DK167776B1 - Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag - Google Patents

Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag Download PDF

Info

Publication number
DK167776B1
DK167776B1 DK202387A DK202387A DK167776B1 DK 167776 B1 DK167776 B1 DK 167776B1 DK 202387 A DK202387 A DK 202387A DK 202387 A DK202387 A DK 202387A DK 167776 B1 DK167776 B1 DK 167776B1
Authority
DK
Denmark
Prior art keywords
approx
metal
anode
tin
copper
Prior art date
Application number
DK202387A
Other languages
Danish (da)
English (en)
Other versions
DK202387A (da
DK202387D0 (da
Inventor
Johnson Cheng-Hsiung Chen
Original Assignee
Atochem North America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atochem North America filed Critical Atochem North America
Publication of DK202387D0 publication Critical patent/DK202387D0/da
Publication of DK202387A publication Critical patent/DK202387A/da
Application granted granted Critical
Publication of DK167776B1 publication Critical patent/DK167776B1/da

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00Electrolytic stripping of metallic layers or coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Secondary Cells (AREA)
  • ing And Chemical Polishing (AREA)
DK202387A 1986-04-22 1987-04-21 Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag DK167776B1 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85504386 1986-04-22
US06/855,043 US4678552A (en) 1986-04-22 1986-04-22 Selective electrolytic stripping of metal coatings from base metal substrates

Publications (3)

Publication Number Publication Date
DK202387D0 DK202387D0 (da) 1987-04-21
DK202387A DK202387A (da) 1987-10-23
DK167776B1 true DK167776B1 (da) 1993-12-13

Family

ID=25320193

Family Applications (1)

Application Number Title Priority Date Filing Date
DK202387A DK167776B1 (da) 1986-04-22 1987-04-21 Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag

Country Status (13)

Country Link
US (1) US4678552A (enExample)
EP (1) EP0242583B1 (enExample)
JP (1) JPS62257000A (enExample)
AT (1) ATE54186T1 (enExample)
AU (1) AU592630B2 (enExample)
BR (1) BR8701888A (enExample)
CA (1) CA1294238C (enExample)
DE (1) DE3763431D1 (enExample)
DK (1) DK167776B1 (enExample)
ES (1) ES2015906B3 (enExample)
GR (1) GR3000587T3 (enExample)
IN (1) IN164856B (enExample)
MX (1) MX165328B (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06272098A (ja) * 1993-03-19 1994-09-27 Ebara Yuujiraito Kk 錫または錫合金からなる皮膜のための電解剥離液および剥離法
US6045686A (en) * 1997-03-18 2000-04-04 The University Of Connecticut Method and apparatus for electrochemical delacquering and detinning
DE19809487A1 (de) * 1998-03-06 1999-09-09 Greising Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche
US6494960B1 (en) * 1998-04-27 2002-12-17 General Electric Company Method for removing an aluminide coating from a substrate
US6176999B1 (en) 1998-12-18 2001-01-23 United Technologies Corporation Feedback controlled stripping of airfoils
GB9901586D0 (en) * 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
JP2002212800A (ja) * 2001-01-10 2002-07-31 Ebara Udylite Kk スズ合金めっき皮膜の電解剥離方法
US6599416B2 (en) 2001-09-28 2003-07-29 General Electric Company Method and apparatus for selectively removing coatings from substrates
JP2003277999A (ja) * 2001-10-11 2003-10-02 Shipley Co Llc 剥離溶液
US6758914B2 (en) 2001-10-25 2004-07-06 General Electric Company Process for partial stripping of diffusion aluminide coatings from metal substrates, and related compositions
US6969457B2 (en) * 2002-10-21 2005-11-29 General Electric Company Method for partially stripping a coating from the surface of a substrate, and related articles and compositions
EP1473387A1 (de) * 2003-05-02 2004-11-03 Siemens Aktiengesellschaft Verfahren zur Entschichtung eines Bauteils
DE102004045297A1 (de) * 2004-09-16 2006-03-23 Basf Ag Verfahren zum Behandeln von metallischen Oberflächen unter Verwendung von Formulierungen auf Basis von wasserarmer Methansulfonsäure
CA2619509C (en) 2005-08-12 2015-01-06 Modumetal, Llc. Compositionally modulated composite materials and methods for making the same
DE102006045221B3 (de) * 2006-09-25 2008-04-03 Poligrat Gmbh Elektropolierverfahren für Kobalt und Kobaltlegierungen und Elektrolyt
CN102639758B (zh) 2009-06-08 2016-05-18 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
WO2011044340A1 (en) * 2009-10-08 2011-04-14 First Solar, Inc. Electrochemical method and apparatus for removing coating from a substrate
KR101620133B1 (ko) * 2010-04-15 2016-05-23 엔테그리스, 아이엔씨. 폐 인쇄 회로판의 재순환 방법
CN103088399B (zh) * 2011-10-31 2016-01-06 通用电气公司 多步骤电化学去金属涂层方法
SG11201403228RA (en) 2011-12-15 2014-07-30 Advanced Tech Materials Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
DE102013102331B3 (de) 2013-03-08 2014-07-03 Horst-Otto Bertholdt Verfahren zum Abbau einer Oxidschicht
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
HK1220742A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 用於连续施加纳米层压金属涂层的方法和装置
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
CN105189828B (zh) * 2013-03-15 2018-05-15 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
WO2015095664A2 (en) 2013-12-20 2015-06-25 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
CA2961507C (en) 2014-09-18 2024-04-09 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
EA201790643A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
CN107922992B (zh) 2015-06-24 2021-03-02 格林里昂集团有限公司 使用包括含有硝酸根离子的流体的酸性流体的贵金属的选择性移出
US10514242B1 (en) 2015-10-14 2019-12-24 The University Of Massachusetts Method and apparatus for electrochemical ammunition disposal and material recovery
EP3510185A1 (en) 2016-09-08 2019-07-17 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
WO2018053158A1 (en) 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
WO2018085591A1 (en) 2016-11-02 2018-05-11 Modumetal, Inc. Topology optimized high interface packing structures
WO2018175975A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
WO2018195516A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
US2706171A (en) * 1953-03-09 1955-04-12 Enthone Stripping chromium plating from zinc electrolytically
DE1926228C3 (de) * 1969-05-22 1974-02-21 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Bad zum elektrolytischen Ablösen von Metallüberzügen aus Nickel oder Chrom von Grundkörpern aus Buntmetall
US4356069A (en) * 1981-03-09 1982-10-26 Ross Cunningham Stripping composition and method for preparing and using same
US4400248A (en) * 1982-03-08 1983-08-23 Occidental Chemical Corporation Electrolytic stripping process
HU186150B (en) * 1982-10-29 1985-06-28 Latszereszeti Eszkoezoek Gyara Process for the removal electrolitically of nickel, chrome ot gold layers from the surface of copper or cupric alloys and equipemnt for carrying out the process
ATE30344T1 (de) * 1983-10-26 1987-11-15 Schloetter Fa Dr Ing Max Entmetallisierungsbad und verfahren zum elektrolytischen abziehen von metallen von titan als grundmetall.
DE3415364A1 (de) * 1984-04-25 1985-10-31 Hoechst Ag, 6230 Frankfurt Verfahren zur elektrochemischen aufrauhung von aluminium fuer druckplattentraeger in einem waessrigen mischelektrolyten
US4664763A (en) * 1985-05-08 1987-05-12 M&T Chemicals Inc. Process for stripping nickel or nickel-alloy plating in a chromic acid solution

Also Published As

Publication number Publication date
DK202387A (da) 1987-10-23
ATE54186T1 (de) 1990-07-15
EP0242583A1 (en) 1987-10-28
IN164856B (enExample) 1989-06-17
DE3763431D1 (de) 1990-08-02
CA1294238C (en) 1992-01-14
AU592630B2 (en) 1990-01-18
JPS62257000A (ja) 1987-11-09
AU7098887A (en) 1987-10-29
ES2015906B3 (es) 1990-09-16
MX165328B (es) 1992-11-05
US4678552A (en) 1987-07-07
BR8701888A (pt) 1988-02-02
GR3000587T3 (en) 1991-07-31
EP0242583B1 (en) 1990-06-27
DK202387D0 (da) 1987-04-21

Similar Documents

Publication Publication Date Title
DK167776B1 (da) Fremgangsmaade til selektiv elektrolytisk fjernelse af metalbelaegninger fra basismetalunderlag
US4755265A (en) Processes for the deposition or removal of metals
US4686017A (en) Electrolytic bath and methods of use
US4801511A (en) Battery cell electrolyte
EP0052986B1 (en) Electrode, method of manufacturing an electrode and electrolytic cell using such an electrode
JPS6156320B2 (enExample)
TWI231831B (en) Stripping solution
CN106062252A (zh) 用于微蚀刻铜和铜合金的组合物及方法
US3468765A (en) Method of plating copper on aluminum
US4244792A (en) Method for stripping anodized aluminum and aluminum alloys
US3281339A (en) Process of electroforming using benzotriazole as the stripping agent
US2436244A (en) Metalworking and strippingplating process
JPS62243776A (ja) 無電解銅メッキ浴の再生方法
CN102906312A (zh) 封孔处理剂以及封孔处理方法
JP3290507B2 (ja) 塗膜付き金属板の塗膜重量測定方法
US2437620A (en) Method of coating masses of small copper-bearing aluminum articles
US3528895A (en) Plating low stress bright rhodium
JP3960655B2 (ja) 錫または錫合金用電解剥離液及び電解剥離法
Budiana et al. Effect of Current, Voltage, Temperature, and Time Variations on Thickness of Steel using Electroplating Process
GB2065175A (en) Method and Composition for Producing Palladium Electrodeposition
KR100384631B1 (ko) 도막제거용전해액과이를이용한도막제거방법및이에이용되는장치
CN112111762A (zh) 高光洁度料带镀锡工艺及其制得的料带
US3075894A (en) Method of electroplating on aluminum surfaces
SU796250A1 (ru) Способ электролитического осаждени СЕРЕбРА HA МЕТАлличЕСКиЕ издЕли
US5487820A (en) Process for removing lead dioxide residues