JPS6255701B2 - - Google Patents
Info
- Publication number
- JPS6255701B2 JPS6255701B2 JP55033648A JP3364880A JPS6255701B2 JP S6255701 B2 JPS6255701 B2 JP S6255701B2 JP 55033648 A JP55033648 A JP 55033648A JP 3364880 A JP3364880 A JP 3364880A JP S6255701 B2 JPS6255701 B2 JP S6255701B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- wiring
- insulating film
- wiring body
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3364880A JPS56130951A (en) | 1980-03-17 | 1980-03-17 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3364880A JPS56130951A (en) | 1980-03-17 | 1980-03-17 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56130951A JPS56130951A (en) | 1981-10-14 |
JPS6255701B2 true JPS6255701B2 (enrdf_load_stackoverflow) | 1987-11-20 |
Family
ID=12392261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3364880A Granted JPS56130951A (en) | 1980-03-17 | 1980-03-17 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56130951A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60261156A (ja) * | 1984-06-08 | 1985-12-24 | Nippon Telegr & Teleph Corp <Ntt> | 多層配線の形成法 |
EP0175604B1 (en) * | 1984-08-23 | 1989-07-19 | Fairchild Semiconductor Corporation | A process for forming vias on integrated circuits |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4835778A (enrdf_load_stackoverflow) * | 1971-09-09 | 1973-05-26 |
-
1980
- 1980-03-17 JP JP3364880A patent/JPS56130951A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56130951A (en) | 1981-10-14 |
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