JPS6251493B2 - - Google Patents
Info
- Publication number
- JPS6251493B2 JPS6251493B2 JP57181945A JP18194582A JPS6251493B2 JP S6251493 B2 JPS6251493 B2 JP S6251493B2 JP 57181945 A JP57181945 A JP 57181945A JP 18194582 A JP18194582 A JP 18194582A JP S6251493 B2 JPS6251493 B2 JP S6251493B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- defoaming
- air bubbles
- molding resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57181945A JPS5969936A (ja) | 1982-10-15 | 1982-10-15 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57181945A JPS5969936A (ja) | 1982-10-15 | 1982-10-15 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5969936A JPS5969936A (ja) | 1984-04-20 |
| JPS6251493B2 true JPS6251493B2 (enExample) | 1987-10-30 |
Family
ID=16109624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57181945A Granted JPS5969936A (ja) | 1982-10-15 | 1982-10-15 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5969936A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3775081B2 (ja) * | 1998-11-27 | 2006-05-17 | 松下電器産業株式会社 | 半導体発光装置 |
| JP4223743B2 (ja) * | 2002-06-26 | 2009-02-12 | 光寶科技股▲分▼有限公司 | カラーセクションディスプレイユニットの製造方法 |
| JP2004267947A (ja) * | 2003-03-10 | 2004-09-30 | Tohoku Ricoh Co Ltd | 光触媒装置 |
| WO2007018039A1 (ja) | 2005-08-05 | 2007-02-15 | Matsushita Electric Industrial Co., Ltd. | 半導体発光装置 |
-
1982
- 1982-10-15 JP JP57181945A patent/JPS5969936A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5969936A (ja) | 1984-04-20 |
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