JPS62296710A - 積層ブスバ−配線板の防水シ−ル方法 - Google Patents
積層ブスバ−配線板の防水シ−ル方法Info
- Publication number
- JPS62296710A JPS62296710A JP61136315A JP13631586A JPS62296710A JP S62296710 A JPS62296710 A JP S62296710A JP 61136315 A JP61136315 A JP 61136315A JP 13631586 A JP13631586 A JP 13631586A JP S62296710 A JPS62296710 A JP S62296710A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- busbar
- laminated
- organic solvent
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 19
- 238000007789 sealing Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003960 organic solvent Substances 0.000 claims description 20
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 210000003462 vein Anatomy 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004078 waterproofing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VOKIGVXCRFTUBE-UHFFFAOYSA-N C(=C)(Cl)Cl.CC(=O)CC Chemical compound C(=C)(Cl)Cl.CC(=O)CC VOKIGVXCRFTUBE-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- -1 ketone Vinyl chloride Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- RIOOIQBUNJDFON-UHFFFAOYSA-N methyl 2-methylprop-2-enoate oxolane Chemical compound O1CCCC1.COC(C(=C)C)=O RIOOIQBUNJDFON-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61136315A JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61136315A JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296710A true JPS62296710A (ja) | 1987-12-24 |
| JPH0357687B2 JPH0357687B2 (enrdf_load_stackoverflow) | 1991-09-03 |
Family
ID=15172334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61136315A Granted JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296710A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01116515U (enrdf_load_stackoverflow) * | 1988-01-28 | 1989-08-07 | ||
| JPH0274114A (ja) * | 1988-09-08 | 1990-03-14 | Yazaki Corp | ブスバー回路板およびその製造方法 |
-
1986
- 1986-06-13 JP JP61136315A patent/JPS62296710A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01116515U (enrdf_load_stackoverflow) * | 1988-01-28 | 1989-08-07 | ||
| JPH0274114A (ja) * | 1988-09-08 | 1990-03-14 | Yazaki Corp | ブスバー回路板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0357687B2 (enrdf_load_stackoverflow) | 1991-09-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |