippery, the Cu-resin conductor pattern on the resin substrate is used for contact action. There is no adhesion, and there is almost no peeling of the pattern, and wear is reduced, resulting in good contact.

Therefore, the contact reliability is improved and the life of the sliding contact device is significantly extended.

[Brief explanation of the drawing]

The figure is a schematic diagram showing an embodiment of the sliding contact device of the present invention.

Claims (1)

[Claims] A wiring board in which a thick film resistance pattern is formed using a resistance paste on a resin substrate, and a thick film conductor pattern is formed using a Cu-resin conductor paste connected to the thick film resistance pattern, and this wiring board. 1. A sliding contact device comprising a sliding contact formed by attaching a contact material of 3 to 15 wt % of Ag bismuth oxide to a spring terminal material and capable of sliding against a thick film conductor pattern.