JPS6232608B2 - - Google Patents
Info
- Publication number
- JPS6232608B2 JPS6232608B2 JP12854280A JP12854280A JPS6232608B2 JP S6232608 B2 JPS6232608 B2 JP S6232608B2 JP 12854280 A JP12854280 A JP 12854280A JP 12854280 A JP12854280 A JP 12854280A JP S6232608 B2 JPS6232608 B2 JP S6232608B2
- Authority
- JP
- Japan
- Prior art keywords
- transition layer
- layer
- gaas
- transition
- compound semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000007704 transition Effects 0.000 claims description 57
- 239000000758 substrate Substances 0.000 claims description 29
- 239000013078 crystal Substances 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 21
- 150000001875 compounds Chemical class 0.000 claims description 18
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 239000012535 impurity Substances 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 238000010276 construction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/0251—Graded layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02581—Transition metal or rare earth elements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Junction Field-Effect Transistors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12854280A JPS5753927A (en) | 1980-09-18 | 1980-09-18 | Compound semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12854280A JPS5753927A (en) | 1980-09-18 | 1980-09-18 | Compound semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5753927A JPS5753927A (en) | 1982-03-31 |
JPS6232608B2 true JPS6232608B2 (enrdf_load_stackoverflow) | 1987-07-15 |
Family
ID=14987327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12854280A Granted JPS5753927A (en) | 1980-09-18 | 1980-09-18 | Compound semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5753927A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220112011A (ko) * | 2021-02-03 | 2022-08-10 | 충북대학교 산학협력단 | 상향 가압형 고관절 탈구방지 예방의복 |
KR20220112012A (ko) * | 2021-02-03 | 2022-08-10 | 충북대학교 산학협력단 | 하향 가압형 고관절 탈구방지 예방의복 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4529455A (en) * | 1983-10-28 | 1985-07-16 | At&T Bell Laboratories | Method for epitaxially growing Gex Si1-x layers on Si utilizing molecular beam epitaxy |
US4514748A (en) * | 1983-11-21 | 1985-04-30 | At&T Bell Laboratories | Germanium p-i-n photodetector on silicon substrate |
JPS60231333A (ja) * | 1984-04-27 | 1985-11-16 | Sanyo Electric Co Ltd | 半導体構造 |
JPS61107721A (ja) * | 1984-10-31 | 1986-05-26 | Matsushita Electric Ind Co Ltd | 3−5化合物単結晶薄膜をそなえたSi基板およびその製造方法 |
JPS61107719A (ja) * | 1984-10-31 | 1986-05-26 | Matsushita Electric Ind Co Ltd | 3−5化合物単結晶薄膜をそなえたSi基板およびその製造方法 |
JPH0669113B2 (ja) * | 1986-04-23 | 1994-08-31 | 株式会社日立製作所 | 半導体レ−ザ装置 |
US5011550A (en) * | 1987-05-13 | 1991-04-30 | Sharp Kabushiki Kaisha | Laminated structure of compound semiconductors |
JPS63310111A (ja) * | 1987-06-12 | 1988-12-19 | Hitachi Cable Ltd | 化合物半導体ウェハ及びその製造方法 |
US5221413A (en) * | 1991-04-24 | 1993-06-22 | At&T Bell Laboratories | Method for making low defect density semiconductor heterostructure and devices made thereby |
JPH0567769A (ja) * | 1991-09-05 | 1993-03-19 | Sony Corp | 3次元光電子集積回路装置 |
-
1980
- 1980-09-18 JP JP12854280A patent/JPS5753927A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220112011A (ko) * | 2021-02-03 | 2022-08-10 | 충북대학교 산학협력단 | 상향 가압형 고관절 탈구방지 예방의복 |
KR20220112012A (ko) * | 2021-02-03 | 2022-08-10 | 충북대학교 산학협력단 | 하향 가압형 고관절 탈구방지 예방의복 |
Also Published As
Publication number | Publication date |
---|---|
JPS5753927A (en) | 1982-03-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4500388A (en) | Method for forming monocrystalline semiconductor film on insulating film | |
JP2516604B2 (ja) | 相補性mos集積回路装置の製造方法 | |
US4997787A (en) | Method for fabricating a semiconductor film which is electrically isolated from a substrate | |
JPS6232608B2 (enrdf_load_stackoverflow) | ||
US4292374A (en) | Sapphire single crystal substrate for semiconductor devices | |
US4568905A (en) | Magnetoelectric transducer | |
JPS5946414B2 (ja) | 化合物半導体装置 | |
JPH01722A (ja) | 半導体基材の製造方法 | |
JPS6232609B2 (enrdf_load_stackoverflow) | ||
JPS61189621A (ja) | 化合物半導体装置 | |
JPS5856322A (ja) | 半導体基板の製造方法 | |
JPH11233440A (ja) | 半導体装置 | |
JPS6353711B2 (enrdf_load_stackoverflow) | ||
JPH01143323A (ja) | 半導体素子 | |
EP0284434A2 (en) | Method of forming crystals | |
JPH04373121A (ja) | 結晶基材の製造方法 | |
JPH0435019A (ja) | 薄膜トランジスター | |
JPS62158314A (ja) | 化合物半導体単結晶薄膜用基板 | |
JP3246067B2 (ja) | 電界効果型トランジスタ用ウエハ及びトランジスタ | |
JP2592929B2 (ja) | 光電子集積回路の製造方法 | |
JPH01194315A (ja) | 炭化珪素半導体素子 | |
JPH0344937A (ja) | バイポーラトランジスタ及びその製造方法 | |
JPS59222923A (ja) | 半導体基板の製造方法 | |
JPS59191393A (ja) | 半導体装置 | |
JPH0810670B2 (ja) | 薄膜単結晶シリコン基板 |