JPS5745957A - Circuit substrate and manufacture thereof - Google Patents

Circuit substrate and manufacture thereof

Info

Publication number
JPS5745957A
JPS5745957A JP12190780A JP12190780A JPS5745957A JP S5745957 A JPS5745957 A JP S5745957A JP 12190780 A JP12190780 A JP 12190780A JP 12190780 A JP12190780 A JP 12190780A JP S5745957 A JPS5745957 A JP S5745957A
Authority
JP
Japan
Prior art keywords
al2o3
recess
wire
wires
aluminum substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12190780A
Other languages
Japanese (ja)
Inventor
Isamu Kitahiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12190780A priority Critical patent/JPS5745957A/en
Publication of JPS5745957A publication Critical patent/JPS5745957A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To facilitate the connection of a wire by selectively forming an Al2O3 on the surface of an aluminum substrate to form a recess, containing a semiconductor part in the recess and forming a conductor wire on the Al2O3. CONSTITUTION:A mask 32 is formed on an aluminum substrate, is then anodized, an Al2O3 33 is formed, the mask 32 is then removed, the Al2O3 is etched with NaOH solution, and a recess 34 is formed. An Al2O3 36 is again formed on the inner wall of the recess as required. In this manner, a semiconductor part 31 is contained in the recess 22 formed on the aluminum substrate 21, is adhered at 32, and is connected at the connecting points 33a, 33b to conductor wires 24 respectively. Since the wires 24 on the surface of the substrate 21 and the upper surface of the part 31 become approximately flat with this configuration, the wire connecting work can be facilitated, and since only the wires are decreased in deflection, no wire contact accident occurs.
JP12190780A 1980-09-02 1980-09-02 Circuit substrate and manufacture thereof Pending JPS5745957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12190780A JPS5745957A (en) 1980-09-02 1980-09-02 Circuit substrate and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12190780A JPS5745957A (en) 1980-09-02 1980-09-02 Circuit substrate and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS5745957A true JPS5745957A (en) 1982-03-16

Family

ID=14822852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12190780A Pending JPS5745957A (en) 1980-09-02 1980-09-02 Circuit substrate and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5745957A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140047A (en) * 1984-07-31 1986-02-26 Hitachi Chem Co Ltd Package for mounting semiconductor element
JPS61287128A (en) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd Chip carrier for electron element
JPS61287129A (en) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd Chip carrier for electron element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140047A (en) * 1984-07-31 1986-02-26 Hitachi Chem Co Ltd Package for mounting semiconductor element
JPH0548628B2 (en) * 1984-07-31 1993-07-22 Hitachi Chemical Co Ltd
JPS61287128A (en) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd Chip carrier for electron element
JPS61287129A (en) * 1985-06-13 1986-12-17 Matsushita Electric Works Ltd Chip carrier for electron element
JPH053744B2 (en) * 1985-06-13 1993-01-18 Matsushita Electric Works Ltd

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