JPS62204575A - 薄膜半導体装置およびその製造方法 - Google Patents
薄膜半導体装置およびその製造方法Info
- Publication number
- JPS62204575A JPS62204575A JP61047842A JP4784286A JPS62204575A JP S62204575 A JPS62204575 A JP S62204575A JP 61047842 A JP61047842 A JP 61047842A JP 4784286 A JP4784286 A JP 4784286A JP S62204575 A JPS62204575 A JP S62204575A
- Authority
- JP
- Japan
- Prior art keywords
- silicon nitride
- film
- semiconductor device
- thin film
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
Landscapes
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61047842A JPS62204575A (ja) | 1986-03-05 | 1986-03-05 | 薄膜半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61047842A JPS62204575A (ja) | 1986-03-05 | 1986-03-05 | 薄膜半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62204575A true JPS62204575A (ja) | 1987-09-09 |
| JPH0556872B2 JPH0556872B2 (enrdf_load_stackoverflow) | 1993-08-20 |
Family
ID=12786620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61047842A Granted JPS62204575A (ja) | 1986-03-05 | 1986-03-05 | 薄膜半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204575A (enrdf_load_stackoverflow) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01185926A (ja) * | 1988-01-20 | 1989-07-25 | Nec Corp | 窒化シリコン膜の製造方法 |
| JPH029129A (ja) * | 1988-06-28 | 1990-01-12 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH02103936A (ja) * | 1988-10-13 | 1990-04-17 | Mitsubishi Electric Corp | 半導体装置 |
| JPH02187030A (ja) * | 1989-01-13 | 1990-07-23 | Kawasaki Steel Corp | 半導体装置への保護膜の形成方法 |
| US6693301B2 (en) | 1991-10-16 | 2004-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving and manufacturing the same |
| US6713783B1 (en) | 1991-03-15 | 2004-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Compensating electro-optical device including thin film transistors |
| US7071910B1 (en) | 1991-10-16 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Electrooptical device and method of driving and manufacturing the same |
| US7116302B2 (en) | 1991-10-16 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Process of operating active matrix display device having thin film transistors |
| US7253440B1 (en) | 1991-10-16 | 2007-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having at least first and second thin film transistors |
| US8183135B2 (en) | 2003-03-13 | 2012-05-22 | Nec Corporation | Method for manufacturing thin film transistor having hydrogen feeding layer formed between a metal gate and a gate insulating film |
| WO2013179837A1 (ja) * | 2012-05-28 | 2013-12-05 | シャープ株式会社 | 半導体装置およびその製造方法 |
| WO2016035627A1 (ja) * | 2014-09-02 | 2016-03-10 | シャープ株式会社 | 半導体装置及び半導体装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128851A (en) * | 1979-03-28 | 1980-10-06 | Hitachi Ltd | Semiconductor memory device |
| JPS60136259A (ja) * | 1983-12-24 | 1985-07-19 | Sony Corp | 電界効果型トランジスタの製造方法 |
-
1986
- 1986-03-05 JP JP61047842A patent/JPS62204575A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55128851A (en) * | 1979-03-28 | 1980-10-06 | Hitachi Ltd | Semiconductor memory device |
| JPS60136259A (ja) * | 1983-12-24 | 1985-07-19 | Sony Corp | 電界効果型トランジスタの製造方法 |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01185926A (ja) * | 1988-01-20 | 1989-07-25 | Nec Corp | 窒化シリコン膜の製造方法 |
| JPH029129A (ja) * | 1988-06-28 | 1990-01-12 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPH02103936A (ja) * | 1988-10-13 | 1990-04-17 | Mitsubishi Electric Corp | 半導体装置 |
| JPH02187030A (ja) * | 1989-01-13 | 1990-07-23 | Kawasaki Steel Corp | 半導体装置への保護膜の形成方法 |
| US6713783B1 (en) | 1991-03-15 | 2004-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Compensating electro-optical device including thin film transistors |
| US6759680B1 (en) | 1991-10-16 | 2004-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device having thin film transistors |
| US6693301B2 (en) | 1991-10-16 | 2004-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method of driving and manufacturing the same |
| US7071910B1 (en) | 1991-10-16 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Electrooptical device and method of driving and manufacturing the same |
| US7116302B2 (en) | 1991-10-16 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Process of operating active matrix display device having thin film transistors |
| US7253440B1 (en) | 1991-10-16 | 2007-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having at least first and second thin film transistors |
| US8183135B2 (en) | 2003-03-13 | 2012-05-22 | Nec Corporation | Method for manufacturing thin film transistor having hydrogen feeding layer formed between a metal gate and a gate insulating film |
| WO2013179837A1 (ja) * | 2012-05-28 | 2013-12-05 | シャープ株式会社 | 半導体装置およびその製造方法 |
| CN104335332A (zh) * | 2012-05-28 | 2015-02-04 | 夏普株式会社 | 半导体装置及其制造方法 |
| WO2016035627A1 (ja) * | 2014-09-02 | 2016-03-10 | シャープ株式会社 | 半導体装置及び半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0556872B2 (enrdf_load_stackoverflow) | 1993-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5747866A (en) | Application of thin crystalline Si3 N4 liners in shallow trench isolation (STI) structures | |
| JP3202893B2 (ja) | 低温オゾン・プラズマ・アニールによる酸化タンタル薄膜製造方法 | |
| JPH09116104A (ja) | 半導体素子のキャパシタ製造方法 | |
| JPS62204575A (ja) | 薄膜半導体装置およびその製造方法 | |
| JP3142457B2 (ja) | 強誘電体薄膜キャパシタの製造方法 | |
| JPH05259297A (ja) | 半導体素子の製造方法 | |
| JPH05167008A (ja) | 半導体素子の製造方法 | |
| JPH11261075A5 (enrdf_load_stackoverflow) | ||
| US5966624A (en) | Method of manufacturing a semiconductor structure having a crystalline layer | |
| JPH03179778A (ja) | 薄膜半導体形成用絶縁基板 | |
| JPH10214889A (ja) | シャロートレンチアイソレーション構造内に結晶質窒化珪素被膜の薄膜を形成する方法、サブミクロンの集積回路デバイス用のシャロートレンチアイソレーション構造及び結晶質窒化珪素被膜 | |
| US4224636A (en) | Semiconductor device with thermally compensating SiO2 -silicate glass-SiC passivation layer | |
| US6579614B2 (en) | Structure having refractory metal film on a substrate | |
| KR19980024277A (ko) | 패시베이션막을 구비하는 반도체 장치 | |
| JP2001036078A5 (enrdf_load_stackoverflow) | ||
| JPH0555199A (ja) | 半導体装置 | |
| JPH02130961A (ja) | 電界効果型トランジスタ | |
| JPH05129286A (ja) | 窒化シリコン膜 | |
| JPH08335703A (ja) | 薄膜トランジスタ及びその製造方法 | |
| JPH04326576A (ja) | 半導体装置の製造方法 | |
| JP3932816B2 (ja) | 半導体装置の製造方法 | |
| JPH03107463A (ja) | 絶縁膜形成方法及び装置 | |
| JP3259641B2 (ja) | 半導体装置の保護膜構造 | |
| JP2501209B2 (ja) | ガラス基板およびその製造方法 | |
| JPS649729B2 (enrdf_load_stackoverflow) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |