JPS6244857B2 - - Google Patents
Info
- Publication number
- JPS6244857B2 JPS6244857B2 JP57037031A JP3703182A JPS6244857B2 JP S6244857 B2 JPS6244857 B2 JP S6244857B2 JP 57037031 A JP57037031 A JP 57037031A JP 3703182 A JP3703182 A JP 3703182A JP S6244857 B2 JPS6244857 B2 JP S6244857B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pin
- correction
- base
- comb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57037031A JPS58154253A (ja) | 1982-03-09 | 1982-03-09 | Icリ−ド矯正機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57037031A JPS58154253A (ja) | 1982-03-09 | 1982-03-09 | Icリ−ド矯正機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58154253A JPS58154253A (ja) | 1983-09-13 |
JPS6244857B2 true JPS6244857B2 (US20030220297A1-20031127-C00033.png) | 1987-09-22 |
Family
ID=12486261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57037031A Granted JPS58154253A (ja) | 1982-03-09 | 1982-03-09 | Icリ−ド矯正機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58154253A (US20030220297A1-20031127-C00033.png) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6298658U (US20030220297A1-20031127-C00033.png) * | 1985-12-11 | 1987-06-23 | ||
JPH0222964U (US20030220297A1-20031127-C00033.png) * | 1988-07-29 | 1990-02-15 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4481984A (en) * | 1982-03-29 | 1984-11-13 | American Tech Manufacturing Inc. | Electronic component lead straightening device and method |
JPS5936260U (ja) * | 1982-08-30 | 1984-03-07 | 日本電気ホームエレクトロニクス株式会社 | 電子部品のリ−ド修整装置 |
JPH06163782A (ja) * | 1992-11-17 | 1994-06-10 | Sanyo Silicon Denshi Kk | Icリードの曲り矯正装置 |
JP5632217B2 (ja) * | 2010-07-08 | 2014-11-26 | 矢崎総業株式会社 | コネクタのインサート成形方法 |
-
1982
- 1982-03-09 JP JP57037031A patent/JPS58154253A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6298658U (US20030220297A1-20031127-C00033.png) * | 1985-12-11 | 1987-06-23 | ||
JPH0222964U (US20030220297A1-20031127-C00033.png) * | 1988-07-29 | 1990-02-15 |
Also Published As
Publication number | Publication date |
---|---|
JPS58154253A (ja) | 1983-09-13 |
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