ATE54186T1 - Selektives elektrolytisches abloesen von metallischen beschichtungen von metallischen basis-substraten. - Google Patents

Selektives elektrolytisches abloesen von metallischen beschichtungen von metallischen basis-substraten.

Info

Publication number
ATE54186T1
ATE54186T1 AT87103767T AT87103767T ATE54186T1 AT E54186 T1 ATE54186 T1 AT E54186T1 AT 87103767 T AT87103767 T AT 87103767T AT 87103767 T AT87103767 T AT 87103767T AT E54186 T1 ATE54186 T1 AT E54186T1
Authority
AT
Austria
Prior art keywords
metallic
metal
coatings
base substrates
base
Prior art date
Application number
AT87103767T
Other languages
German (de)
English (en)
Inventor
Johnson Cheng-Hsiung Chen
Original Assignee
Pennwalt Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pennwalt Corp filed Critical Pennwalt Corp
Application granted granted Critical
Publication of ATE54186T1 publication Critical patent/ATE54186T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Secondary Cells (AREA)
  • ing And Chemical Polishing (AREA)
AT87103767T 1986-04-22 1987-03-16 Selektives elektrolytisches abloesen von metallischen beschichtungen von metallischen basis-substraten. ATE54186T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/855,043 US4678552A (en) 1986-04-22 1986-04-22 Selective electrolytic stripping of metal coatings from base metal substrates
EP87103767A EP0242583B1 (en) 1986-04-22 1987-03-16 Selective electrolytic stripping of metal coatings from base metal substrates

Publications (1)

Publication Number Publication Date
ATE54186T1 true ATE54186T1 (de) 1990-07-15

Family

ID=25320193

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87103767T ATE54186T1 (de) 1986-04-22 1987-03-16 Selektives elektrolytisches abloesen von metallischen beschichtungen von metallischen basis-substraten.

Country Status (13)

Country Link
US (1) US4678552A (enExample)
EP (1) EP0242583B1 (enExample)
JP (1) JPS62257000A (enExample)
AT (1) ATE54186T1 (enExample)
AU (1) AU592630B2 (enExample)
BR (1) BR8701888A (enExample)
CA (1) CA1294238C (enExample)
DE (1) DE3763431D1 (enExample)
DK (1) DK167776B1 (enExample)
ES (1) ES2015906B3 (enExample)
GR (1) GR3000587T3 (enExample)
IN (1) IN164856B (enExample)
MX (1) MX165328B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045221B3 (de) * 2006-09-25 2008-04-03 Poligrat Gmbh Elektropolierverfahren für Kobalt und Kobaltlegierungen und Elektrolyt
DE102013102331B3 (de) * 2013-03-08 2014-07-03 Horst-Otto Bertholdt Verfahren zum Abbau einer Oxidschicht

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JPH06272098A (ja) * 1993-03-19 1994-09-27 Ebara Yuujiraito Kk 錫または錫合金からなる皮膜のための電解剥離液および剥離法
US6045686A (en) * 1997-03-18 2000-04-04 The University Of Connecticut Method and apparatus for electrochemical delacquering and detinning
DE19809487A1 (de) * 1998-03-06 1999-09-09 Greising Verfahren und Vorrichtung zur Aufbringung einer räumlich begrenzten metallischen Deckschicht auf einer elektrisch leitenden Materialoberfläche
US6494960B1 (en) * 1998-04-27 2002-12-17 General Electric Company Method for removing an aluminide coating from a substrate
US6176999B1 (en) 1998-12-18 2001-01-23 United Technologies Corporation Feedback controlled stripping of airfoils
GB9901586D0 (en) * 1999-01-25 1999-03-17 Alpha Fry Ltd Process for the recovery of lead and/or tin or alloys thereof from substrate surfaces
JP2002212800A (ja) * 2001-01-10 2002-07-31 Ebara Udylite Kk スズ合金めっき皮膜の電解剥離方法
US6599416B2 (en) 2001-09-28 2003-07-29 General Electric Company Method and apparatus for selectively removing coatings from substrates
JP2003277999A (ja) * 2001-10-11 2003-10-02 Shipley Co Llc 剥離溶液
US6758914B2 (en) 2001-10-25 2004-07-06 General Electric Company Process for partial stripping of diffusion aluminide coatings from metal substrates, and related compositions
US6969457B2 (en) * 2002-10-21 2005-11-29 General Electric Company Method for partially stripping a coating from the surface of a substrate, and related articles and compositions
EP1473387A1 (de) * 2003-05-02 2004-11-03 Siemens Aktiengesellschaft Verfahren zur Entschichtung eines Bauteils
DE102004045297A1 (de) * 2004-09-16 2006-03-23 Basf Ag Verfahren zum Behandeln von metallischen Oberflächen unter Verwendung von Formulierungen auf Basis von wasserarmer Methansulfonsäure
CA2619509C (en) 2005-08-12 2015-01-06 Modumetal, Llc. Compositionally modulated composite materials and methods for making the same
CN102639758B (zh) 2009-06-08 2016-05-18 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
WO2011044340A1 (en) * 2009-10-08 2011-04-14 First Solar, Inc. Electrochemical method and apparatus for removing coating from a substrate
KR101620133B1 (ko) * 2010-04-15 2016-05-23 엔테그리스, 아이엔씨. 폐 인쇄 회로판의 재순환 방법
CN103088399B (zh) * 2011-10-31 2016-01-06 通用电气公司 多步骤电化学去金属涂层方法
SG11201403228RA (en) 2011-12-15 2014-07-30 Advanced Tech Materials Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
HK1220742A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 用於连续施加纳米层压金属涂层的方法和装置
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
CN105189828B (zh) * 2013-03-15 2018-05-15 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
WO2015095664A2 (en) 2013-12-20 2015-06-25 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
CA2961507C (en) 2014-09-18 2024-04-09 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
EA201790643A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
CN107922992B (zh) 2015-06-24 2021-03-02 格林里昂集团有限公司 使用包括含有硝酸根离子的流体的酸性流体的贵金属的选择性移出
US10514242B1 (en) 2015-10-14 2019-12-24 The University Of Massachusetts Method and apparatus for electrochemical ammunition disposal and material recovery
EP3510185A1 (en) 2016-09-08 2019-07-17 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
WO2018053158A1 (en) 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
WO2018085591A1 (en) 2016-11-02 2018-05-11 Modumetal, Inc. Topology optimized high interface packing structures
WO2018175975A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
WO2018195516A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2525942A (en) * 1945-06-29 1950-10-17 Standard Oil Co Electrodepositing bath and process
US2706171A (en) * 1953-03-09 1955-04-12 Enthone Stripping chromium plating from zinc electrolytically
DE1926228C3 (de) * 1969-05-22 1974-02-21 Bergische Metallwarenfabrik Dillenberg & Co Kg, 5601 Gruiten Bad zum elektrolytischen Ablösen von Metallüberzügen aus Nickel oder Chrom von Grundkörpern aus Buntmetall
US4356069A (en) * 1981-03-09 1982-10-26 Ross Cunningham Stripping composition and method for preparing and using same
US4400248A (en) * 1982-03-08 1983-08-23 Occidental Chemical Corporation Electrolytic stripping process
HU186150B (en) * 1982-10-29 1985-06-28 Latszereszeti Eszkoezoek Gyara Process for the removal electrolitically of nickel, chrome ot gold layers from the surface of copper or cupric alloys and equipemnt for carrying out the process
ATE30344T1 (de) * 1983-10-26 1987-11-15 Schloetter Fa Dr Ing Max Entmetallisierungsbad und verfahren zum elektrolytischen abziehen von metallen von titan als grundmetall.
DE3415364A1 (de) * 1984-04-25 1985-10-31 Hoechst Ag, 6230 Frankfurt Verfahren zur elektrochemischen aufrauhung von aluminium fuer druckplattentraeger in einem waessrigen mischelektrolyten
US4664763A (en) * 1985-05-08 1987-05-12 M&T Chemicals Inc. Process for stripping nickel or nickel-alloy plating in a chromic acid solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006045221B3 (de) * 2006-09-25 2008-04-03 Poligrat Gmbh Elektropolierverfahren für Kobalt und Kobaltlegierungen und Elektrolyt
DE102013102331B3 (de) * 2013-03-08 2014-07-03 Horst-Otto Bertholdt Verfahren zum Abbau einer Oxidschicht

Also Published As

Publication number Publication date
DK202387A (da) 1987-10-23
DK167776B1 (da) 1993-12-13
EP0242583A1 (en) 1987-10-28
IN164856B (enExample) 1989-06-17
DE3763431D1 (de) 1990-08-02
CA1294238C (en) 1992-01-14
AU592630B2 (en) 1990-01-18
JPS62257000A (ja) 1987-11-09
AU7098887A (en) 1987-10-29
ES2015906B3 (es) 1990-09-16
MX165328B (es) 1992-11-05
US4678552A (en) 1987-07-07
BR8701888A (pt) 1988-02-02
GR3000587T3 (en) 1991-07-31
EP0242583B1 (en) 1990-06-27
DK202387D0 (da) 1987-04-21

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