JPS63110697A - 多層金属構造体 - Google Patents

多層金属構造体

Info

Publication number
JPS63110697A
JPS63110697A JP62195440A JP19544087A JPS63110697A JP S63110697 A JPS63110697 A JP S63110697A JP 62195440 A JP62195440 A JP 62195440A JP 19544087 A JP19544087 A JP 19544087A JP S63110697 A JPS63110697 A JP S63110697A
Authority
JP
Japan
Prior art keywords
layer
polyimide
substrate
multilayer
zirconium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62195440A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214796B2 (enExample
Inventor
ジャンジイル・キム
ウォルター・フレデリック・レンジ
ダーユン・シー
シャレー・シャウール・ウェン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS63110697A publication Critical patent/JPS63110697A/ja
Publication of JPH0214796B2 publication Critical patent/JPH0214796B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/66—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12743—Next to refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP62195440A 1986-10-16 1987-08-06 多層金属構造体 Granted JPS63110697A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/919,530 US4751349A (en) 1986-10-16 1986-10-16 Zirconium as an adhesion material in a multi-layer metallic structure
US919530 1986-10-16

Publications (2)

Publication Number Publication Date
JPS63110697A true JPS63110697A (ja) 1988-05-16
JPH0214796B2 JPH0214796B2 (enExample) 1990-04-10

Family

ID=25442258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62195440A Granted JPS63110697A (ja) 1986-10-16 1987-08-06 多層金属構造体

Country Status (4)

Country Link
US (1) US4751349A (enExample)
EP (1) EP0264134B1 (enExample)
JP (1) JPS63110697A (enExample)
DE (1) DE3781234D1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04349690A (ja) * 1991-05-27 1992-12-04 Kyocera Corp 回路基板
JP2014185636A (ja) * 2013-02-15 2014-10-02 Alstom Technology Ltd 耐エロージョン性及び耐コロージョン性のコーティング系を備えるターボ機械部品並びに当該ターボ機械部品の製造方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847445A (en) * 1985-02-01 1989-07-11 Tektronix, Inc. Zirconium thin-film metal conductor systems
JPH0732158B2 (ja) * 1988-04-08 1995-04-10 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 電子部品のための多層金属構造
US5183973A (en) * 1989-08-14 1993-02-02 Santa Barbara Research Center Flexible cable for interconnecting electronic components
US5436412A (en) * 1992-10-30 1995-07-25 International Business Machines Corporation Interconnect structure having improved metallization
JP4428832B2 (ja) * 1999-08-27 2010-03-10 富士通株式会社 金属配線構造、半導体装置及び半導体装置の製造方法
US6800815B1 (en) * 2001-01-16 2004-10-05 National Semiconductor Corporation Materials and structure for a high reliability bga connection between LTCC and PB boards
JP4448702B2 (ja) * 2004-01-30 2010-04-14 日東電工株式会社 回路付サスペンション基板の製造方法
KR100857365B1 (ko) * 2007-02-28 2008-09-05 주식회사 네패스 반도체 장치의 범프 구조물
US10453817B1 (en) * 2018-06-18 2019-10-22 Texas Instruments Incorporated Zinc-cobalt barrier for interface in solder bond applications
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838112A (enExample) * 1971-09-10 1973-06-05
JPS5212030A (en) * 1975-07-16 1977-01-29 Nippon Telegraph & Telephone Serial printing system

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2857663A (en) * 1954-02-09 1958-10-28 Gen Electric Metallic bond
US3379568A (en) * 1964-12-21 1968-04-23 North American Rockwell Process for forming holes and multilayer interconnections through a dielectric
US3423821A (en) * 1965-03-18 1969-01-28 Hitachi Ltd Method of producing thin film integrated circuits
US3461524A (en) * 1966-11-02 1969-08-19 Bell Telephone Labor Inc Method for making closely spaced conductive layers
US3621442A (en) * 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
US3798011A (en) * 1969-01-31 1974-03-19 Du Pont Multilayered metal composite
FR2041392A5 (enExample) * 1969-04-23 1971-01-29 Cii
US3647585A (en) * 1969-05-23 1972-03-07 Bell Telephone Labor Inc Method of eliminating pinhole shorts in an air-isolated crossover
GB1248142A (en) * 1969-06-20 1971-09-29 Decca Ltd Improvements in or relating to electrical circuits assemblies
US4042753A (en) * 1972-09-22 1977-08-16 Imperial Chemical Industries Limited Composite conductor
US4016050A (en) * 1975-05-12 1977-04-05 Bell Telephone Laboratories, Incorporated Conduction system for thin film and hybrid integrated circuits
US4153518A (en) * 1977-11-18 1979-05-08 Tektronix, Inc. Method of making a metalized substrate having a thin film barrier layer
DE3136198A1 (de) * 1981-01-15 1982-08-05 Robert Bosch Gmbh, 7000 Stuttgart "elektronische duennschichtschaltung"
JPS59167096A (ja) * 1983-03-11 1984-09-20 日本電気株式会社 回路基板
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
US4847445A (en) * 1985-02-01 1989-07-11 Tektronix, Inc. Zirconium thin-film metal conductor systems

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838112A (enExample) * 1971-09-10 1973-06-05
JPS5212030A (en) * 1975-07-16 1977-01-29 Nippon Telegraph & Telephone Serial printing system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04349690A (ja) * 1991-05-27 1992-12-04 Kyocera Corp 回路基板
JP2014185636A (ja) * 2013-02-15 2014-10-02 Alstom Technology Ltd 耐エロージョン性及び耐コロージョン性のコーティング系を備えるターボ機械部品並びに当該ターボ機械部品の製造方法

Also Published As

Publication number Publication date
EP0264134A2 (en) 1988-04-20
EP0264134B1 (en) 1992-08-19
JPH0214796B2 (enExample) 1990-04-10
EP0264134A3 (en) 1988-09-21
US4751349A (en) 1988-06-14
DE3781234D1 (de) 1992-09-24

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