JPS6258306B2 - - Google Patents
Info
- Publication number
- JPS6258306B2 JPS6258306B2 JP55097940A JP9794080A JPS6258306B2 JP S6258306 B2 JPS6258306 B2 JP S6258306B2 JP 55097940 A JP55097940 A JP 55097940A JP 9794080 A JP9794080 A JP 9794080A JP S6258306 B2 JPS6258306 B2 JP S6258306B2
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- opening
- lid
- contents
- closing lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 4
- 239000002537 cosmetic Substances 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 229940079593 drug Drugs 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- LGXVIGDEPROXKC-UHFFFAOYSA-N 1,1-dichloroethene Chemical compound ClC(Cl)=C LGXVIGDEPROXKC-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000003000 inclusion body Anatomy 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 235000019640 taste Nutrition 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Making Paper Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9794080A JPS5722041A (en) | 1980-07-17 | 1980-07-17 | Manufacture of enclosing bag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9794080A JPS5722041A (en) | 1980-07-17 | 1980-07-17 | Manufacture of enclosing bag |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5722041A JPS5722041A (en) | 1982-02-04 |
| JPS6258306B2 true JPS6258306B2 (US07922777-20110412-C00004.png) | 1987-12-04 |
Family
ID=14205655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9794080A Granted JPS5722041A (en) | 1980-07-17 | 1980-07-17 | Manufacture of enclosing bag |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5722041A (US07922777-20110412-C00004.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2639904B1 (fr) * | 1988-12-01 | 1991-07-05 | Marion Louis | Procede et moyens d'ensachage de plusieurs compresses, ainsi que le sachet obtenu |
| JP4845461B2 (ja) * | 2004-09-14 | 2011-12-28 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
| US8698262B2 (en) | 2004-09-14 | 2014-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Wireless chip and manufacturing method of the same |
| JP4088653B2 (ja) | 2005-09-29 | 2008-05-21 | 憲司 中村 | ウェットシート包装体 |
-
1980
- 1980-07-17 JP JP9794080A patent/JPS5722041A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5722041A (en) | 1982-02-04 |
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