JPS6220206B2 - - Google Patents
Info
- Publication number
- JPS6220206B2 JPS6220206B2 JP58090621A JP9062183A JPS6220206B2 JP S6220206 B2 JPS6220206 B2 JP S6220206B2 JP 58090621 A JP58090621 A JP 58090621A JP 9062183 A JP9062183 A JP 9062183A JP S6220206 B2 JPS6220206 B2 JP S6220206B2
- Authority
- JP
- Japan
- Prior art keywords
- naphthol
- polyglycidyl ether
- formula
- resin
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
- Epoxy Compounds (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58090621A JPS59230017A (ja) | 1983-05-25 | 1983-05-25 | 新規ポリグリシジルエ−テル及びその製法 |
| US06/613,306 US4551508A (en) | 1983-05-25 | 1984-05-23 | Polyglycidyl ethers, process for production thereof, and cured products thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58090621A JPS59230017A (ja) | 1983-05-25 | 1983-05-25 | 新規ポリグリシジルエ−テル及びその製法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27976986A Division JPS62143920A (ja) | 1986-11-26 | 1986-11-26 | エポキシ樹脂 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59230017A JPS59230017A (ja) | 1984-12-24 |
| JPS6220206B2 true JPS6220206B2 (enExample) | 1987-05-06 |
Family
ID=14003556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58090621A Granted JPS59230017A (ja) | 1983-05-25 | 1983-05-25 | 新規ポリグリシジルエ−テル及びその製法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4551508A (enExample) |
| JP (1) | JPS59230017A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632495U (ja) * | 1992-09-28 | 1994-04-28 | 日本輸送機株式会社 | フルフリーマスト装置における緩衝装置 |
| WO2012023435A1 (ja) | 2010-08-19 | 2012-02-23 | Dic株式会社 | エポキシ化合物、硬化性組成物、及びその硬化物 |
| WO2013042438A1 (ja) | 2011-09-21 | 2013-03-28 | Dic株式会社 | エポキシ樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| US9736926B2 (en) | 2012-09-26 | 2017-08-15 | Dic Corporation | Epoxy resin, curable resin composition, cured product thereof, and printed circuit board |
| WO2021149736A1 (ja) | 2020-01-22 | 2021-07-29 | 日本化薬株式会社 | エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物 |
| WO2021193303A1 (ja) | 2020-03-23 | 2021-09-30 | 日本化薬株式会社 | エポキシ樹脂、エポキシ化合物、エポキシ樹脂組成物、樹脂シート、プリプレグ、炭素繊維強化複合材料、及びフェノール樹脂 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62167318A (ja) * | 1986-01-20 | 1987-07-23 | Teijin Ltd | エポキシ樹脂の硬化方法 |
| US4940809A (en) * | 1987-10-09 | 1990-07-10 | Shell Oil Company | Bis-anthrols and bis-naphthols and diglycidyl ethers thereof |
| US4908424A (en) * | 1987-10-09 | 1990-03-13 | Shell Oil Company | Bis-anthrols and bis-naphthols and diglycidyl ethers thereof |
| US4847011A (en) * | 1987-10-09 | 1989-07-11 | Shell Oil Company | Bis-anthrols and bis-naphthols and diglycidyl ethers thereof |
| US5008350A (en) * | 1987-12-16 | 1991-04-16 | Sumitomo Chemical Company, Limited | Glycidyl ethers of phenolic compounds and process for producing the same |
| JPH0617440B2 (ja) * | 1989-05-30 | 1994-03-09 | 新日鐵化学株式会社 | 新規エポキシ樹脂及びその製造法 |
| CA2033978C (en) * | 1989-06-20 | 1995-02-14 | Nippon Kayaku Kabushiki Kaisha | Phenolic novolak resins, cured substances therefrom and method for production thereof |
| JPH0390075A (ja) * | 1989-09-01 | 1991-04-16 | Nippon Steel Chem Co Ltd | エポキシ樹脂及びその中間体並びにその製造法 |
| EP0439171B1 (en) * | 1990-01-25 | 1995-12-06 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition and semiconductor device encapsulated therewith |
| US5302672A (en) * | 1991-02-27 | 1994-04-12 | Dainippon Ink And Chemicals, Inc. | 2,7-dihydroxynaphthalene based epoxy resin, intermediate thereof, processes for producing them, and epoxy resin composition |
| JPH04300914A (ja) * | 1991-03-29 | 1992-10-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2526747B2 (ja) * | 1991-05-21 | 1996-08-21 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
| US5290882A (en) * | 1991-08-13 | 1994-03-01 | Shin-Etsu Chemical Co., Ltd. | Thermosetting resin compositions |
| US5223602A (en) * | 1992-01-24 | 1993-06-29 | Nippon Steel Chemical Co., Ltd. | Naphthol aralkyl resins and cured products thereof |
| KR100512171B1 (ko) * | 2003-01-24 | 2005-09-02 | 삼성전자주식회사 | 하층 레지스트용 조성물 |
| EP2532710B1 (en) * | 2010-02-03 | 2018-08-22 | DIC Corporation | Phenol resin composition, curable resin composition, cured products thereof, and printed circuit board |
| JP2013173838A (ja) * | 2012-02-24 | 2013-09-05 | Dic Corp | シアン酸エステル樹脂、硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及び、ビルドアップフィルム |
| TWI675051B (zh) * | 2014-10-10 | 2019-10-21 | 日商迪愛生股份有限公司 | 萘酚型杯芳烴化合物及其製造方法、感光性組成物、光阻材料、及塗膜 |
| RU2736820C2 (ru) * | 2015-09-03 | 2020-11-20 | Торэй Индастриз, Инк. | Композиция эпоксидной смолы, препрег и композитный материал, армированный углеродным волокном |
| JP6098908B2 (ja) * | 2016-01-19 | 2017-03-22 | Dic株式会社 | 硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及び、ビルドアップフィルム |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3996185A (en) * | 1972-11-29 | 1976-12-07 | Gulf Research & Development Company | Polyepoxy resin-diaryl dianhydride laminating resins and laminates |
| SU513993A1 (ru) * | 1974-04-17 | 1976-05-15 | Сумгаитский Филиал Ордена Трудового Красного Знамени Институт Нефтехимических Процессов Им.Академика Ю.Г. Мамедалиева Ан Азербайджанской Сср | Глицидиловый эфир полиоксинафтилена |
| JPS56116717A (en) * | 1980-02-20 | 1981-09-12 | Yuka Shell Epoxy Kk | Preparation of novolak-type epoxy resin |
| JPS5936123A (ja) * | 1982-08-20 | 1984-02-28 | Sumitomo Chem Co Ltd | 新規なノボラツク型置換フエノ−ル樹脂のグリシジルエ−テル、その製造法およびこれを主成分とする封止剤 |
-
1983
- 1983-05-25 JP JP58090621A patent/JPS59230017A/ja active Granted
-
1984
- 1984-05-23 US US06/613,306 patent/US4551508A/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0632495U (ja) * | 1992-09-28 | 1994-04-28 | 日本輸送機株式会社 | フルフリーマスト装置における緩衝装置 |
| WO2012023435A1 (ja) | 2010-08-19 | 2012-02-23 | Dic株式会社 | エポキシ化合物、硬化性組成物、及びその硬化物 |
| US8519065B2 (en) | 2010-08-19 | 2013-08-27 | Dic Corporation | Epoxy compound, curable composition, and cured product thereof |
| WO2013042438A1 (ja) | 2011-09-21 | 2013-03-28 | Dic株式会社 | エポキシ樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 |
| US9125309B2 (en) | 2011-09-21 | 2015-09-01 | Dic Corporation | Epoxy resin, curable resin composition and cured product thereof, and printed wiring board |
| US9736926B2 (en) | 2012-09-26 | 2017-08-15 | Dic Corporation | Epoxy resin, curable resin composition, cured product thereof, and printed circuit board |
| WO2021149736A1 (ja) | 2020-01-22 | 2021-07-29 | 日本化薬株式会社 | エポキシ樹脂混合物、エポキシ樹脂組成物およびその硬化物 |
| WO2021193303A1 (ja) | 2020-03-23 | 2021-09-30 | 日本化薬株式会社 | エポキシ樹脂、エポキシ化合物、エポキシ樹脂組成物、樹脂シート、プリプレグ、炭素繊維強化複合材料、及びフェノール樹脂 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59230017A (ja) | 1984-12-24 |
| US4551508A (en) | 1985-11-05 |
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