JPS6239821B2 - - Google Patents
Info
- Publication number
- JPS6239821B2 JPS6239821B2 JP56077396A JP7739681A JPS6239821B2 JP S6239821 B2 JPS6239821 B2 JP S6239821B2 JP 56077396 A JP56077396 A JP 56077396A JP 7739681 A JP7739681 A JP 7739681A JP S6239821 B2 JPS6239821 B2 JP S6239821B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- opening
- holder
- stacking tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 102
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7739681A JPS57192020A (en) | 1981-05-20 | 1981-05-20 | Stacking tool for thin plate body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7739681A JPS57192020A (en) | 1981-05-20 | 1981-05-20 | Stacking tool for thin plate body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57192020A JPS57192020A (en) | 1982-11-26 |
| JPS6239821B2 true JPS6239821B2 (pl) | 1987-08-25 |
Family
ID=13632727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7739681A Granted JPS57192020A (en) | 1981-05-20 | 1981-05-20 | Stacking tool for thin plate body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57192020A (pl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0261406U (pl) * | 1988-10-31 | 1990-05-08 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60106136A (ja) * | 1983-11-14 | 1985-06-11 | Mitsubishi Electric Corp | 薄板状体の洗浄装置 |
| JP2006286446A (ja) * | 2005-04-01 | 2006-10-19 | Matsushita Electric Ind Co Ltd | フレキシブルケーブルおよびフレキシブルケーブルの製造方法およびフレキシブルケーブルの形成方法ならびにフレキシブルケーブルに取り付けられる部品の固定方法 |
| ITUD20070202A1 (it) * | 2007-10-24 | 2009-04-25 | Baccini S P A | Contenitore per lo stoccaggio di piastre per circuiti elettronici e relativo procedimento |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53129974A (en) * | 1977-04-20 | 1978-11-13 | Hitachi Ltd | Palte form object transfer device |
| JPS5640656B2 (pl) * | 1973-12-11 | 1981-09-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5832266Y2 (ja) * | 1979-09-05 | 1983-07-18 | 三菱電機株式会社 | 薄板体の立替具 |
-
1981
- 1981-05-20 JP JP7739681A patent/JPS57192020A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5640656B2 (pl) * | 1973-12-11 | 1981-09-22 | ||
| JPS53129974A (en) * | 1977-04-20 | 1978-11-13 | Hitachi Ltd | Palte form object transfer device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0261406U (pl) * | 1988-10-31 | 1990-05-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57192020A (en) | 1982-11-26 |
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