JPS62278293A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS62278293A
JPS62278293A JP61119345A JP11934586A JPS62278293A JP S62278293 A JPS62278293 A JP S62278293A JP 61119345 A JP61119345 A JP 61119345A JP 11934586 A JP11934586 A JP 11934586A JP S62278293 A JPS62278293 A JP S62278293A
Authority
JP
Japan
Prior art keywords
film
plating
plating film
electrolytic
nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61119345A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222160B2 (enExample
Inventor
Kiyoshi Asakawa
浅川　清
Hiroshi Uotani
魚谷　鴻
Toru Murakami
透 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura & Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura & Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura & Co Ltd filed Critical Uemera Kogyo Co Ltd
Priority to JP61119345A priority Critical patent/JPS62278293A/ja
Publication of JPS62278293A publication Critical patent/JPS62278293A/ja
Publication of JPH0222160B2 publication Critical patent/JPH0222160B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61119345A 1986-05-26 1986-05-26 電子部品の製造方法 Granted JPS62278293A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61119345A JPS62278293A (ja) 1986-05-26 1986-05-26 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61119345A JPS62278293A (ja) 1986-05-26 1986-05-26 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS62278293A true JPS62278293A (ja) 1987-12-03
JPH0222160B2 JPH0222160B2 (enExample) 1990-05-17

Family

ID=14759186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61119345A Granted JPS62278293A (ja) 1986-05-26 1986-05-26 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS62278293A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0416141A (ja) * 1990-05-08 1992-01-21 Mai Planning:Kk 冷凍パン生地の製造法
JPH05331677A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JPH05331676A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JP2001107284A (ja) * 1999-10-01 2001-04-17 Shimizu:Kk ほう酸を含まないニッケルめっき浴
JP2004339584A (ja) * 2003-05-16 2004-12-02 Mitsui High Tec Inc リードフレーム及びそのめっき方法
JP2005154864A (ja) * 2003-11-27 2005-06-16 Kakihara Kogyo Kk 樹脂製筐体の高剛性・高硬度めっき方法
JP2006077311A (ja) * 2004-09-13 2006-03-23 Murata Mfg Co Ltd ニッケルめっき浴、及び電子部品
JP2008285732A (ja) * 2007-05-21 2008-11-27 Meltex Inc ニッケルめっき液及びそのニッケルめっき液を用いた電気めっき方法並びにその電気めっき方法でニッケルめっき皮膜を形成したチップ部品
US7473343B2 (en) 2003-03-05 2009-01-06 Tdk Corporation Method of manufacturing rare-earth magnet, and plating bath
JP2009203536A (ja) * 2008-02-28 2009-09-10 Univ Kanagawa めっき液及び該めっき液を用いての切削ブレードの製造方法
JP2013110363A (ja) * 2011-11-24 2013-06-06 Tdk Corp セラミック電子部品
WO2019187250A1 (ja) * 2018-03-28 2019-10-03 Ｊｘ金属株式会社 Ｃｏアノード及びＣｏアノードを用いた電気Ｃｏめっき方法
CN111816456A (zh) * 2020-06-30 2020-10-23 西安交通大学 一种能够增强超级电容器电极导电性且抑制活性物质脱落的电极制作方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69607130T2 (de) * 1995-12-29 2000-10-19 At & T Corp., New York Elektroplattieren von Nickel auf Nickel-Ferrit Vorrichtungen

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0416141A (ja) * 1990-05-08 1992-01-21 Mai Planning:Kk 冷凍パン生地の製造法
JPH05331677A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JPH05331676A (ja) * 1992-05-27 1993-12-14 Sumitomo Metal Mining Co Ltd 電気鉄めっき液
JP2001107284A (ja) * 1999-10-01 2001-04-17 Shimizu:Kk ほう酸を含まないニッケルめっき浴
US7473343B2 (en) 2003-03-05 2009-01-06 Tdk Corporation Method of manufacturing rare-earth magnet, and plating bath
JP2004339584A (ja) * 2003-05-16 2004-12-02 Mitsui High Tec Inc リードフレーム及びそのめっき方法
JP2005154864A (ja) * 2003-11-27 2005-06-16 Kakihara Kogyo Kk 樹脂製筐体の高剛性・高硬度めっき方法
JP2006077311A (ja) * 2004-09-13 2006-03-23 Murata Mfg Co Ltd ニッケルめっき浴、及び電子部品
JP2008285732A (ja) * 2007-05-21 2008-11-27 Meltex Inc ニッケルめっき液及びそのニッケルめっき液を用いた電気めっき方法並びにその電気めっき方法でニッケルめっき皮膜を形成したチップ部品
JP2009203536A (ja) * 2008-02-28 2009-09-10 Univ Kanagawa めっき液及び該めっき液を用いての切削ブレードの製造方法
JP2013110363A (ja) * 2011-11-24 2013-06-06 Tdk Corp セラミック電子部品
WO2019187250A1 (ja) * 2018-03-28 2019-10-03 Ｊｘ金属株式会社 Ｃｏアノード及びＣｏアノードを用いた電気Ｃｏめっき方法
CN111816456A (zh) * 2020-06-30 2020-10-23 西安交通大学 一种能够增强超级电容器电极导电性且抑制活性物质脱落的电极制作方法
CN111816456B (zh) * 2020-06-30 2021-08-13 西安交通大学 一种能够增强超级电容器电极导电性且抑制活性物质脱落的电极制作方法

Also Published As

Publication number Publication date
JPH0222160B2 (enExample) 1990-05-17

Similar Documents

Publication Publication Date Title
EP1892321B1 (en) A Hard Gold Alloy Plating Bath
KR101502804B1 (ko) Ｐｄ 및 Ｐｄ-Ｎｉ 전해질 욕조
KR100303930B1 (ko) 주석합금도금조성물
US5552031A (en) Palladium alloy plating compositions
KR19990045291A (ko) 팔라듐 합금 전기도금용 조성물 및 이를 사용하는 전기도금법
JPH0222160B2 (enExample)
KR20070026832A (ko) 주석계 도금 피막 및 그 형성 방법
JPH0319308B2 (enExample)
TWI687545B (zh) 無電解鎳觸擊鍍液及鎳鍍膜的形成方法
CN113832509B (zh) 用于在镍镀层上电镀金的镀液和在镍镀层上电镀金的方法和镀金件
JP3482402B2 (ja) 置換金メッキ液
US3963455A (en) Electrodeposited gold plating
US6461745B2 (en) Copper foil for tape carrier and tab carrier tape and tab tape carrier using the copper foil
JP2769614B2 (ja) 亜鉛−ニツケル合金用めつき浴
CN108866548A (zh) 一种金属镀层及其制备方法和应用
JP3677617B2 (ja) 無電解金めっき液
US4615774A (en) Gold alloy plating bath and process
US3475290A (en) Bright gold plating solution and process
JPS63114997A (ja) 電気めつき方法
CN116288561A (zh) 无氰电镀金的镀液及采用无氰电镀金的镀液电镀金的方法
JPH02301588A (ja) 錫，鉛，錫―鉛合金電気めっき浴及び電気めっき方法
US4376018A (en) Electrodeposition of nickel
JP3833493B2 (ja) Ｔａｂ用テープキャリアに用いる銅箔並びにこの銅箔を用いたｔａｂ用キャリアテープ及びｔａｂ用テープキャリア
US4379738A (en) Electroplating zinc
US4377448A (en) Electrolytic gold plating

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees