DK167776B1 - Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag - Google Patents

Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag Download PDF

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Publication number
DK167776B1
DK167776B1 DK202387A DK202387A DK167776B1 DK 167776 B1 DK167776 B1 DK 167776B1 DK 202387 A DK202387 A DK 202387A DK 202387 A DK202387 A DK 202387A DK 167776 B1 DK167776 B1 DK 167776B1
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DK
Denmark
Prior art keywords
approx
metal
anode
tin
copper
Prior art date
Application number
DK202387A
Other languages
Danish (da)
English (en)
Other versions
DK202387D0 (da
DK202387A (da
Inventor
Johnson Cheng-Hsiung Chen
Original Assignee
Atochem North America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atochem North America filed Critical Atochem North America
Publication of DK202387D0 publication Critical patent/DK202387D0/da
Publication of DK202387A publication Critical patent/DK202387A/da
Application granted granted Critical
Publication of DK167776B1 publication Critical patent/DK167776B1/da

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00Electrolytic stripping of metallic layers or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Secondary Cells (AREA)
  • ing And Chemical Polishing (AREA)
DK202387A 1986-04-22 1987-04-21 Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag DK167776B1 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85504386 1986-04-22
US06/855,043 US4678552A (en) 1986-04-22 1986-04-22 Selective electrolytic stripping of metal coatings from base metal substrates

Publications (3)

Publication Number Publication Date
DK202387D0 DK202387D0 (da) 1987-04-21
DK202387A DK202387A (da) 1987-10-23
DK167776B1 true DK167776B1 (da) 1993-12-13

Family

ID=25320193

Family Applications (1)

Application Number Title Priority Date Filing Date
DK202387A DK167776B1 (da) 1986-04-22 1987-04-21 Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag

Country Status (13)

Country Link
US (1) US4678552A (enExample)
EP (1) EP0242583B1 (enExample)
JP (1) JPS62257000A (enExample)
AT (1) ATE54186T1 (enExample)
AU (1) AU592630B2 (enExample)
BR (1) BR8701888A (enExample)
CA (1) CA1294238C (enExample)
DE (1) DE3763431D1 (enExample)
DK (1) DK167776B1 (enExample)
ES (1) ES2015906B3 (enExample)
GR (1) GR3000587T3 (enExample)
IN (1) IN164856B (enExample)
MX (1) MX165328B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06272098A (ja) * 1993-03-19 1994-09-27 Ebara Yuujiraito Kk 錫または錫合金からなる皮膜のための電解剥離液および剥離法
US6045686A (en) * 1997-03-18 2000-04-04 The University Of Connecticut Method and apparatus for electrochemical delacquering and detinning
DE19809487A1 (de) * 1998-03-06 1999-09-09 Greising Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche
US6494960B1 (en) * 1998-04-27 2002-12-17 General Electric Company Method for removing an aluminide coating from a substrate
US6176999B1 (en) 1998-12-18 2001-01-23 United Technologies Corporation Feedback controlled stripping of airfoils
GB9901586D0 (en) * 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
JP2002212800A (ja) * 2001-01-10 2002-07-31 Ebara Udylite Kk スズ合金めっき皮膜の電解剥離方法
US6599416B2 (en) 2001-09-28 2003-07-29 General Electric Company Method and apparatus for selectively removing coatings from substrates
TWI231831B (en) * 2001-10-11 2005-05-01 Shipley Co Llc Stripping solution
US6758914B2 (en) 2001-10-25 2004-07-06 General Electric Company Process for partial stripping of diffusion aluminide coatings from metal substrates, and related compositions
US6969457B2 (en) * 2002-10-21 2005-11-29 General Electric Company Method for partially stripping a coating from the surface of a substrate, and related articles and compositions
EP1473387A1 (de) * 2003-05-02 2004-11-03 Siemens Aktiengesellschaft Verfahren zur Entschichtung eines Bauteils
DE102004045297A1 (de) * 2004-09-16 2006-03-23 Basf Ag Verfahren zum Behandeln von metallischen Oberflächen unter Verwendung von Formulierungen auf Basis von wasserarmer Methansulfonsäure
ES2422455T3 (es) 2005-08-12 2013-09-11 Modumetal Llc Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos
DE102006045221B3 (de) * 2006-09-25 2008-04-03 Poligrat Gmbh Elektropolierverfahren für Kobalt und Kobaltlegierungen und Elektrolyt
EP2440691B1 (en) 2009-06-08 2019-10-23 Modumetal, Inc. Electrodeposited, nanolaminate coatings and claddings for corrosion protection
WO2011044340A1 (en) * 2009-10-08 2011-04-14 First Solar, Inc. Electrochemical method and apparatus for removing coating from a substrate
TWI568859B (zh) * 2010-04-15 2017-02-01 恩特葛瑞斯股份有限公司 廢棄印刷電路板之回收利用方法
CN103088399B (zh) * 2011-10-31 2016-01-06 通用电气公司 多步骤电化学去金属涂层方法
US9221114B2 (en) 2011-12-15 2015-12-29 Advanced Technology Materials, Inc. Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
DE102013102331B3 (de) 2013-03-08 2014-07-03 Horst-Otto Bertholdt Verfahren zum Abbau einer Oxidschicht
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
EA201500949A1 (ru) * 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
CN105283587B (zh) 2013-03-15 2019-05-10 莫杜美拓有限公司 纳米叠层涂层
WO2014146117A2 (en) 2013-03-15 2014-09-18 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP3083016B1 (en) 2013-12-20 2020-07-29 Greene Lyon Group Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
EP3194642A4 (en) 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
JP2018524480A (ja) 2015-06-24 2018-08-30 グリーン リヨン グループ, インコーポレーテッドGreene Lyon Group, Inc. 硝酸イオン含有流体を包含する酸性流体を用いる貴金属の選択的取り出し関連出願
US10514242B1 (en) 2015-10-14 2019-12-24 The University Of Massachusetts Method and apparatus for electrochemical ammunition disposal and material recovery
CN109952391B (zh) 2016-09-08 2022-11-01 莫杜美拓有限公司 在工件上提供层压涂层的方法,及由其制备的制品
CN109922936A (zh) 2016-09-09 2019-06-21 莫杜美拓有限公司 通过在工件上沉积材料层来制造模具,通过该工艺得到的模具和制品
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
WO2018175975A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
US2706171A (en) * 1953-03-09 1955-04-12 Enthone Stripping chromium plating from zinc electrolytically
DE1926228C3 (de) * 1969-05-22 1974-02-21 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Bad zum elektrolytischen Ablösen von Metallüberzügen aus Nickel oder Chrom von Grundkörpern aus Buntmetall
US4356069A (en) * 1981-03-09 1982-10-26 Ross Cunningham Stripping composition and method for preparing and using same
US4400248A (en) * 1982-03-08 1983-08-23 Occidental Chemical Corporation Electrolytic stripping process
HU186150B (en) * 1982-10-29 1985-06-28 Latszereszeti Eszkoezoek Gyara Process for the removal electrolitically of nickel, chrome ot gold layers from the surface of copper or cupric alloys and equipemnt for carrying out the process
ATE30344T1 (de) * 1983-10-26 1987-11-15 Schloetter Fa Dr Ing Max Entmetallisierungsbad und verfahren zum elektrolytischen abziehen von metallen von titan als grundmetall.
DE3415364A1 (de) * 1984-04-25 1985-10-31 Hoechst Ag, 6230 Frankfurt Verfahren zur elektrochemischen aufrauhung von aluminium fuer druckplattentraeger in einem waessrigen mischelektrolyten
US4664763A (en) * 1985-05-08 1987-05-12 M&T Chemicals Inc. Process for stripping nickel or nickel-alloy plating in a chromic acid solution

Also Published As

Publication number Publication date
AU7098887A (en) 1987-10-29
AU592630B2 (en) 1990-01-18
MX165328B (es) 1992-11-05
EP0242583A1 (en) 1987-10-28
ES2015906B3 (es) 1990-09-16
DK202387D0 (da) 1987-04-21
DK202387A (da) 1987-10-23
EP0242583B1 (en) 1990-06-27
BR8701888A (pt) 1988-02-02
GR3000587T3 (en) 1991-07-31
CA1294238C (en) 1992-01-14
JPS62257000A (ja) 1987-11-09
DE3763431D1 (de) 1990-08-02
ATE54186T1 (de) 1990-07-15
IN164856B (enExample) 1989-06-17
US4678552A (en) 1987-07-07

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