JPS56138942A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS56138942A
JPS56138942A JP4167680A JP4167680A JPS56138942A JP S56138942 A JPS56138942 A JP S56138942A JP 4167680 A JP4167680 A JP 4167680A JP 4167680 A JP4167680 A JP 4167680A JP S56138942 A JPS56138942 A JP S56138942A
Authority
JP
Japan
Prior art keywords
metal
layer
hole part
wire
increase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4167680A
Other languages
Japanese (ja)
Inventor
Hideto Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4167680A priority Critical patent/JPS56138942A/en
Publication of JPS56138942A publication Critical patent/JPS56138942A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To increase the thickness of an insulating film and prevent improper stepwise disconnection of multilayer wire by burying through-hole part with metal. CONSTITUTION:After an oxide film 2 is formed on a semiconductor substrate 1 on which necessary impurity diffused layer or the like is formed, the first layer wire metal pattern 3 is formed thereon, polyimide resin 4 is further formed thereon, and a through hole is formed by etching. Thereafter, metal 8 is plated on the through hole part. Subsequently, the second layer wire metal 6 is formed by a technique of vacuum evaporation, and a photoresist for patterning is formed. Then, the second layer metal 6 is patterned, then the phtotoresist is removed, and the multilayer wire is completed. Thus, it can prevent the stepwise disconnection of the through hole part step, the improper contact of the wiring layers, the deterioration of high frequency characteristics due to the increase in the static capacity or the like.
JP4167680A 1980-03-31 1980-03-31 Manufacture of semiconductor device Pending JPS56138942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4167680A JPS56138942A (en) 1980-03-31 1980-03-31 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4167680A JPS56138942A (en) 1980-03-31 1980-03-31 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS56138942A true JPS56138942A (en) 1981-10-29

Family

ID=12615009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4167680A Pending JPS56138942A (en) 1980-03-31 1980-03-31 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56138942A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057648A (en) * 1983-09-07 1985-04-03 Mitsubishi Electric Corp Formation of metallic wiring pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057648A (en) * 1983-09-07 1985-04-03 Mitsubishi Electric Corp Formation of metallic wiring pattern

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