JPS5619632A - Lead terminal - Google Patents
Lead terminalInfo
- Publication number
- JPS5619632A JPS5619632A JP9527779A JP9527779A JPS5619632A JP S5619632 A JPS5619632 A JP S5619632A JP 9527779 A JP9527779 A JP 9527779A JP 9527779 A JP9527779 A JP 9527779A JP S5619632 A JPS5619632 A JP S5619632A
- Authority
- JP
- Japan
- Prior art keywords
- projection
- lead wire
- lead terminal
- time
- bonding therebetween
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9527779A JPS5619632A (en) | 1979-07-26 | 1979-07-26 | Lead terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9527779A JPS5619632A (en) | 1979-07-26 | 1979-07-26 | Lead terminal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5619632A true JPS5619632A (en) | 1981-02-24 |
JPS6258146B2 JPS6258146B2 (ja) | 1987-12-04 |
Family
ID=14133271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9527779A Granted JPS5619632A (en) | 1979-07-26 | 1979-07-26 | Lead terminal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5619632A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01186662A (ja) * | 1988-01-14 | 1989-07-26 | Mitsui High Tec Inc | 半導体装置用リードフレーム |
US8384228B1 (en) * | 2009-04-29 | 2013-02-26 | Triquint Semiconductor, Inc. | Package including wires contacting lead frame edge |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014218136B4 (de) | 2014-09-10 | 2019-07-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Thermographische Untersuchungseinrichtung sowie Verfahren zur zerstörungsfreien Untersuchung einer oberflächennahen Struktur an einem Prüfobjekt |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5261480A (en) * | 1975-11-17 | 1977-05-20 | Seiko Instr & Electronics Ltd | Production of lead frame for ic |
JPS5330873U (ja) * | 1976-08-23 | 1978-03-16 | ||
JPS5348463A (en) * | 1976-10-14 | 1978-05-01 | Hamasawa Kogyo:Kk | Semiconductor integrated circuit support |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5164183A (ja) * | 1974-11-29 | 1976-06-03 | Tokyo Shibaura Electric Co | Ichigimesochi |
-
1979
- 1979-07-26 JP JP9527779A patent/JPS5619632A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5261480A (en) * | 1975-11-17 | 1977-05-20 | Seiko Instr & Electronics Ltd | Production of lead frame for ic |
JPS5330873U (ja) * | 1976-08-23 | 1978-03-16 | ||
JPS5348463A (en) * | 1976-10-14 | 1978-05-01 | Hamasawa Kogyo:Kk | Semiconductor integrated circuit support |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01186662A (ja) * | 1988-01-14 | 1989-07-26 | Mitsui High Tec Inc | 半導体装置用リードフレーム |
US8384228B1 (en) * | 2009-04-29 | 2013-02-26 | Triquint Semiconductor, Inc. | Package including wires contacting lead frame edge |
Also Published As
Publication number | Publication date |
---|---|
JPS6258146B2 (ja) | 1987-12-04 |
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