JPS599934A - Manufacture of probe card - Google Patents

Abstract

PURPOSE:To prevent the generation of displacement among contactors by forming a pattern of a lead section onto an insulator having elasticity, fixing the insulator onto a printed wiring board and electrically connecting the insulator and the wiring board. CONSTITUTION:A photo-resist is applied to a copper plate, a circuit pattern consisting of the terminal patterns 3 of a semiconductor wafer to be tested and the patterns 4 of the lead sections is baked photographically so that the pattern is exposed to light, and developed, and the unnecessary resist of sections except the circuit pattern is removed. When an elastic plate 5 and a reinforcing plate 6 are pasted from the back side of the copper plate and the copper plate is etched and the photo-resist is removed, the terminal patterns of copper are formed to the surface of the elastic plate 5. The elastic plate is bonded and fixed onto a printed wiring substrate 7, and each lead section 4 and the predetermined wirings 8 of the substrate 7 are connected electrically. According to the manufacture, the contactors to wafer terminals are obtained regardless of the number of terminals of the wafer and the complexity of alignment patterns, and displacement is not generated among the contactors.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a probe card used for testing semiconductor wafers.

Conventional probe cards have probes arranged radially around an insulating substrate with a hole in the center for observation using a microscope, surrounding the hole. During manufacture, a probe card is manufactured by inserting a probe into the hole through the hole and placing the probe under the hole. It is necessary to adjust the position of each probe so that the tip of the probe matches the arrangement position of the wafer's terminals while observing the terminals of the semiconductor wafer to be tested or the diagram depicting the arrangement position of the terminals. be. Not only is this process becoming increasingly time-consuming and complex, especially as the number of terminals on wafers increases, but probe cards manufactured in this way are also difficult to handle. There are disadvantages such as the position of the probe changing due to slight carelessness, requiring readjustment of the probe position, and also disadvantages such as the tip slipping if the wafer terminal is a hump type. be.

The present invention eliminates the above-mentioned drawbacks and eliminates the problem in that the relative positional relationship between the contact pieces on one wafer terminal deviates during a certain work process regardless of the number of terminals on the wafer or the complexity of the terminal arrangement pattern. It is an object of the present invention to provide a method for manufacturing a probe card that does not cause slippage on contacts even if the terminals are hump-shaped.

For the following two purposes, the present invention includes a step of forming a pattern of a wafer terminal and a lead portion connected thereto on an elastic insulator by a metal photoetching method, and a step of forming the pattern on the surface. The method consists of the steps of fixing the printed insulator onto a printed wiring board and making a predetermined electrical connection between the pattern and the printed wiring.

Embodiments of the present invention will be described below based on the drawings.

First, as shown in FIG. 1, a copper plate 1 with a thickness Q of 2 mm is coated with a fumetresist such as Microresist 752 manufactured by Kodanok Co., Ltd., and the terminal pattern 3 of the semiconductor wafer to be tested is connected to the external circuit. A circuit pattern consisting of pattern 4 of the lead part for
After photo-printing so that the area is exposed to light, it is developed using, for example, Kodanok's Microresist Diheronova to remove unnecessary resist from areas other than the circuit pattern.

FIG. 2 shows the state of adhesion of the fumetresist on the copper plate at this stage in a cross section taken along line L in FIG. Next, as shown in FIG.
After pasting the rubber and plastic reinforcing plate 6 with a thickness of 11, etching is applied to the copper plate 1 (Fig. 4).
Furthermore, when the photoresist remaining on the copper surface is removed using a microresist removal solution manufactured by Kodanok, a copper terminal pattern is formed on the surface of the elastic plate 5, as shown in FIG. A perspective view of this from diagonally above is shown in FIG. In FIG. 6, the circuit pattern is formed by etching the copper plate 1, and here it is indicated by the symbol 1.
Instead, symbols 3 (terminal) and 4 (lead) are used for each part of the circuit pattern, corresponding to the terminal pattern and lead pattern in FIG. 1. As shown in FIG. 7, this is adhesively fixed onto a pre-prepared printed wiring board 7, and an electrical connection is made between each lead part 4 and a predetermined wiring 8 of the printed wiring board 7. By doing this, a probe card according to the manufacturing method of the present invention is obtained. 8th
The figure shows a cross section of the probe card 7 along line M in FIG.

As described above, according to the present invention, the contacts to the terminals of the wafer to be tested can be obtained by a constant photoetching process, regardless of the number of terminals or the complexity of the arrangement pattern. There is no difference between the children. Furthermore, if the probe card manufactured by the method based on the present invention is used, the two-dimensional positional relationship between the wafer and the probe card can be adjusted even when positioning the contact between the contact and one terminal of the wafer during wafer testing. need only be determined once, and there is no need to use a microscope to monitor and adjust the contact between the probe side and the wafer terminal for each probe, as is the case with conventional probe cards.

[Brief explanation of the drawing]

FIG. 1 shows the pattern to be photoetched in an embodiment of the invention. FIGS. 2 and 3 are diagrams for explaining the preparation process for photoetching. FIG. 4 is a cross-sectional view of a pattern formed on an elastic plate by photoetching. Figures 5 and 6 are cross-sectional and perspective views, respectively, of the copper pattern formed on the elastic plate after the residual photoresist has been removed. FIGS. 7 and 8 are a plan view and a sectional view, respectively, of a probe card manufactured according to this example. ■...Copper plate, 2...Photoresist, 3
...Terminal pattern, 4...Lead pattern, 5...
- Elastic board, 6... Reinforcement board, 7... Printed wiring board, 8... Printed wiring. Patent Applicant Japan Electronic Materials Co., Ltd. Agent Patent Attorney Nishi 1) New Procedural Amendment (Movement) 1981 Patent Layer No. 118938 2, Title of Invention Method of Probe Card Manufacturing 3, Amendment to Person Case Related Patent Applicant Address 167 Unogami, Kuchitanaka, Amagasaki City, Hyogo Prefecture 10 names
Japan Electronic Materials Co., Ltd. Representative Masao Okubo 4, Agent

Claims (1)

[Claims] A photoresist is applied to one side of a metal plate, and a circuit pattern consisting of a terminal pattern of a semiconductor wafer to be tested and a pattern connected to the terminal pattern to form a lead part is photoprinted on the photoresist, and then the circuit pattern is printed on the photoresist. After removing the photoresist from other parts, attaching an elastic insulating plate to the side of the metal plate on which the photoresist was not applied, and etching the metal plate from the side with the circuit pattern. After the metal portion showing the circuit pattern is left on the insulating plate 2, the photoresist remaining on the surface of the metal portion is removed, the insulating plate is fixed to the printed wiring board 2, and the circuit pattern is formed on the insulating plate 2. A method for manufacturing a probe card, comprising electrically connecting a lead portion of the probe card to a predetermined wiring of the printed wiring board.