JPS6159530B2 - - Google Patents

Info

Publication number
JPS6159530B2
JPS6159530B2 JP11893982A JP11893982A JPS6159530B2 JP S6159530 B2 JPS6159530 B2 JP S6159530B2 JP 11893982 A JP11893982 A JP 11893982A JP 11893982 A JP11893982 A JP 11893982A JP S6159530 B2 JPS6159530 B2 JP S6159530B2
Authority
JP
Japan
Prior art keywords
contact
photoresist
wafer
terminal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP11893982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS599935A (ja
Inventor
Masao Ookubo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP11893982A priority Critical patent/JPS599935A/ja
Publication of JPS599935A publication Critical patent/JPS599935A/ja
Publication of JPS6159530B2 publication Critical patent/JPS6159530B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11893982A 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法 Granted JPS599935A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11893982A JPS599935A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11893982A JPS599935A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Publications (2)

Publication Number Publication Date
JPS599935A JPS599935A (ja) 1984-01-19
JPS6159530B2 true JPS6159530B2 (enrdf_load_stackoverflow) 1986-12-17

Family

ID=14748965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11893982A Granted JPS599935A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Country Status (1)

Country Link
JP (1) JPS599935A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3128199B2 (ja) * 1996-06-28 2001-01-29 信越ポリマー株式会社 検査用プローブ

Also Published As

Publication number Publication date
JPS599935A (ja) 1984-01-19

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