JPS63114226A - 外側リ−ドテ−プ自動接着方式 - Google Patents

外側リ−ドテ−プ自動接着方式

Info

Publication number
JPS63114226A
JPS63114226A JP62214115A JP21411587A JPS63114226A JP S63114226 A JPS63114226 A JP S63114226A JP 62214115 A JP62214115 A JP 62214115A JP 21411587 A JP21411587 A JP 21411587A JP S63114226 A JPS63114226 A JP S63114226A
Authority
JP
Japan
Prior art keywords
tape
lead
substrate
support ring
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62214115A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0454379B2 (cg-RX-API-DMAC10.html
Inventor
ディヴィッド　エル　ハローウェル
ジョン　ダブリュー　ソフィア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Equipment Corp
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Publication of JPS63114226A publication Critical patent/JPS63114226A/ja
Publication of JPH0454379B2 publication Critical patent/JPH0454379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H10W72/071—
    • H10W70/453—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H10W72/077—
    • H10W72/701—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Cable Accessories (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP62214115A 1986-08-27 1987-08-27 外側リ−ドテ−プ自動接着方式 Granted JPS63114226A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US90078986A 1986-08-27 1986-08-27
US900789 1986-08-27

Publications (2)

Publication Number Publication Date
JPS63114226A true JPS63114226A (ja) 1988-05-19
JPH0454379B2 JPH0454379B2 (cg-RX-API-DMAC10.html) 1992-08-31

Family

ID=25413083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214115A Granted JPS63114226A (ja) 1986-08-27 1987-08-27 外側リ−ドテ−プ自動接着方式

Country Status (10)

Country Link
EP (1) EP0259222B1 (cg-RX-API-DMAC10.html)
JP (1) JPS63114226A (cg-RX-API-DMAC10.html)
KR (1) KR880003422A (cg-RX-API-DMAC10.html)
CN (1) CN87106380A (cg-RX-API-DMAC10.html)
AT (1) ATE87397T1 (cg-RX-API-DMAC10.html)
AU (1) AU596443B2 (cg-RX-API-DMAC10.html)
BR (1) BR8705103A (cg-RX-API-DMAC10.html)
CA (1) CA1281435C (cg-RX-API-DMAC10.html)
DE (1) DE3784987T2 (cg-RX-API-DMAC10.html)
IN (1) IN171404B (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113257769A (zh) * 2020-02-10 2021-08-13 台达电子工业股份有限公司 封装结构

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761880A (en) * 1986-12-08 1988-08-09 International Business Machines Corporation Method of obtaining surface mount component planarity
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
US5099392A (en) * 1990-04-02 1992-03-24 Hewlett-Packard Company Tape-automated bonding frame adapter system
GB9018764D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Packaging of electronic devices
GB2257827B (en) * 1991-07-17 1995-05-03 Lsi Logic Europ Support for semiconductor bond wires
US5532934A (en) * 1992-07-17 1996-07-02 Lsi Logic Corporation Floorplanning technique using multi-partitioning based on a partition cost factor for non-square shaped partitions
US5340772A (en) * 1992-07-17 1994-08-23 Lsi Logic Corporation Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die
US5561086A (en) * 1993-06-18 1996-10-01 Lsi Logic Corporation Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
JPH07101699B2 (ja) * 1993-09-29 1995-11-01 インターナショナル・ビジネス・マシーンズ・コーポレイション 印刷回路基板及び液晶表示装置
US6334765B1 (en) * 1998-10-21 2002-01-01 Engel Maschinenbau Gesellschaft M.B.H. Injection molding machine having a C-form frame

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0016522B1 (en) * 1979-02-19 1982-12-22 Fujitsu Limited Semiconductor device and method for manufacturing the same
US4466183A (en) * 1982-05-03 1984-08-21 National Semiconductor Corporation Integrated circuit packaging process
DE3219055A1 (de) * 1982-05-21 1983-11-24 Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt Verfahren zur herstellung eines filmtraegers mit leiterstrukturen
US4571354A (en) * 1983-12-27 1986-02-18 Rogers Corporation Tape automated bonding of integrated circuits
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
EP0213014B1 (en) * 1985-07-23 1990-09-19 Fairchild Semiconductor Corporation Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156560A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Semiconductor device and its production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113257769A (zh) * 2020-02-10 2021-08-13 台达电子工业股份有限公司 封装结构

Also Published As

Publication number Publication date
JPH0454379B2 (cg-RX-API-DMAC10.html) 1992-08-31
DE3784987D1 (de) 1993-04-29
AU596443B2 (en) 1990-05-03
KR880003422A (ko) 1988-05-17
EP0259222A3 (en) 1988-09-07
AU7743487A (en) 1988-03-03
ATE87397T1 (de) 1993-04-15
DE3784987T2 (de) 1993-10-14
IN171404B (cg-RX-API-DMAC10.html) 1992-10-03
CN87106380A (zh) 1988-06-08
EP0259222B1 (en) 1993-03-24
CA1281435C (en) 1991-03-12
BR8705103A (pt) 1988-04-26
EP0259222A2 (en) 1988-03-09

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