JPS62169354A - 半導体装置の実装構造 - Google Patents

半導体装置の実装構造

Info

Publication number
JPS62169354A
JPS62169354A JP30370786A JP30370786A JPS62169354A JP S62169354 A JPS62169354 A JP S62169354A JP 30370786 A JP30370786 A JP 30370786A JP 30370786 A JP30370786 A JP 30370786A JP S62169354 A JPS62169354 A JP S62169354A
Authority
JP
Japan
Prior art keywords
solder
lead
tip
semiconductor device
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30370786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0321096B2 (enrdf_load_stackoverflow
Inventor
Fumihito Inoue
文仁 井上
Kazuo Shimizu
一男 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP30370786A priority Critical patent/JPS62169354A/ja
Publication of JPS62169354A publication Critical patent/JPS62169354A/ja
Publication of JPH0321096B2 publication Critical patent/JPH0321096B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP30370786A 1986-12-22 1986-12-22 半導体装置の実装構造 Granted JPS62169354A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30370786A JPS62169354A (ja) 1986-12-22 1986-12-22 半導体装置の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30370786A JPS62169354A (ja) 1986-12-22 1986-12-22 半導体装置の実装構造

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP133480A Division JPS5698853A (en) 1980-01-11 1980-01-11 Structure of lead in semiconductor device

Publications (2)

Publication Number Publication Date
JPS62169354A true JPS62169354A (ja) 1987-07-25
JPH0321096B2 JPH0321096B2 (enrdf_load_stackoverflow) 1991-03-20

Family

ID=17924283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30370786A Granted JPS62169354A (ja) 1986-12-22 1986-12-22 半導体装置の実装構造

Country Status (1)

Country Link
JP (1) JPS62169354A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166630A (ja) * 2006-12-29 2008-07-17 Jst Mfg Co Ltd 実装部材及びその製造方法
JP2013051373A (ja) * 2011-08-31 2013-03-14 Fujifilm Corp 電子機器の製造方法
US20220157699A1 (en) * 2019-03-18 2022-05-19 Ampleon Netherlands B.V. Electronic Molded Package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698853A (en) * 1980-01-11 1981-08-08 Hitachi Ltd Structure of lead in semiconductor device
JPS6342416A (ja) * 1986-08-08 1988-02-23 Hitoshi Ito 調髪角度計測器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698853A (en) * 1980-01-11 1981-08-08 Hitachi Ltd Structure of lead in semiconductor device
JPS6342416A (ja) * 1986-08-08 1988-02-23 Hitoshi Ito 調髪角度計測器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166630A (ja) * 2006-12-29 2008-07-17 Jst Mfg Co Ltd 実装部材及びその製造方法
JP2013051373A (ja) * 2011-08-31 2013-03-14 Fujifilm Corp 電子機器の製造方法
US20220157699A1 (en) * 2019-03-18 2022-05-19 Ampleon Netherlands B.V. Electronic Molded Package
US12087678B2 (en) * 2019-03-18 2024-09-10 Ampleon Netherlands B.V. Electronic molded package

Also Published As

Publication number Publication date
JPH0321096B2 (enrdf_load_stackoverflow) 1991-03-20

Similar Documents

Publication Publication Date Title
JP3730412B2 (ja) 半導体集積回路装置およびその製造方法
JP3663295B2 (ja) チップスケールパッケージ
JPS62169354A (ja) 半導体装置の実装構造
JPS6342416B2 (enrdf_load_stackoverflow)
JPH0626280U (ja) 半導体装置のリード構造
JPS62262447A (ja) 半導体パツケ−ジとその実装方法
JPH0215662A (ja) 集積回路のリードメッキ方法
JP2583353B2 (ja) 半導体装置用リードフレーム
JPS63250163A (ja) 半導体集積回路装置
JPH0625017Y2 (ja) Ｌｓｉパッケ−ジのリ−ド構造
JP2595881B2 (ja) 表面実装型集積回路パッケージのリード端子の固着方法
JP2774566B2 (ja) 半導体装置のリードフレーム
JPH07154048A (ja) 電子部品の外部リード
JP3048236B2 (ja) 電子部品
JPH06334090A (ja) 樹脂封止型半導体装置のリード構造およびその製造方法
JPH07130937A (ja) 表面実装型半導体装置およびその製造に用いるリードフレーム
JP2991174B2 (ja) 半導体装置用リードフレームおよびその半導体装置の製造方法
JPS60161693A (ja) プリント基板
JPH0442934Y2 (enrdf_load_stackoverflow)
JP2820133B2 (ja) 半導体パッケージ
JPS6223136A (ja) 半導体装置
JPH0343979A (ja) フラットパッケージ
JPS63128574A (ja) コネクタピン
JPH0722569A (ja) アウターリード及びそれを用いた半導体装置
JPH04162466A (ja) 半導体装置用リードフレーム