JP3987514B2 - 工作部材および装置部品を非反応性被覆により選択的にまたは完全に不活性化する方法 - Google Patents
工作部材および装置部品を非反応性被覆により選択的にまたは完全に不活性化する方法 Download PDFInfo
- Publication number
- JP3987514B2 JP3987514B2 JP2004236473A JP2004236473A JP3987514B2 JP 3987514 B2 JP3987514 B2 JP 3987514B2 JP 2004236473 A JP2004236473 A JP 2004236473A JP 2004236473 A JP2004236473 A JP 2004236473A JP 3987514 B2 JP3987514 B2 JP 3987514B2
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- JP
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- Prior art keywords
- metallization
- coating
- reactive
- layer
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 42
- 238000000576 coating method Methods 0.000 title claims description 28
- 239000011248 coating agent Substances 0.000 title claims description 22
- 238000001465 metallisation Methods 0.000 claims description 30
- 239000003792 electrolyte Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- 229910052804 chromium Inorganic materials 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 11
- 238000000151 deposition Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 150000002736 metal compounds Chemical class 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 230000010287 polarization Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 15
- 229910000831 Steel Inorganic materials 0.000 description 8
- 230000009849 deactivation Effects 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 229910017604 nitric acid Inorganic materials 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 3
- 230000002779 inactivation Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 230000000181 anti-adherent effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- BFGKITSFLPAWGI-UHFFFAOYSA-N chromium(3+) Chemical class [Cr+3] BFGKITSFLPAWGI-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004035 construction material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000000415 inactivating effect Effects 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Description
200〜300g/lの酸化クロム(VI)、
1〜3g/lの濃縮硫酸、
0.02〜0.3g/lのフッ化物
0.2〜3g/lのメタンスルホン酸またはメタンスルホン酸誘導体
を組成とする電解質から、平滑で層厚に制限のない厚みのある層が析出された。
Claims (12)
- 後続の金属析出工程において金属化対象外であるが同工程において暴露される領域上に、金属化に対して不活性である非反応性被覆を析出させる方法であって、
非反応性被覆が電解析出するように同領域を活性化させる工程と、
同領域上に非反応性被覆を電解析出させる工程とを備え、
前記活性化させる工程と前記非反応性被覆を電解析出させる工程とが一工程として同時に実施される方法。 - 化学的に析出される金属が、銅、ニッケル、スズ、コバルト、パラジウム、銀、金または白金から成る群のうちの少なくとも1つであることを特徴とする請求項1に記載の方法。
- 活性化に、フッ化物を含む溶液が使用されることを特徴とする請求項1または2に記載の方法。
- 基材として、特に金属および/または金属化合物、合金またはプラスチックから成る工作部材または装置部品が使用されることを特徴とする請求項1乃至3のいずれか1項に記載の方法。
- 無電解金属化の対象外領域への被覆加工として、クロムを含む電解質から層が析出されることを特徴とする請求項1乃至4のいずれか1項に記載の方法。
- 陰極電流の設定により非反応性層が基材の被覆対象領域に電解析出されることを特徴とする請求項1乃至5のいずれか1項に記載の方法。
- 非反応性層が10A/dm 2 未満の電流密度領域で析出されることを特徴とする請求項1乃至6のいずれか1項に記載の方法。
- 非反応性層が15〜40℃で析出されることを特徴とする請求項1乃至7のいずれか1項に記載の方法。
- 非反応性層によって不活性化されない基材領域における続いての無電解金属化を特徴とする請求項1乃至8のいずれか1項に記載の方法。
- 非反応性層が、無電解金属化の後に除去されることを特徴とする請求項1乃至9のいずれか1項に記載の方法。
- 非反応性層の除去が無電解金属化の後に、酸によって行われることを特徴とする請求項1乃至10のいずれか1項に記載の方法。
- 非反応性層の除去が無電解金属化の後に、陽極分極下アルカリ溶液によって行われることを特徴とする請求項1乃至10のいずれか1項に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03018449A EP1507026A1 (de) | 2003-08-14 | 2003-08-14 | Verfahren zur selektiven oder vollständigen Inertisierung von Werkstücken und Anlagenteilen mittels nicht reaktiver Beschichtungen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005060843A JP2005060843A (ja) | 2005-03-10 |
JP3987514B2 true JP3987514B2 (ja) | 2007-10-10 |
Family
ID=33560801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004236473A Expired - Fee Related JP3987514B2 (ja) | 2003-08-14 | 2004-08-16 | 工作部材および装置部品を非反応性被覆により選択的にまたは完全に不活性化する方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050034996A1 (ja) |
EP (1) | EP1507026A1 (ja) |
JP (1) | JP3987514B2 (ja) |
CN (1) | CN1598051A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10847620B2 (en) | 2018-01-18 | 2020-11-24 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10668511B2 (en) * | 2018-03-20 | 2020-06-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of cleaning process chamber |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2587651A (en) * | 1945-12-22 | 1952-03-04 | Floricel A Rojas | Method and means for the electro-deposition of chromium |
US2570174A (en) * | 1947-11-12 | 1951-10-02 | Gen Electric | Metal cleaning and plating process |
US3041257A (en) * | 1960-08-25 | 1962-06-26 | Westinghouse Electric Corp | Chromium electroplating |
US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
US3592744A (en) * | 1968-12-02 | 1971-07-13 | Macdermid Inc | Method of preventing rack plating in continuous plating cycle for nonconductive articles |
DE2422076A1 (de) * | 1973-08-30 | 1975-04-10 | M & T Chemicals Inc | Verfahren und bad zur abscheidung von chrom |
US4139942A (en) * | 1977-12-16 | 1979-02-20 | The Gillette Company | Process for producing corrosion resistant carbon steel razor blades and products made thereby |
US4699811A (en) * | 1986-09-16 | 1987-10-13 | Macdermid, Incorporated | Chromium mask for electroless nickel or copper plating |
DK1205582T3 (da) * | 2000-11-11 | 2008-11-24 | Enthone | Fremgangsmåde til elektrolytisk udskillelse fra en chromholdig oplösning |
-
2003
- 2003-08-14 EP EP03018449A patent/EP1507026A1/de not_active Withdrawn
-
2004
- 2004-08-16 US US10/919,034 patent/US20050034996A1/en not_active Abandoned
- 2004-08-16 CN CNA2004100577392A patent/CN1598051A/zh active Pending
- 2004-08-16 JP JP2004236473A patent/JP3987514B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10847620B2 (en) | 2018-01-18 | 2020-11-24 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
EP1507026A1 (de) | 2005-02-16 |
JP2005060843A (ja) | 2005-03-10 |
CN1598051A (zh) | 2005-03-23 |
US20050034996A1 (en) | 2005-02-17 |
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