JPS62153377A - ウェハダイシング用粘着シート - Google Patents
ウェハダイシング用粘着シートInfo
- Publication number
- JPS62153377A JPS62153377A JP60295190A JP29519085A JPS62153377A JP S62153377 A JPS62153377 A JP S62153377A JP 60295190 A JP60295190 A JP 60295190A JP 29519085 A JP29519085 A JP 29519085A JP S62153377 A JPS62153377 A JP S62153377A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive sheet
- pressure
- sensitive adhesive
- radiation
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 claims abstract description 93
- 239000000853 adhesive Substances 0.000 claims abstract description 92
- 230000005855 radiation Effects 0.000 claims abstract description 46
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 abstract description 17
- 238000001514 detection method Methods 0.000 abstract description 9
- 230000007257 malfunction Effects 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 abstract 2
- 239000000049 pigment Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 54
- 238000000034 method Methods 0.000 description 24
- 239000012790 adhesive layer Substances 0.000 description 19
- -1 polypropylene Polymers 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 7
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 150000003384 small molecules Chemical class 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- 125000004386 diacrylate group Chemical group 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002601 oligoester Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- LIZLYZVAYZQVPG-UHFFFAOYSA-N (3-bromo-2-fluorophenyl)methanol Chemical compound OCC1=CC=CC(Br)=C1F LIZLYZVAYZQVPG-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- FWWWRCRHNMOYQY-UHFFFAOYSA-N 1,5-diisocyanato-2,4-dimethylbenzene Chemical compound CC1=CC(C)=C(N=C=O)C=C1N=C=O FWWWRCRHNMOYQY-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- SYENVBKSVVOOPS-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl prop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C=C SYENVBKSVVOOPS-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- JCDNZBVGSQJAFS-UHFFFAOYSA-N [3-(cyanatomethyl)phenyl]methyl cyanate Chemical compound N#COCC1=CC=CC(COC#N)=C1 JCDNZBVGSQJAFS-UHFFFAOYSA-N 0.000 description 1
- 239000000370 acceptor Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- JPIYZTWMUGTEHX-UHFFFAOYSA-N auramine O free base Chemical compound C1=CC(N(C)C)=CC=C1C(=N)C1=CC=C(N(C)C)C=C1 JPIYZTWMUGTEHX-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical class OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- PRWNDQXXTXXMMW-UHFFFAOYSA-N butan-1-ol;prop-2-enoic acid Chemical compound CCCCO.OC(=O)C=C PRWNDQXXTXXMMW-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- FWQHNLCNFPYBCA-UHFFFAOYSA-N fluoran Chemical compound C12=CC=CC=C2OC2=CC=CC=C2C11OC(=O)C2=CC=CC=C21 FWQHNLCNFPYBCA-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- MYWUZJCMWCOHBA-VIFPVBQESA-N methamphetamine Chemical compound CN[C@@H](C)CC1=CC=CC=C1 MYWUZJCMWCOHBA-VIFPVBQESA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Priority Applications (27)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60295190A JPS62153377A (ja) | 1985-12-27 | 1985-12-27 | ウェハダイシング用粘着シート |
| DE19863639266 DE3639266A1 (de) | 1985-12-27 | 1986-11-17 | Haftfolie |
| US06/932,210 US4756968A (en) | 1985-12-27 | 1986-11-18 | Adhesive sheets |
| PH34523A PH23580A (en) | 1985-12-27 | 1986-11-24 | Adhesive sheet |
| MYPI86000164A MY100214A (en) | 1985-12-27 | 1986-12-02 | Adhesive sheet |
| KR1019860010787A KR910007086B1 (ko) | 1985-12-27 | 1986-12-15 | 점착시이트 |
| FR8618037A FR2592390B1 (fr) | 1985-12-27 | 1986-12-23 | Feuille adhesive utilisable notamment pour le decoupage de pastilles semiconductrices sous la forme de microplaquettes |
| NL8603269A NL191241C (nl) | 1985-12-27 | 1986-12-23 | Kleefvel voor halfgeleiders. |
| GB8630956A GB2184741B (en) | 1985-12-27 | 1986-12-29 | Adhesive sheet suitable for use in the preparation of semiconductor chips |
| US07/111,849 US4965127A (en) | 1985-12-27 | 1987-10-22 | Adhesive sheets |
| MYPI89000327A MY104709A (en) | 1985-12-27 | 1989-05-15 | Adhesive sheet. |
| GB8916857A GB2221470B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for semiconductor wafer processing |
| GB8916855A GB2221468B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
| GB8916856A GB2221469B (en) | 1985-12-27 | 1989-07-24 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
| US07/549,496 US5187007A (en) | 1985-12-27 | 1990-06-29 | Adhesive sheets |
| SG1146/92A SG114692G (en) | 1985-12-27 | 1992-11-02 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
| SG1145/92A SG114592G (en) | 1985-12-27 | 1992-11-02 | Adhesive sheet suitable for semiconductor wafer processing |
| SG1144/92A SG114492G (en) | 1985-12-27 | 1992-11-02 | Adhesive sheet suitable for use in the preparation of semiconductor chips |
| SG1143/92A SG114392G (en) | 1985-12-27 | 1992-11-02 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
| HK1057/92A HK105792A (en) | 1985-12-27 | 1992-12-31 | Adhesive sheet suitable for use in the preparation of semiconductor chips |
| HK1056/92A HK105692A (en) | 1985-12-27 | 1992-12-31 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
| HK1054/92A HK105492A (en) | 1985-12-27 | 1992-12-31 | Adhesive sheet suitable for semiconductor wafer processing |
| HK1055/92A HK105592A (en) | 1985-12-27 | 1992-12-31 | Adhesive sheet suitable for use in dicing semiconductor wafers into chips |
| NL9302149A NL9302149A (nl) | 1985-12-27 | 1993-12-09 | Kleefvel voor halfgeleiders. |
| NL9302147A NL9302147A (nl) | 1985-12-27 | 1993-12-09 | Kleefvel voor halfgeleiders. |
| NL9302148A NL9302148A (nl) | 1985-12-27 | 1993-12-09 | Kleefvel voor halfgeleiders. |
| NL9302150A NL193617C (nl) | 1985-12-27 | 1993-12-09 | Kleefvel voor halfgeleiders. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60295190A JPS62153377A (ja) | 1985-12-27 | 1985-12-27 | ウェハダイシング用粘着シート |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62153377A true JPS62153377A (ja) | 1987-07-08 |
| JPH0215595B2 JPH0215595B2 (enrdf_load_stackoverflow) | 1990-04-12 |
Family
ID=17817367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60295190A Granted JPS62153377A (ja) | 1985-12-27 | 1985-12-27 | ウェハダイシング用粘着シート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62153377A (enrdf_load_stackoverflow) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02107681A (ja) * | 1988-10-18 | 1990-04-19 | Tomoegawa Paper Co Ltd | 光感受性粘着シート |
| JP2011515528A (ja) * | 2008-03-21 | 2011-05-19 | ジャクレ | 構造用接着剤組成物 |
| WO2020189390A1 (ja) * | 2019-03-15 | 2020-09-24 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
| JP2020152905A (ja) * | 2019-03-15 | 2020-09-24 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
| WO2020255849A1 (ja) * | 2019-06-21 | 2020-12-24 | 日東電工株式会社 | 粘着シート、中間積層体、中間積層体の製造方法および製品積層体の製造方法 |
| WO2020262048A1 (ja) * | 2019-06-27 | 2020-12-30 | 日東電工株式会社 | 粘着シート、および粘着シート貼付品の製造方法 |
| JP2021006620A (ja) * | 2019-06-27 | 2021-01-21 | 日東電工株式会社 | 粘着シート、および粘着シート貼付品の製造方法 |
| WO2021075401A1 (ja) * | 2019-10-18 | 2021-04-22 | 日東電工株式会社 | 粘着シートおよび中間積層体 |
| JP2021066869A (ja) * | 2019-10-18 | 2021-04-30 | 日東電工株式会社 | 粘着シートおよび中間積層体 |
| WO2022054633A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054634A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054635A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054636A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054638A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054632A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 積層体、積層体の製造方法、および、可変色粘着シート |
| JP2022046412A (ja) * | 2020-09-10 | 2022-03-23 | 日東電工株式会社 | 積層体、積層体の製造方法、および、可変色粘着シート |
| JP2022046398A (ja) * | 2020-09-10 | 2022-03-23 | 日東電工株式会社 | 可変色粘着シート |
| WO2022186180A1 (ja) * | 2021-03-05 | 2022-09-09 | 日東電工株式会社 | 可変色粘着シートの変色抑制方法および積層シート |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5630410A (en) * | 1979-08-20 | 1981-03-27 | Minnesota Mining & Mfg | Photopolymerizable mixture |
| JPS60173076A (ja) * | 1983-12-27 | 1985-09-06 | チパ−ガイギ− アクチエンゲゼルシヤフト | 熱硬化性接着フイルムの製造方法 |
-
1985
- 1985-12-27 JP JP60295190A patent/JPS62153377A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5630410A (en) * | 1979-08-20 | 1981-03-27 | Minnesota Mining & Mfg | Photopolymerizable mixture |
| JPS60173076A (ja) * | 1983-12-27 | 1985-09-06 | チパ−ガイギ− アクチエンゲゼルシヤフト | 熱硬化性接着フイルムの製造方法 |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02107681A (ja) * | 1988-10-18 | 1990-04-19 | Tomoegawa Paper Co Ltd | 光感受性粘着シート |
| JP2011515528A (ja) * | 2008-03-21 | 2011-05-19 | ジャクレ | 構造用接着剤組成物 |
| WO2020189390A1 (ja) * | 2019-03-15 | 2020-09-24 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
| JP2020152905A (ja) * | 2019-03-15 | 2020-09-24 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
| JP2022159480A (ja) * | 2019-03-15 | 2022-10-17 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
| WO2020255849A1 (ja) * | 2019-06-21 | 2020-12-24 | 日東電工株式会社 | 粘着シート、中間積層体、中間積層体の製造方法および製品積層体の製造方法 |
| WO2020262048A1 (ja) * | 2019-06-27 | 2020-12-30 | 日東電工株式会社 | 粘着シート、および粘着シート貼付品の製造方法 |
| JP2021006620A (ja) * | 2019-06-27 | 2021-01-21 | 日東電工株式会社 | 粘着シート、および粘着シート貼付品の製造方法 |
| KR20220084030A (ko) * | 2019-10-18 | 2022-06-21 | 닛토덴코 가부시키가이샤 | 점착 시트 및 중간 적층체 |
| JP2021066869A (ja) * | 2019-10-18 | 2021-04-30 | 日東電工株式会社 | 粘着シートおよび中間積層体 |
| WO2021075401A1 (ja) * | 2019-10-18 | 2021-04-22 | 日東電工株式会社 | 粘着シートおよび中間積層体 |
| JP2022046284A (ja) * | 2020-09-10 | 2022-03-23 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054635A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054638A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054632A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 積層体、積層体の製造方法、および、可変色粘着シート |
| JP2022046412A (ja) * | 2020-09-10 | 2022-03-23 | 日東電工株式会社 | 積層体、積層体の製造方法、および、可変色粘着シート |
| JP2022046398A (ja) * | 2020-09-10 | 2022-03-23 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054633A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| WO2022054636A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| CN116075568B (zh) * | 2020-09-10 | 2024-02-06 | 日东电工株式会社 | 可变色粘合片 |
| WO2022054634A1 (ja) * | 2020-09-10 | 2022-03-17 | 日東電工株式会社 | 可変色粘着シート |
| KR20230037674A (ko) * | 2020-09-10 | 2023-03-16 | 닛토덴코 가부시키가이샤 | 가변색 점착 시트 |
| KR20230038297A (ko) * | 2020-09-10 | 2023-03-17 | 닛토덴코 가부시키가이샤 | 가변색 점착 시트 |
| CN116075568A (zh) * | 2020-09-10 | 2023-05-05 | 日东电工株式会社 | 可变色粘合片 |
| CN116249752A (zh) * | 2020-09-10 | 2023-06-09 | 日东电工株式会社 | 层叠体、层叠体的制造方法和可变色粘合片 |
| WO2022186180A1 (ja) * | 2021-03-05 | 2022-09-09 | 日東電工株式会社 | 可変色粘着シートの変色抑制方法および積層シート |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0215595B2 (enrdf_load_stackoverflow) | 1990-04-12 |
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