JPS62141078A - 導電塗料用銅粉の処理方法 - Google Patents

導電塗料用銅粉の処理方法

Info

Publication number
JPS62141078A
JPS62141078A JP60281613A JP28161385A JPS62141078A JP S62141078 A JPS62141078 A JP S62141078A JP 60281613 A JP60281613 A JP 60281613A JP 28161385 A JP28161385 A JP 28161385A JP S62141078 A JPS62141078 A JP S62141078A
Authority
JP
Japan
Prior art keywords
copper powder
conductivity
parts
boron
aqueous solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60281613A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0140069B2 (enExample
Inventor
Yukiyoshi Yoshitake
吉武　征義
Jiro Yamamoto
次郎 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Kinzoku Hakufun Kogyo Kk
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
Fukuda Kinzoku Hakufun Kogyo Kk
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Kinzoku Hakufun Kogyo Kk, Fukuda Metal Foil and Powder Co Ltd filed Critical Fukuda Kinzoku Hakufun Kogyo Kk
Priority to JP60281613A priority Critical patent/JPS62141078A/ja
Publication of JPS62141078A publication Critical patent/JPS62141078A/ja
Publication of JPH0140069B2 publication Critical patent/JPH0140069B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Powder Metallurgy (AREA)
JP60281613A 1985-12-13 1985-12-13 導電塗料用銅粉の処理方法 Granted JPS62141078A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60281613A JPS62141078A (ja) 1985-12-13 1985-12-13 導電塗料用銅粉の処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60281613A JPS62141078A (ja) 1985-12-13 1985-12-13 導電塗料用銅粉の処理方法

Publications (2)

Publication Number Publication Date
JPS62141078A true JPS62141078A (ja) 1987-06-24
JPH0140069B2 JPH0140069B2 (enExample) 1989-08-24

Family

ID=17641575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60281613A Granted JPS62141078A (ja) 1985-12-13 1985-12-13 導電塗料用銅粉の処理方法

Country Status (1)

Country Link
JP (1) JPS62141078A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001515A (ja) * 2008-06-18 2010-01-07 Seiko Epson Corp 水アトマイズ粉末の製造方法、水アトマイズ粉末および焼結体の製造方法
JP2017183247A (ja) * 2016-03-31 2017-10-05 Ｊｘ金属株式会社 導電性金属粉ペースト
WO2019054339A1 (ja) * 2017-09-12 2019-03-21 Ｊｘ金属株式会社 低温焼結性表面処理銅微粒子の製造方法
CN114178523A (zh) * 2017-10-04 2022-03-15 Ｊｘ金属株式会社 表面处理铜微粒子的制造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010001515A (ja) * 2008-06-18 2010-01-07 Seiko Epson Corp 水アトマイズ粉末の製造方法、水アトマイズ粉末および焼結体の製造方法
JP2017183247A (ja) * 2016-03-31 2017-10-05 Ｊｘ金属株式会社 導電性金属粉ペースト
WO2019054339A1 (ja) * 2017-09-12 2019-03-21 Ｊｘ金属株式会社 低温焼結性表面処理銅微粒子の製造方法
JP2019052332A (ja) * 2017-09-12 2019-04-04 Ｊｘ金属株式会社 低温焼結性表面処理銅微粒子の製造方法
TWI677488B (zh) * 2017-09-12 2019-11-21 日商Ｊｘ金屬股份有限公司 低溫燒結性表面處理銅微粒子之製造方法
CN114178523A (zh) * 2017-10-04 2022-03-15 Ｊｘ金属株式会社 表面处理铜微粒子的制造方法
CN114178523B (zh) * 2017-10-04 2024-03-01 Ｊｘ金属株式会社 表面处理铜微粒子的制造方法

Also Published As

Publication number Publication date
JPH0140069B2 (enExample) 1989-08-24

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