JPS63196010A - Slide contactor - Google Patents
Slide contactorInfo
- Publication number
- JPS63196010A JPS63196010A JP62028480A JP2848087A JPS63196010A JP S63196010 A JPS63196010 A JP S63196010A JP 62028480 A JP62028480 A JP 62028480A JP 2848087 A JP2848087 A JP 2848087A JP S63196010 A JPS63196010 A JP S63196010A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- sliding contact
- contact
- pattern
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000010304 firing Methods 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、計測器、各種機械等で、検出用、制御用、設
定用、発振器用などに使用されているボリュームスイッ
チ、ポテンシオメータ、トリマー（可変抵抗器の一種）
等で用いられる摺動接点装置の改良に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention applies to volume switches, potentiometers, and trimmers used for detection, control, setting, oscillators, etc. in measuring instruments, various machines, etc. (a type of variable resistor)
This paper relates to improvements to sliding contact devices used in, etc.
（従来の技術とその問題点）
従来より上記のボリュームスイッチ、ポテンシオメータ
、トリマー等で用いられる摺動接点装置は、セラミック
ス基板上にカーボン（Ｃ）や酸化ルテニウム（Ｒｕｓｔ
）などの抵抗ペーストを焼成して厚膜抵抗バクーンを形
成して成る配線板と、この配線板の厚膜抵抗パターンに
対向して摺動し得るようになされたスプリング端子材に
Ａｇ接点材をかしめ或いは溶接して成るすり接点とによ
り構成されているが、この摺動接点装置は、ノイズが発
生し易く、又接触抵抗がやや高く且つ幾分ばらつきがあ
って不安定であり、しかも摩耗し易（て寿命が短く、接
触信頼性にやや欠けるものであった。(Prior art and its problems) Sliding contact devices conventionally used in the above-mentioned volume switches, potentiometers, trimmers, etc. are made of carbon (C) or ruthenium oxide (Rust) on a ceramic substrate.
), etc., to form a thick film resistor pattern, and a spring terminal material that can slide against the thick film resistor pattern of this wiring board, and an Ag contact material. These sliding contact devices are constructed with caulked or welded sliding contacts, but these sliding contact devices tend to generate noise, have somewhat high contact resistance, are unstable due to some variation, and are prone to wear. However, it had a short lifespan and was somewhat lacking in contact reliability.
この為、セラミックス基板上のカーボンや酸化ルテニウ
ムの厚膜抵抗パターンのすり接点と摺動する部分を、Ｃ
ｕ−樹脂系の導体ペーストに置き換えて硬化するかある
いは厚膜抵抗パターンのすり接点と摺動する部分にＣｕ
−樹脂系導体ペーストを重ねて硬化することにより、接
触信頼性を改善し、又すり接点のＡｇ接点材を硫化防止
の為、Ａｇ−Ｐｄ３０〜５０−ｔ％に置き換えている。For this reason, the part that slides with the sliding contact of the carbon or ruthenium oxide thick film resistor pattern on the ceramic substrate is
Either replace it with a u-resin conductor paste and cure it, or add Cu to the part that slides with the sliding contact of the thick film resistor pattern.
- Contact reliability is improved by layering and curing resin-based conductor paste, and the Ag contact material of the sliding contact is replaced with 30 to 50-t% Ag-Pd to prevent sulfurization.
然し乍ら、Ａ ｇ −Ｐ ｄ ３０〜５０ｗｔ％の接点
材はｔｔ ｖ１６０〜２００で硬すぎるのに対し、Ｃｕ
−樹脂系の導体ペーストの硬化物である厚膜導体パター
ンが軟らかい為、摩耗が多（なり、早期に寿命となる。However, the contact material containing A g -P d 30 to 50 wt% is too hard at tt v160 to 200, whereas Cu
-The thick film conductor pattern, which is a cured product of resin-based conductor paste, is soft, so it wears out a lot and ends its lifespan quickly.
更にＡｇ−Ｐｄ３０〜５０ｗ ｔ％接点材は、電気伝導
度（ＩＡＣ３３，８〜５．５）が低い為、発熱する等の
問題点があった。Furthermore, since the Ag-Pd 30-50wt% contact material has a low electrical conductivity (IAC33, 8-5.5), there are problems such as heat generation.
（発明の目的）
本発明は、上記問題点を解決することのできる摺動接点
装置を提供することを目的とするものである。(Object of the Invention) An object of the present invention is to provide a sliding contact device that can solve the above problems.
（問題点を解決するための手段）
前記の問題点を解決するための本発明の摺動接点装置は
、セラミックス基板上に、抵抗ペーストを硬化して厚膜
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＣｕ−樹脂系導体ペーストを焼成して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−ＷＣ４０
〜８０ｗ ｔ％の接点材がスプリング端子材に取付けら
れて成るすり接点とにより構成されていることを特徴と
する。(Means for Solving the Problems) A sliding contact device of the present invention for solving the above-mentioned problems includes forming a thick film resistance pattern by hardening a resistance paste on a ceramic substrate, and forming a thick film resistance pattern on a ceramic substrate. A wiring board formed by firing a Cu-resin conductor paste to form a thick film conductor pattern connected to a resistor pattern, and an Ag- WC40
It is characterized in that it is comprised of a contact material of ~80wt% and a sliding contact formed by being attached to a spring terminal material.
本発明の摺動接点装置に於いて、すり接点の接点材をＡ
ｇ−ＷＣ４０〜８０−ｔ％とした理由は、Ａｇ中のＷＣ
が４０ｗｔ％未満だと潤滑効果が薄く、そのすり接点が
セラミックス基板上のＣｕ−樹脂系の厚膜導体パターン
との接触に於いて凝着、剥離が生じ、８０％１ｔ％を超
えると、酸化物の生成量が多くなりノイズの発生原因と
なるからである。In the sliding contact device of the present invention, the contact material of the sliding contact is A
The reason for setting g-WC to 40-80-t% is that WC in Ag
If it is less than 40wt%, the lubricating effect will be weak, and adhesion and peeling will occur when the sliding contact contacts the Cu-resin thick film conductor pattern on the ceramic substrate.If it exceeds 80% or 1t%, oxidation will occur. This is because the amount of material generated increases, causing noise.
（作用）
上記の如く構成された摺動接点装置は、すり接点とセラ
ミックス基板上の厚膜導体パターンとの接触作用におい
て、すり接点のＡｇ−ＷＣ４０〜８０ｗｔ％接点材の硬
さくＨｖ１００〜１５０）が軟らかく滑りやすいので、
接触抵抗が低く安定していて、Ｃｕ−樹脂系厚膜導体パ
ターンを損耗することが無く、又凝着、剥離が殆んど無
くなり、摩耗が減少するので、良好な接触が得られる。(Function) In the sliding contact device configured as described above, in the contact action between the sliding contact and the thick film conductor pattern on the ceramic substrate, the hardness of the Ag-WC40-80wt% contact material of the sliding contact is Hv100-150). Because it is soft and slippery,
The contact resistance is low and stable, the Cu-resin thick film conductor pattern is not damaged, adhesion and peeling are almost eliminated, and abrasion is reduced, so good contact can be obtained.
更にすり接点のＡｇ−ＷＣ４０〜８０−ｔ％接点材の電
気伝導度力月ＡＣ３５０〜７０％と良好であるので、発
熱しない。Furthermore, since the electrical conductivity of the contact material of the sliding contact is 40-80% Ag-WC and 350-70% AC, no heat is generated.
（実施例）
本発明の摺動接点装置の実施例を説明すると、図に示す
如き板厚Ｑ、０＋ｎ、直径３０ｍの純度９８％のＡ ｌ
ｚ Ｏｓ基板１上の外周に幅３鶴でＲｕｎｇの抵抗ペ
ーストをスクリーン印刷し、８００℃で焼成して厚さ１
０μの厚膜抵抗パターン２を形成し、この厚膜抵抗パタ
ーン２に接続して、周方向に、Ｃｕ−樹脂系導体ペース
トをスクリーン印刷し、１３０℃で硬化して、０．２ｍ
間隔に幅０．２鶴、長さ７１１＋、厚さ１０μの厚膜導
体パターン（Ｃｕ−樹脂２６−ｔ％）３を形成して配線
板４とした。一方、この配線板４の厚膜導体パターン３
に対向して夫々摺動するようになされた２種のすり接点
５は、Ａ ｇ −ＷＣ５０ｗ ｔ％とＡｇ−ＷＣ６５ｗ
ｔ％の２種の接点線材（直径１ 、５ ｔｍ ）から作
製した頭部径３ｍ、頭部厚さ０．６鶴、脚部径１．５鴫
、脚部長１．５鶴の２種のリベ−／ ）接点６を、夫々
幅４１１ｍ、厚さ０．１５ｍｍのＢｅ−Ｃｕより成るス
プリング端子材７の接点取付穴に挿入しかしめて成るも
のである。(Example) To explain an example of the sliding contact device of the present invention, as shown in the figure, a 98% pure Al having a plate thickness of Q, 0+n, and a diameter of 30 m is used.
Rung's resistance paste was screen printed on the outer periphery of the Os substrate 1 with a width of 3 squares, and baked at 800°C to a thickness of 1 inch.
A thick film resistor pattern 2 of 0 μm is formed, and connected to this thick film resistor pattern 2, a Cu-resin conductor paste is screen printed in the circumferential direction, and cured at 130°C to form a 0.2 m thick resistor pattern.
Thick film conductor patterns (Cu-resin 26-t%) 3 having a width of 0.2 mm, a length of 711+, and a thickness of 10 μm were formed at intervals to form a wiring board 4. On the other hand, thick film conductor pattern 3 of this wiring board 4
The two types of sliding contacts 5 are Ag-WC50wt% and Ag-WC65w.
Two types of contact wire rods (diameters 1 and 5 tm) with a head diameter of 3 m, a head thickness of 0.6 tsuru, a leg diameter of 1.5 tm, and a leg length of 1.5 tm were made from two types of contact wire rods (diameters of 1 and 5 tm). The contacts 6 are inserted into the contact mounting holes of spring terminal members 7 made of Be-Cu and each having a width of 411 m and a thickness of 0.15 mm.
このように構成された実施例１．２の摺動接点装置と、
Ａｇ Ｐｄ３０〜５０接点材を有するすり接点を配線
板のＣｕ−樹脂の厚膜導体パターンと対向させて成る従
来の摺動接点装置とを、下記の試験条件にて摺動開閉試
験を行った処、下記の表に示すような結果を得たヶ
試験条件
接触カニ１０ｇ、動作二回転往復型（５５度）、駆動：
６０ストロ一ク／ｍｉｎ、通電： １２Ｖ、 １００ｍ
Ａ上記の表で明らかなように実施例１．２の摺動接点装
置は、従来例の慴動装置に比し、寿命が大概倍増してい
ることが判る。これはひとえにすり接点５のＡｇ−ＷＣ
４０〜８０％４ｔ％接点材の硬さが軟らかく滑りやすい
為、対向するＣｕ−樹脂系の厚膜導体パターン３を損耗
することが無く、又凝着、２１１離することが無く、摩
耗が減少し、更にＡｇ−ＷＣ４０〜３Ｑｗｔ％の接点材
の電気伝導度が良好で発熱することが無いからである。The sliding contact device of Example 1.2 configured in this way,
A sliding opening/closing test was conducted under the following test conditions on a conventional sliding contact device consisting of a sliding contact having a contact material of 30 to 50 AgPd facing a thick film conductor pattern made of Cu-resin on a wiring board. , the results shown in the table below were obtained.Test conditions: Contact crab 10g, action 2 rotation reciprocating type (55 degrees), drive:
60 strokes/min, current: 12V, 100m
A: As is clear from the above table, the life of the sliding contact device of Example 1.2 is almost twice as long as that of the conventional sliding contact device. This is just Ag-WC with sliding contact 5.
40~80% 4t% Since the hardness of the contact material is soft and slippery, there is no damage to the opposing Cu-resin thick film conductor pattern 3, and there is no adhesion or separation, reducing wear. Furthermore, the electrical conductivity of the contact material containing 40 to 3 Qwt% of Ag-WC is good and no heat is generated.
尚、前記の寿命は、厚膜導体パターン３の摩耗により、
すり接点５がＡｌ１ｚＯ３基板との接触となって、オー
プン状Ｂ（接触抵抗無限大）となった場合と、厚膜導体
パターン３間のスリット部の目詰まりによりショートし
た場合で判定した。Note that the above-mentioned lifespan is due to wear of the thick film conductor pattern 3.
The judgment was made based on the case where the sliding contact 5 came into contact with the Al1zO3 substrate and became an open state B (infinite contact resistance), and the case where a short circuit occurred due to clogging of the slit between the thick film conductor patterns 3.
尚、上記実施例の摺動接点装置の配線板４は円形である
が、矩形でも良いものである。その場合、厚膜抵抗パタ
ーンは矩形の配線板の一側端に形成し、厚膜導体パター
ンは厚膜抵抗パターンに接続してその長手方向に一定間
隔に平行に形成すると良い。そしてすり接点は厚膜導体
パターンに対向して厚膜抵抗パターンの長手方向に摺動
し得るようにする。またセラミックス基板上にベローズ
形状に前後に往復させた厚膜抵抗パターンを形成し、そ
の上に厚膜導体パターンを一定間隔に並べて形成した配
線板と、この配線板の厚膜導体パターンに対向して摺動
するようにしたすり接点とより成る摺動接点装置として
も良い。Although the wiring board 4 of the sliding contact device in the above embodiment is circular, it may also be rectangular. In that case, the thick film resistor pattern is preferably formed at one end of the rectangular wiring board, and the thick film conductor patterns are preferably connected to the thick film resistor pattern and formed in parallel at regular intervals in the longitudinal direction thereof. The sliding contact is slidable in the longitudinal direction of the thick film resistor pattern, facing the thick film conductor pattern. In addition, a thick film resistor pattern is formed in a bellows shape and reciprocated back and forth on a ceramic substrate, and a wiring board is formed on which thick film conductor patterns are arranged at regular intervals, and the wiring board faces the thick film conductor patterns. It is also possible to use a sliding contact device consisting of a sliding contact that is slidable.
（発明の効果）
以上の説明で判るように本発明の摺動接点装置は、すり
接点のＡｇ ＷＣ４０〜８０ｗｔ％が硬さくＩＩＶ１
００〜１５０）が軟らかく滑りやすいので、接触作用に
おいてセラミックス基板上のＣｕ−樹脂系厚膜導体パタ
ーンが損耗することが無（、又凝着、剥離が殆んど無く
なり、摩耗が減少するので、良好な接触が得られる。(Effects of the Invention) As can be seen from the above explanation, the sliding contact device of the present invention has a sliding contact in which 40 to 80 wt% of Ag WC is hard and IIV1
00 to 150) is soft and slippery, so the Cu-resin thick film conductor pattern on the ceramic substrate is not worn out during contact action (also, adhesion and peeling are almost eliminated, reducing wear). Good contact can be obtained.
従って、接触信顧性が向上し、摺動接点装置の寿命が著
しく増長する。更にすり接点のＡ ｇ −ＷＣ４０〜８
０−ｔ％接点材の電気伝導度が良好であるので、接触作
用において、発熱せず、溶着が起こりにくい。従って、
摺動接点装置の耐溶着性が著しく向上する。Therefore, contact reliability is improved and the life of the sliding contact device is significantly extended. Furthermore, the sliding contact A g -WC40~8
Since the electrical conductivity of the 0-t% contact material is good, no heat is generated during contact action, and welding is less likely to occur. Therefore,
The welding resistance of the sliding contact device is significantly improved.
図は本発明の摺動接点装置の一実施例を示す概略斜視図
である。The figure is a schematic perspective view showing an embodiment of the sliding contact device of the present invention.
Claims (1)
抵抗パターンを形成し、この厚膜抵抗パターンに接続し
てＣｕ−樹脂系導体ペーストを硬化して厚膜導体パター
ンを形成して成る配線板と、この配線板の厚膜導体パタ
ーンに対向して摺動し得るようになされＡｇ−ＷＣ４０
〜８０ｗｔ％の接点材がスプリング端子材に取り付けら
れて成るすり接点とにより構成されていることを特徴と
する摺動接点装置。A wiring board formed by firing a resistor paste to form a thick film resistor pattern on a ceramic substrate, and connecting the thick film resistor pattern to harden a Cu-resin conductor paste to form a thick film conductor pattern. , Ag-WC40 is made to be able to slide against the thick film conductor pattern of this wiring board.
A sliding contact device comprising a sliding contact in which ~80wt% of contact material is attached to a spring terminal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62028480A JPS63196010A (en) | 1987-02-10 | 1987-02-10 | Slide contactor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62028480A JPS63196010A (en) | 1987-02-10 | 1987-02-10 | Slide contactor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63196010A true JPS63196010A (en) | 1988-08-15 |
Family
ID=12249818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62028480A Pending JPS63196010A (en) | 1987-02-10 | 1987-02-10 | Slide contactor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63196010A (en) |
-
1987
- 1987-02-10 JP JP62028480A patent/JPS63196010A/en active Pending
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