JPS599934A - プロ−ブカ−ドの製造方法 - Google Patents

プロ−ブカ−ドの製造方法

Info

Publication number
JPS599934A
JPS599934A JP11893882A JP11893882A JPS599934A JP S599934 A JPS599934 A JP S599934A JP 11893882 A JP11893882 A JP 11893882A JP 11893882 A JP11893882 A JP 11893882A JP S599934 A JPS599934 A JP S599934A
Authority
JP
Japan
Prior art keywords
pattern
photoresist
probe card
circuit pattern
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11893882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6222529B2 (enrdf_load_stackoverflow
Inventor
Masao Okubo
昌男 大久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Priority to JP11893882A priority Critical patent/JPS599934A/ja
Publication of JPS599934A publication Critical patent/JPS599934A/ja
Publication of JPS6222529B2 publication Critical patent/JPS6222529B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP11893882A 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法 Granted JPS599934A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11893882A JPS599934A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11893882A JPS599934A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Publications (2)

Publication Number Publication Date
JPS599934A true JPS599934A (ja) 1984-01-19
JPS6222529B2 JPS6222529B2 (enrdf_load_stackoverflow) 1987-05-19

Family

ID=14748941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11893882A Granted JPS599934A (ja) 1982-07-07 1982-07-07 プロ−ブカ−ドの製造方法

Country Status (1)

Country Link
JP (1) JPS599934A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62233774A (ja) * 1986-04-03 1987-10-14 Matsushita Electric Ind Co Ltd 回路基板の検査方法
JPH0462479A (ja) * 1990-06-29 1992-02-27 Sharp Corp 半導体装置の電気的検査方法
US5412329A (en) * 1991-11-18 1995-05-02 Tokyo Electron Yamanashi Limited Probe card
WO1995034000A1 (fr) * 1994-06-03 1995-12-14 Hitachi, Ltd. Dispositif de connexion et sa fabrication
US20110159444A1 (en) * 2006-04-14 2011-06-30 Kabushiki Kaisha Nihon Micronics Method for manufacturing probe sheet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132181A (en) * 1974-09-11 1976-03-18 Matsushita Electric Industrial Co Ltd Handotaisoshisokuteiyopuroobubarinoseizohoho
JPS51121267A (en) * 1975-04-17 1976-10-23 Seiko Epson Corp Semiconductor wafer measuring device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5132181A (en) * 1974-09-11 1976-03-18 Matsushita Electric Industrial Co Ltd Handotaisoshisokuteiyopuroobubarinoseizohoho
JPS51121267A (en) * 1975-04-17 1976-10-23 Seiko Epson Corp Semiconductor wafer measuring device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62233774A (ja) * 1986-04-03 1987-10-14 Matsushita Electric Ind Co Ltd 回路基板の検査方法
JPH0462479A (ja) * 1990-06-29 1992-02-27 Sharp Corp 半導体装置の電気的検査方法
US5412329A (en) * 1991-11-18 1995-05-02 Tokyo Electron Yamanashi Limited Probe card
WO1995034000A1 (fr) * 1994-06-03 1995-12-14 Hitachi, Ltd. Dispositif de connexion et sa fabrication
US20110159444A1 (en) * 2006-04-14 2011-06-30 Kabushiki Kaisha Nihon Micronics Method for manufacturing probe sheet
US8202684B2 (en) * 2006-04-14 2012-06-19 Kabushiki Kaisha Nihon Micronics Method for manufacturing probe sheet

Also Published As

Publication number Publication date
JPS6222529B2 (enrdf_load_stackoverflow) 1987-05-19

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