JPH0441495B2 - - Google Patents

Info

Publication number
JPH0441495B2
JPH0441495B2 JP58132179A JP13217983A JPH0441495B2 JP H0441495 B2 JPH0441495 B2 JP H0441495B2 JP 58132179 A JP58132179 A JP 58132179A JP 13217983 A JP13217983 A JP 13217983A JP H0441495 B2 JPH0441495 B2 JP H0441495B2
Authority
JP
Japan
Prior art keywords
needle
chip
semiconductor wafer
contact
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58132179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6024030A (ja
Inventor
Junichi Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP13217983A priority Critical patent/JPS6024030A/ja
Publication of JPS6024030A publication Critical patent/JPS6024030A/ja
Publication of JPH0441495B2 publication Critical patent/JPH0441495B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
JP13217983A 1983-07-19 1983-07-19 半導体ウエハ測定方法 Granted JPS6024030A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13217983A JPS6024030A (ja) 1983-07-19 1983-07-19 半導体ウエハ測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13217983A JPS6024030A (ja) 1983-07-19 1983-07-19 半導体ウエハ測定方法

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP41769690A Division JP2717884B2 (ja) 1990-12-15 1990-12-15 半導体ウエハ測定方法
JP2417697A Division JPH0828408B2 (ja) 1990-12-15 1990-12-15 半導体ウエハ測定方法
JP14953791A Division JPH0618229B2 (ja) 1991-05-24 1991-05-24 半導体ウエハの検査装置

Publications (2)

Publication Number Publication Date
JPS6024030A JPS6024030A (ja) 1985-02-06
JPH0441495B2 true JPH0441495B2 (ko) 1992-07-08

Family

ID=15075226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13217983A Granted JPS6024030A (ja) 1983-07-19 1983-07-19 半導体ウエハ測定方法

Country Status (1)

Country Link
JP (1) JPS6024030A (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0713990B2 (ja) * 1985-04-02 1995-02-15 東京エレクトロン株式会社 プローブ針とパッドの位置合わせ方法
JPH0714757B2 (ja) * 1986-09-29 1995-02-22 株式会社タツノ・メカトロニクス 燃料油配送車
JPS63265441A (ja) * 1987-04-23 1988-11-01 Tokyo Electron Ltd 測定装置
US5041845A (en) * 1987-10-13 1991-08-20 Canon Kabushiki Kaisha Heat transfer recording apparatus with a common drive source for selective plural functions
JPH01257074A (ja) * 1988-04-07 1989-10-13 Canon Inc 熱転写記録装置
JPH0828408B2 (ja) * 1990-12-15 1996-03-21 東京エレクトロン株式会社 半導体ウエハ測定方法
JP2726651B2 (ja) * 1996-04-22 1998-03-11 東京エレクトロン株式会社 不良素子へのマーキング方法
WO2010073359A1 (ja) 2008-12-26 2010-07-01 富士通セミコンダクター株式会社 プローバ、試験装置、及び半導体チップの検査方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121638A (ja) * 1982-01-12 1983-07-20 Nec Home Electronics Ltd ウエ−ハプロ−バ用検針のチエツク方法
JPS58169922A (ja) * 1982-03-31 1983-10-06 Fujitsu Ltd オ−トプロ−バにおけるウエハ−のアライメント方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121638A (ja) * 1982-01-12 1983-07-20 Nec Home Electronics Ltd ウエ−ハプロ−バ用検針のチエツク方法
JPS58169922A (ja) * 1982-03-31 1983-10-06 Fujitsu Ltd オ−トプロ−バにおけるウエハ−のアライメント方法

Also Published As

Publication number Publication date
JPS6024030A (ja) 1985-02-06

Similar Documents

Publication Publication Date Title
KR0138754B1 (ko) 전기회로측정용 탐침의 접촉검지장치 및 이 접촉검지장치를 이용한 전기회로 측정장치
JPS6362245A (ja) ウエハプロ−バ
JPH0441495B2 (ko)
JPH0713990B2 (ja) プローブ針とパッドの位置合わせ方法
JPH065690B2 (ja) 半導体ウエハプローブ方法
JPH09230005A (ja) 回路基板検査装置
JPS6279640A (ja) ウエハプロ−バ装置
JPS6216018B2 (ko)
JPH04340241A (ja) 半導体ウエハの検査装置
JP2501613B2 (ja) ウエハプロ―バ
JPH0828408B2 (ja) 半導体ウエハ測定方法
KR100615086B1 (ko) 반도체 웨이퍼 칩 검사장치 및 이를 이용한 검사방법
JP2627929B2 (ja) 検査装置
JP2717884B2 (ja) 半導体ウエハ測定方法
JPS62136041A (ja) ウエハプロ−バ
JPS6030147A (ja) 半導体ウェ−ハ
JPH0794559A (ja) プローバ
JPH06294817A (ja) プローブカード
JPS63244855A (ja) プロ−ブ装置によるウエハの検査方法
KR0127639B1 (ko) 프로우빙 시험 방법 및 그 장치
JPS6115340A (ja) ウエハプロ−バ
JPS63127545A (ja) プロ−ブ装置
JPS6170735A (ja) 電気測定用アライメントマ−クを有するウエハまたはチツプ
JP2827285B2 (ja) ウェーハ検査装置
JP2655188B2 (ja) 検査装置