JPS62242676A - エポキシ樹脂の製造法 - Google Patents
エポキシ樹脂の製造法Info
- Publication number
- JPS62242676A JPS62242676A JP8615986A JP8615986A JPS62242676A JP S62242676 A JPS62242676 A JP S62242676A JP 8615986 A JP8615986 A JP 8615986A JP 8615986 A JP8615986 A JP 8615986A JP S62242676 A JPS62242676 A JP S62242676A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- average
- epoxy
- parts
- naphthol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Epoxy Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8615986A JPS62242676A (ja) | 1986-04-16 | 1986-04-16 | エポキシ樹脂の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8615986A JPS62242676A (ja) | 1986-04-16 | 1986-04-16 | エポキシ樹脂の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62242676A true JPS62242676A (ja) | 1987-10-23 |
| JPH0545607B2 JPH0545607B2 (https=) | 1993-07-09 |
Family
ID=13878960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8615986A Granted JPS62242676A (ja) | 1986-04-16 | 1986-04-16 | エポキシ樹脂の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62242676A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122713A (ja) * | 1990-09-12 | 1992-04-23 | Hitachi Chem Co Ltd | 高分子量エポキシ樹脂の製造方法 |
| JPH04122714A (ja) * | 1990-09-12 | 1992-04-23 | Hitachi Chem Co Ltd | 高分子量エポキシ樹脂の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2043645A1 (de) * | 1970-09-03 | 1972-03-16 | Koelbel H | Selbsthaltende Epoxidharze |
| JPS60206824A (ja) * | 1984-03-30 | 1985-10-18 | Toshiba Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS6173719A (ja) * | 1984-09-20 | 1986-04-15 | Dainippon Ink & Chem Inc | 新規なエポキシ樹脂組成物 |
-
1986
- 1986-04-16 JP JP8615986A patent/JPS62242676A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2043645A1 (de) * | 1970-09-03 | 1972-03-16 | Koelbel H | Selbsthaltende Epoxidharze |
| JPS60206824A (ja) * | 1984-03-30 | 1985-10-18 | Toshiba Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS6173719A (ja) * | 1984-09-20 | 1986-04-15 | Dainippon Ink & Chem Inc | 新規なエポキシ樹脂組成物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04122713A (ja) * | 1990-09-12 | 1992-04-23 | Hitachi Chem Co Ltd | 高分子量エポキシ樹脂の製造方法 |
| JPH04122714A (ja) * | 1990-09-12 | 1992-04-23 | Hitachi Chem Co Ltd | 高分子量エポキシ樹脂の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0545607B2 (https=) | 1993-07-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3137202B2 (ja) | エポキシ樹脂、その製造方法及びエポキシ樹脂組成物 | |
| US4368299A (en) | Epoxy resin compositions | |
| US5155202A (en) | Phenolic novolak resins, cured substances therefrom and method for production thereof | |
| US3329737A (en) | Curable composition containing a polyepoxide and an allylic polyphenolic novolac, free of methylol groups | |
| US20020065386A1 (en) | Cyclopentylene compound and intermediate thereof, epoxy resin composition, molding material, and resin-encapsulated electronic device | |
| JPH03717A (ja) | 新規エポキシ樹脂及びその製造法 | |
| JPS62167318A (ja) | エポキシ樹脂の硬化方法 | |
| JPS62242676A (ja) | エポキシ樹脂の製造法 | |
| JP3074013B2 (ja) | エポキシ樹脂組成物及びその硬化物 | |
| JPH05287052A (ja) | エポキシ樹脂組成物、エポキシ樹脂の製法及び半導体封止材料 | |
| JPH10324733A (ja) | エポキシ樹脂組成物、エポキシ樹脂の製造方法及び半導体封止材料 | |
| JPH04255714A (ja) | 多官能エポキシ樹脂及びその製造方法 | |
| JPS62283969A (ja) | エポキシ樹脂の製造法 | |
| JPS60170653A (ja) | 収縮の少ないフラン接合剤用の酸硬化性混合物 | |
| JP3770343B2 (ja) | エポキシ樹脂組成物及び半導体封止材料 | |
| JP2001064358A (ja) | エポキシ樹脂組成物 | |
| KR102733315B1 (ko) | 반도체 접착제용 에폭시 수지, 이의 제조방법 및 이를 포함하는 조성물 | |
| JPS6377915A (ja) | フェノール類ノボラック組成物の製造法 | |
| JP2001151856A (ja) | 電子部品封止用エポキシ樹脂組成物 | |
| JPS6317875A (ja) | エポキシ樹脂の製造法 | |
| JPH05287053A (ja) | エポキシ樹脂、樹脂組成物及び硬化物 | |
| JPS6215217A (ja) | ビスフエノ−ルaノボラツク樹脂の製造法 | |
| JP3791711B2 (ja) | エポキシ樹脂組成物 | |
| JPH04282331A (ja) | 新規化合物、樹脂、樹脂組成物及び硬化物 | |
| JPH07216052A (ja) | エポキシ樹脂及びエポキシ樹脂組成物 |