JPS56130951A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56130951A
JPS56130951A JP3364880A JP3364880A JPS56130951A JP S56130951 A JPS56130951 A JP S56130951A JP 3364880 A JP3364880 A JP 3364880A JP 3364880 A JP3364880 A JP 3364880A JP S56130951 A JPS56130951 A JP S56130951A
Authority
JP
Japan
Prior art keywords
film
wiring layer
projection
insulating layer
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3364880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6255701B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Tokunaga
Ryoji Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3364880A priority Critical patent/JPS56130951A/ja
Publication of JPS56130951A publication Critical patent/JPS56130951A/ja
Publication of JPS6255701B2 publication Critical patent/JPS6255701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP3364880A 1980-03-17 1980-03-17 Manufacture of semiconductor device Granted JPS56130951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3364880A JPS56130951A (en) 1980-03-17 1980-03-17 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3364880A JPS56130951A (en) 1980-03-17 1980-03-17 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56130951A true JPS56130951A (en) 1981-10-14
JPS6255701B2 JPS6255701B2 (enrdf_load_stackoverflow) 1987-11-20

Family

ID=12392261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3364880A Granted JPS56130951A (en) 1980-03-17 1980-03-17 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56130951A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261156A (ja) * 1984-06-08 1985-12-24 Nippon Telegr & Teleph Corp <Ntt> 多層配線の形成法
JPS61112356A (ja) * 1984-08-23 1986-05-30 フエアチアイルド　カメラ　アンド　インストルメント　コ−ポレ−シヨン 集積回路に貫通導体を形成する方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835778A (enrdf_load_stackoverflow) * 1971-09-09 1973-05-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835778A (enrdf_load_stackoverflow) * 1971-09-09 1973-05-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261156A (ja) * 1984-06-08 1985-12-24 Nippon Telegr & Teleph Corp <Ntt> 多層配線の形成法
JPS61112356A (ja) * 1984-08-23 1986-05-30 フエアチアイルド　カメラ　アンド　インストルメント　コ−ポレ−シヨン 集積回路に貫通導体を形成する方法

Also Published As

Publication number Publication date
JPS6255701B2 (enrdf_load_stackoverflow) 1987-11-20

Similar Documents

Publication Publication Date Title
JPS57176746A (en) Semiconductor integrated circuit and manufacture thereof
JPS55163860A (en) Manufacture of semiconductor device
JPS56130951A (en) Manufacture of semiconductor device
JPS57145340A (en) Manufacture of semiconductor device
JPS56165339A (en) Semiconductor device
JPS54158884A (en) Manufacture of semiconductor device
JPS56161656A (en) Manufacture of semiconductor device
JPS56130925A (en) Manufacture of semiconductor device
JPS5568655A (en) Manufacturing method of wiring
GB1102832A (en) Improvements in or relating to the manufacture of thin film modules
JPS568834A (en) Manufacture of projection for substrate conductor layer
JPS57167659A (en) Manufacture of semiconductor device
JPS5732654A (en) Semiconductor integrated circuit device
JPS56138942A (en) Manufacture of semiconductor device
JPS56130947A (en) Manufacture of semiconductor device
JPS5649541A (en) Multilayer wiring structure for integrated circuit
JPS57159040A (en) Manufacture of semiconductor device
JPS57184232A (en) Manufacture of semiconductor device
JPS5710249A (en) Manufacture of semiconductor device
JPS56104450A (en) Manufacture of semiconductor device
JPS5759356A (en) Structure of multilayer wiring
JPS5648151A (en) Wiring formation of semiconductor device
JPS572545A (en) Manufacture of semiconductor device
JPS57208160A (en) Semiconductor device
JPS575329A (en) Manufacture of semiconductor device