JPS62257000A - 卑金属基材からの金属コ−テイングの選択的電解剥離 - Google Patents

卑金属基材からの金属コ−テイングの選択的電解剥離

Info

Publication number
JPS62257000A
JPS62257000A JP62096383A JP9638387A JPS62257000A JP S62257000 A JPS62257000 A JP S62257000A JP 62096383 A JP62096383 A JP 62096383A JP 9638387 A JP9638387 A JP 9638387A JP S62257000 A JPS62257000 A JP S62257000A
Authority
JP
Japan
Prior art keywords
metal
anode
tin
coating
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62096383A
Other languages
English (en)
Japanese (ja)
Inventor
ジヨンソン・ジヤンシエン・チヤン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pennwalt Corp
Original Assignee
Pennwalt Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pennwalt Corp filed Critical Pennwalt Corp
Publication of JPS62257000A publication Critical patent/JPS62257000A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00Electrolytic stripping of metallic layers or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • ing And Chemical Polishing (AREA)
  • Secondary Cells (AREA)
JP62096383A 1986-04-22 1987-04-21 卑金属基材からの金属コ−テイングの選択的電解剥離 Pending JPS62257000A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/855,043 US4678552A (en) 1986-04-22 1986-04-22 Selective electrolytic stripping of metal coatings from base metal substrates
US855043 1986-04-22

Publications (1)

Publication Number Publication Date
JPS62257000A true JPS62257000A (ja) 1987-11-09

Family

ID=25320193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62096383A Pending JPS62257000A (ja) 1986-04-22 1987-04-21 卑金属基材からの金属コ−テイングの選択的電解剥離

Country Status (13)

Country Link
US (1) US4678552A (enExample)
EP (1) EP0242583B1 (enExample)
JP (1) JPS62257000A (enExample)
AT (1) ATE54186T1 (enExample)
AU (1) AU592630B2 (enExample)
BR (1) BR8701888A (enExample)
CA (1) CA1294238C (enExample)
DE (1) DE3763431D1 (enExample)
DK (1) DK167776B1 (enExample)
ES (1) ES2015906B3 (enExample)
GR (1) GR3000587T3 (enExample)
IN (1) IN164856B (enExample)
MX (1) MX165328B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06272098A (ja) * 1993-03-19 1994-09-27 Ebara Yuujiraito Kk 錫または錫合金からなる皮膜のための電解剥離液および剥離法
JP2002212800A (ja) * 2001-01-10 2002-07-31 Ebara Udylite Kk スズ合金めっき皮膜の電解剥離方法

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US6045686A (en) * 1997-03-18 2000-04-04 The University Of Connecticut Method and apparatus for electrochemical delacquering and detinning
DE19809487A1 (de) * 1998-03-06 1999-09-09 Greising Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche
US6494960B1 (en) * 1998-04-27 2002-12-17 General Electric Company Method for removing an aluminide coating from a substrate
US6176999B1 (en) 1998-12-18 2001-01-23 United Technologies Corporation Feedback controlled stripping of airfoils
GB9901586D0 (en) * 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
US6599416B2 (en) 2001-09-28 2003-07-29 General Electric Company Method and apparatus for selectively removing coatings from substrates
EP1302569A3 (en) * 2001-10-11 2004-03-03 Shipley Co. L.L.C. Stripping solution
US6758914B2 (en) 2001-10-25 2004-07-06 General Electric Company Process for partial stripping of diffusion aluminide coatings from metal substrates, and related compositions
US6969457B2 (en) * 2002-10-21 2005-11-29 General Electric Company Method for partially stripping a coating from the surface of a substrate, and related articles and compositions
EP1473387A1 (de) * 2003-05-02 2004-11-03 Siemens Aktiengesellschaft Verfahren zur Entschichtung eines Bauteils
DE102004045297A1 (de) * 2004-09-16 2006-03-23 Basf Ag Verfahren zum Behandeln von metallischen Oberflächen unter Verwendung von Formulierungen auf Basis von wasserarmer Methansulfonsäure
EP2381015B1 (en) 2005-08-12 2019-01-16 Modumetal, Inc. Compositionally modulated composite materials
DE102006045221B3 (de) * 2006-09-25 2008-04-03 Poligrat Gmbh Elektropolierverfahren für Kobalt und Kobaltlegierungen und Elektrolyt
EP3009532A1 (en) 2009-06-08 2016-04-20 Modumetal, Inc. Electrodeposited nanolaminate coatings and claddings for corrosion protection
WO2011044340A1 (en) * 2009-10-08 2011-04-14 First Solar, Inc. Electrochemical method and apparatus for removing coating from a substrate
EP2558605A1 (en) 2010-04-15 2013-02-20 Advanced Technology Materials, Inc. Method for recycling of obsolete printed circuit boards
CN103088399B (zh) * 2011-10-31 2016-01-06 通用电气公司 多步骤电化学去金属涂层方法
KR20140139131A (ko) 2011-12-15 2014-12-04 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 폐 전기 및 전자 장비의 재활용 동안 땜납 금속의 스트리핑을 위한 장치 및 방법
DE102013102331B3 (de) * 2013-03-08 2014-07-03 Horst-Otto Bertholdt Verfahren zum Abbau einer Oxidschicht
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP2971265A4 (en) 2013-03-15 2016-12-14 Modumetal Inc NICKEL CHROME NANOLAMINE COATING WITH HIGH HARDNESS
CA2905536C (en) 2013-03-15 2023-03-07 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
WO2016044720A1 (en) 2014-09-18 2016-03-24 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
HK1220741A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 纳米层压涂层
US20160319444A1 (en) 2013-12-20 2016-11-03 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
CN107922992B (zh) 2015-06-24 2021-03-02 格林里昂集团有限公司 使用包括含有硝酸根离子的流体的酸性流体的贵金属的选择性移出
US10514242B1 (en) 2015-10-14 2019-12-24 The University Of Massachusetts Method and apparatus for electrochemical ammunition disposal and material recovery
EP3510185A1 (en) 2016-09-08 2019-07-17 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
EP3509812B1 (en) 2016-09-09 2025-04-09 Modumetal, Inc. Manufacturing of molds by deposition of material layers on a workpiece, molds and articles obtained by said process
CN109963966B (zh) 2016-09-14 2022-10-11 莫杜美拓有限公司 用于可靠、高通量、复杂电场生成的系统以及由其生产涂层的方法
CN110114210B (zh) 2016-11-02 2022-03-04 莫杜美拓有限公司 拓扑优化的高界面填充结构
US11293272B2 (en) 2017-03-24 2022-04-05 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
US11286575B2 (en) 2017-04-21 2022-03-29 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
US2706171A (en) * 1953-03-09 1955-04-12 Enthone Stripping chromium plating from zinc electrolytically
DE1926228C3 (de) * 1969-05-22 1974-02-21 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Bad zum elektrolytischen Ablösen von Metallüberzügen aus Nickel oder Chrom von Grundkörpern aus Buntmetall
US4356069A (en) * 1981-03-09 1982-10-26 Ross Cunningham Stripping composition and method for preparing and using same
US4400248A (en) * 1982-03-08 1983-08-23 Occidental Chemical Corporation Electrolytic stripping process
HU186150B (en) * 1982-10-29 1985-06-28 Latszereszeti Eszkoezoek Gyara Process for the removal electrolitically of nickel, chrome ot gold layers from the surface of copper or cupric alloys and equipemnt for carrying out the process
ATE30344T1 (de) * 1983-10-26 1987-11-15 Schloetter Fa Dr Ing Max Entmetallisierungsbad und verfahren zum elektrolytischen abziehen von metallen von titan als grundmetall.
DE3415364A1 (de) * 1984-04-25 1985-10-31 Hoechst Ag, 6230 Frankfurt Verfahren zur elektrochemischen aufrauhung von aluminium fuer druckplattentraeger in einem waessrigen mischelektrolyten
US4664763A (en) * 1985-05-08 1987-05-12 M&T Chemicals Inc. Process for stripping nickel or nickel-alloy plating in a chromic acid solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06272098A (ja) * 1993-03-19 1994-09-27 Ebara Yuujiraito Kk 錫または錫合金からなる皮膜のための電解剥離液および剥離法
JP2002212800A (ja) * 2001-01-10 2002-07-31 Ebara Udylite Kk スズ合金めっき皮膜の電解剥離方法

Also Published As

Publication number Publication date
US4678552A (en) 1987-07-07
DK167776B1 (da) 1993-12-13
ES2015906B3 (es) 1990-09-16
AU592630B2 (en) 1990-01-18
DK202387D0 (da) 1987-04-21
ATE54186T1 (de) 1990-07-15
DK202387A (da) 1987-10-23
IN164856B (enExample) 1989-06-17
BR8701888A (pt) 1988-02-02
AU7098887A (en) 1987-10-29
GR3000587T3 (en) 1991-07-31
DE3763431D1 (de) 1990-08-02
EP0242583A1 (en) 1987-10-28
CA1294238C (en) 1992-01-14
EP0242583B1 (en) 1990-06-27
MX165328B (es) 1992-11-05

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