JPS6222529B2 - - Google Patents

Info

Publication number
JPS6222529B2
JPS6222529B2 JP57118938A JP11893882A JPS6222529B2 JP S6222529 B2 JPS6222529 B2 JP S6222529B2 JP 57118938 A JP57118938 A JP 57118938A JP 11893882 A JP11893882 A JP 11893882A JP S6222529 B2 JPS6222529 B2 JP S6222529B2
Authority
JP
Japan
Prior art keywords
photoresist
circuit pattern
probe card
pattern
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57118938A
Other languages
English (en)
Japanese (ja)
Other versions
JPS599934A (ja
Inventor
Masao Ookubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP11893882A priority Critical patent/JPS599934A/ja
Publication of JPS599934A publication Critical patent/JPS599934A/ja
Publication of JPS6222529B2 publication Critical patent/JPS6222529B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11893882A 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法 Granted JPS599934A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11893882A JPS599934A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11893882A JPS599934A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Publications (2)

Publication Number Publication Date
JPS599934A JPS599934A (ja) 1984-01-19
JPS6222529B2 true JPS6222529B2 (enrdf_load_stackoverflow) 1987-05-19

Family

ID=14748941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11893882A Granted JPS599934A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Country Status (1)

Country Link
JP (1) JPS599934A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62233774A (ja) * 1986-04-03 1987-10-14 Matsushita Electric Ind Co Ltd 回路基板の検査方法
JPH0820465B2 (ja) * 1990-06-29 1996-03-04 シャープ株式会社 半導体装置の電気的検査方法
KR100196195B1 (ko) * 1991-11-18 1999-06-15 이노우에 쥰이치 프로우브 카드
WO1995034000A1 (fr) * 1994-06-03 1995-12-14 Hitachi, Ltd. Dispositif de connexion et sa fabrication
JP4841298B2 (ja) * 2006-04-14 2011-12-21 株式会社日本マイクロニクス プローブシートの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811739B2 (ja) * 1974-09-11 1983-03-04 松下電器産業株式会社 ハンドウタイソシソクテイヨウプロ−ブバリノセイゾウホウホウ
JPS51121267A (en) * 1975-04-17 1976-10-23 Seiko Epson Corp Semiconductor wafer measuring device

Also Published As

Publication number Publication date
JPS599934A (ja) 1984-01-19

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