JPS6313346B2 - - Google Patents

Info

Publication number
JPS6313346B2
JPS6313346B2 JP13193481A JP13193481A JPS6313346B2 JP S6313346 B2 JPS6313346 B2 JP S6313346B2 JP 13193481 A JP13193481 A JP 13193481A JP 13193481 A JP13193481 A JP 13193481A JP S6313346 B2 JPS6313346 B2 JP S6313346B2
Authority
JP
Japan
Prior art keywords
layer
convex portion
forming
wiring body
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13193481A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5833853A (ja
Inventor
Tadashi Kirisako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13193481A priority Critical patent/JPS5833853A/ja
Publication of JPS5833853A publication Critical patent/JPS5833853A/ja
Publication of JPS6313346B2 publication Critical patent/JPS6313346B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP13193481A 1981-08-21 1981-08-21 半導体装置の製造方法 Granted JPS5833853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13193481A JPS5833853A (ja) 1981-08-21 1981-08-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13193481A JPS5833853A (ja) 1981-08-21 1981-08-21 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5833853A JPS5833853A (ja) 1983-02-28
JPS6313346B2 true JPS6313346B2 (enrdf_load_stackoverflow) 1988-03-25

Family

ID=15069623

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13193481A Granted JPS5833853A (ja) 1981-08-21 1981-08-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5833853A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195845A (ja) * 1983-04-21 1984-11-07 Toshiba Corp 多層配線の製造方法
JPS60110141A (ja) * 1983-11-18 1985-06-15 Matsushita Electronics Corp 層間接続配線層の製造方法
JPH027470A (ja) * 1988-06-27 1990-01-11 Toshiba Corp 化合物半導体装置の電極配線構造
JPH0230137A (ja) * 1988-07-19 1990-01-31 Nec Corp 半導体装置の配線形成方法

Also Published As

Publication number Publication date
JPS5833853A (ja) 1983-02-28

Similar Documents

Publication Publication Date Title
JPH027544A (ja) 柱の整合及び製造工程
JPS6313346B2 (enrdf_load_stackoverflow)
JPS6313347B2 (enrdf_load_stackoverflow)
JPH0669351A (ja) 多層金属配線構造のコンタクトの製造方法
JPH09199587A (ja) 半導体装置
JP2637726B2 (ja) 半導体集積回路装置の製造方法
JPS6134956A (ja) 配線層の形成方法
JPS6254427A (ja) 半導体装置の製造方法
JPH0478141A (ja) 半導体装置の製造方法
JPH0587973B2 (enrdf_load_stackoverflow)
JPH0661354A (ja) 半導体装置の製造方法
JP2538245Y2 (ja) 半導体装置
JPH0330295B2 (enrdf_load_stackoverflow)
JPH079933B2 (ja) 半導体装置の製造方法
JPS6355784B2 (enrdf_load_stackoverflow)
JPH0474430A (ja) 半導体装置
JPS61259540A (ja) 多層配線の製造方法
JPH05175342A (ja) 半導体装置の製造方法
JPS6255701B2 (enrdf_load_stackoverflow)
JPH0425157A (ja) 半導体装置の製造方法
JPH0555217A (ja) 半導体装置の製造方法
JPH03248533A (ja) 半導体集積回路装置
JPS6235537A (ja) 半導体装置及びその製造方法
JPS61114559A (ja) 半導体装置
JPS59163838A (ja) 半導体装置の製造方法