JPH0357687B2 - - Google Patents
Info
- Publication number
- JPH0357687B2 JPH0357687B2 JP61136315A JP13631586A JPH0357687B2 JP H0357687 B2 JPH0357687 B2 JP H0357687B2 JP 61136315 A JP61136315 A JP 61136315A JP 13631586 A JP13631586 A JP 13631586A JP H0357687 B2 JPH0357687 B2 JP H0357687B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- busbar
- insulating
- laminated
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 35
- 239000003960 organic solvent Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 6
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000004078 waterproofing Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- VOKIGVXCRFTUBE-UHFFFAOYSA-N C(=C)(Cl)Cl.CC(=O)CC Chemical compound C(=C)(Cl)Cl.CC(=O)CC VOKIGVXCRFTUBE-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920005994 diacetyl cellulose Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- -1 ketone Vinyl chloride Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- RIOOIQBUNJDFON-UHFFFAOYSA-N methyl 2-methylprop-2-enoate oxolane Chemical compound O1CCCC1.COC(C(=C)C)=O RIOOIQBUNJDFON-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Connection Or Junction Boxes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61136315A JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61136315A JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62296710A JPS62296710A (ja) | 1987-12-24 |
JPH0357687B2 true JPH0357687B2 (enrdf_load_stackoverflow) | 1991-09-03 |
Family
ID=15172334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61136315A Granted JPS62296710A (ja) | 1986-06-13 | 1986-06-13 | 積層ブスバ−配線板の防水シ−ル方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62296710A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01116515U (enrdf_load_stackoverflow) * | 1988-01-28 | 1989-08-07 | ||
JP2561948B2 (ja) * | 1988-09-08 | 1996-12-11 | 矢崎総業株式会社 | ブスバ−回路板の製造方法 |
-
1986
- 1986-06-13 JP JP61136315A patent/JPS62296710A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62296710A (ja) | 1987-12-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR980006193A (ko) | 열적 개량된 플립 칩 패키지 및 그 제조 방법 | |
JPH0357687B2 (enrdf_load_stackoverflow) | ||
US6360438B1 (en) | Method of making an upper housing for a bussed electrical center | |
JP3300254B2 (ja) | 樹脂被覆実装基板及びその製造方法 | |
JPS62296709A (ja) | ジャンクションボックスの防水構造 | |
JPS59194496A (ja) | 電子部品の防水装置 | |
JPH0343804Y2 (enrdf_load_stackoverflow) | ||
JP3964555B2 (ja) | 電子機器の防水構造及び防水方法 | |
JPH066927A (ja) | 電気接続箱の防水シール方法 | |
JP2550991B2 (ja) | ピングリッドアレイ半導体モジュ−ル | |
JPH08125305A (ja) | メンブレン基板 | |
JP2563568B2 (ja) | プリント基板装置 | |
JPH0691325B2 (ja) | 防水性電子部品実装装置 | |
JPH0357054Y2 (enrdf_load_stackoverflow) | ||
JPH0357688B2 (enrdf_load_stackoverflow) | ||
JP2001339900A (ja) | 回転電機の端子接続構造 | |
JPH087775Y2 (ja) | 電気接続箱 | |
JPH0649062Y2 (ja) | 防水型配線接続箱 | |
JPH0575153U (ja) | 密閉構造筐体 | |
JPH0353550Y2 (enrdf_load_stackoverflow) | ||
JPH01303791A (ja) | 印刷配線基板及び印刷配線基板樹脂封止時の気泡発生防止方法 | |
JPH0353548Y2 (enrdf_load_stackoverflow) | ||
JPH0724898Y2 (ja) | 配線接続箱 | |
JPS637125A (ja) | 配線接続箱の組立方法 | |
JPH0432784Y2 (enrdf_load_stackoverflow) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |