JPS6216018B2 - - Google Patents
Info
- Publication number
- JPS6216018B2 JPS6216018B2 JP5114082A JP5114082A JPS6216018B2 JP S6216018 B2 JPS6216018 B2 JP S6216018B2 JP 5114082 A JP5114082 A JP 5114082A JP 5114082 A JP5114082 A JP 5114082A JP S6216018 B2 JPS6216018 B2 JP S6216018B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- alignment
- probe
- chip
- probe needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000012937 correction Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5114082A JPS58169922A (ja) | 1982-03-31 | 1982-03-31 | オ−トプロ−バにおけるウエハ−のアライメント方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5114082A JPS58169922A (ja) | 1982-03-31 | 1982-03-31 | オ−トプロ−バにおけるウエハ−のアライメント方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58169922A JPS58169922A (ja) | 1983-10-06 |
JPS6216018B2 true JPS6216018B2 (ko) | 1987-04-10 |
Family
ID=12878509
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5114082A Granted JPS58169922A (ja) | 1982-03-31 | 1982-03-31 | オ−トプロ−バにおけるウエハ−のアライメント方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58169922A (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH065690B2 (ja) * | 1983-07-19 | 1994-01-19 | 東京エレクトロン株式会社 | 半導体ウエハプローブ方法 |
JPS6024030A (ja) * | 1983-07-19 | 1985-02-06 | Telmec Co Ltd | 半導体ウエハ測定方法 |
US4755746A (en) * | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
US4943767A (en) * | 1986-08-21 | 1990-07-24 | Tokyo Electron Limited | Automatic wafer position aligning method for wafer prober |
JP2582256B2 (ja) * | 1987-04-23 | 1997-02-19 | 東京エレクトロン株式会社 | プロービング方法 |
JPH0748509B2 (ja) * | 1987-04-28 | 1995-05-24 | 東京エレクトロン株式会社 | プロ−ビング方法 |
-
1982
- 1982-03-31 JP JP5114082A patent/JPS58169922A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58169922A (ja) | 1983-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2963603B2 (ja) | プローブ装置のアライメント方法 | |
JPS6362245A (ja) | ウエハプロ−バ | |
JP4996119B2 (ja) | プローブの先端位置の検出方法、この方法を記録した記憶媒体、及びプローブ装置 | |
JPS6115341A (ja) | ウエハプロ−バ | |
US7977957B2 (en) | Method and apparatus for electrical testing of a unit under test, as well as a method for production of a contact-making apparatus which is used for testing | |
JPH07297242A (ja) | プローブ方法及びその装置 | |
JPS6216018B2 (ko) | ||
JP2004063877A (ja) | ウェハの位置決め修正方法 | |
US4966520A (en) | Method of positioning objects to be measured | |
JPH067561B2 (ja) | 半導体ウエハチツプの位置合わせ方法 | |
JP2005150224A (ja) | プローブ情報を用いた半導体検査装置及び検査方法 | |
JPH0441495B2 (ko) | ||
KR20100109358A (ko) | 얼라인먼트 기능을 갖는 반도체 검사장치와 얼라인먼트 방법 | |
JPH0384945A (ja) | 位置合せ方法およびそれを用いた検査装置 | |
JPH065690B2 (ja) | 半導体ウエハプローブ方法 | |
JPS6279640A (ja) | ウエハプロ−バ装置 | |
JP7174555B2 (ja) | 基板検査装置、その位置合せ、及び基板検査方法 | |
JPS6184029A (ja) | 半導体検査装置 | |
JP2006318965A (ja) | 半導体デバイスの検査方法および半導体デバイス検査装置 | |
JP2005123293A (ja) | プローブ検査方法 | |
JP2939665B2 (ja) | 半導体ウエハの測定方法 | |
JP2501613B2 (ja) | ウエハプロ―バ | |
JP2694462B2 (ja) | 半導体ウェーハチップの位置合わせ方法 | |
JPH04283672A (ja) | 分割試験ヘッドの位置補正方法及び装置 | |
JPS6115340A (ja) | ウエハプロ−バ |