JPS6258146B2 - - Google Patents

Info

Publication number
JPS6258146B2
JPS6258146B2 JP54095277A JP9527779A JPS6258146B2 JP S6258146 B2 JPS6258146 B2 JP S6258146B2 JP 54095277 A JP54095277 A JP 54095277A JP 9527779 A JP9527779 A JP 9527779A JP S6258146 B2 JPS6258146 B2 JP S6258146B2
Authority
JP
Japan
Prior art keywords
protrusion
lead terminal
contact area
lead
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54095277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5619632A (en
Inventor
Aryoshi Aota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP9527779A priority Critical patent/JPS5619632A/ja
Publication of JPS5619632A publication Critical patent/JPS5619632A/ja
Publication of JPS6258146B2 publication Critical patent/JPS6258146B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP9527779A 1979-07-26 1979-07-26 Lead terminal Granted JPS5619632A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9527779A JPS5619632A (en) 1979-07-26 1979-07-26 Lead terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9527779A JPS5619632A (en) 1979-07-26 1979-07-26 Lead terminal

Publications (2)

Publication Number Publication Date
JPS5619632A JPS5619632A (en) 1981-02-24
JPS6258146B2 true JPS6258146B2 (enExample) 1987-12-04

Family

ID=14133271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9527779A Granted JPS5619632A (en) 1979-07-26 1979-07-26 Lead terminal

Country Status (1)

Country Link
JP (1) JPS5619632A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11226301B2 (en) 2014-09-10 2022-01-18 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Thermographic examination means and method for non-destructive examination of a near-surface structure at a test object

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01186662A (ja) * 1988-01-14 1989-07-26 Mitsui High Tec Inc 半導体装置用リードフレーム
US8384228B1 (en) * 2009-04-29 2013-02-26 Triquint Semiconductor, Inc. Package including wires contacting lead frame edge

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5261480A (en) * 1975-11-17 1977-05-20 Seiko Instr & Electronics Ltd Production of lead frame for ic
JPS575887Y2 (enExample) * 1976-08-23 1982-02-03
JPS5348463A (en) * 1976-10-14 1978-05-01 Hamasawa Kogyo:Kk Semiconductor integrated circuit support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11226301B2 (en) 2014-09-10 2022-01-18 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Thermographic examination means and method for non-destructive examination of a near-surface structure at a test object

Also Published As

Publication number Publication date
JPS5619632A (en) 1981-02-24

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