JPS62140822A - ポリイミド積層シ−トおよびその製造法 - Google Patents

ポリイミド積層シ−トおよびその製造法

Info

Publication number
JPS62140822A
JPS62140822A JP60281957A JP28195785A JPS62140822A JP S62140822 A JPS62140822 A JP S62140822A JP 60281957 A JP60281957 A JP 60281957A JP 28195785 A JP28195785 A JP 28195785A JP S62140822 A JPS62140822 A JP S62140822A
Authority
JP
Japan
Prior art keywords
aromatic polyimide
films
aromatic
transition point
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60281957A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0559815B2 (enExample
Inventor
Takahiko Sado
佐渡　孝彦
Hiroaki Mori
森　弘昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP60281957A priority Critical patent/JPS62140822A/ja
Priority to US06/941,432 priority patent/US4788098A/en
Publication of JPS62140822A publication Critical patent/JPS62140822A/ja
Publication of JPH0559815B2 publication Critical patent/JPH0559815B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP60281957A 1985-12-17 1985-12-17 ポリイミド積層シ−トおよびその製造法 Granted JPS62140822A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60281957A JPS62140822A (ja) 1985-12-17 1985-12-17 ポリイミド積層シ−トおよびその製造法
US06/941,432 US4788098A (en) 1985-12-17 1986-12-15 Aromatic polyimide laminate sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60281957A JPS62140822A (ja) 1985-12-17 1985-12-17 ポリイミド積層シ−トおよびその製造法

Publications (2)

Publication Number Publication Date
JPS62140822A true JPS62140822A (ja) 1987-06-24
JPH0559815B2 JPH0559815B2 (enExample) 1993-09-01

Family

ID=17646258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60281957A Granted JPS62140822A (ja) 1985-12-17 1985-12-17 ポリイミド積層シ−トおよびその製造法

Country Status (2)

Country Link
US (1) US4788098A (enExample)
JP (1) JPS62140822A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH03180343A (ja) * 1989-12-08 1991-08-06 Ube Ind Ltd 多層押出ポリイミドフィルムの製法
JPH08224845A (ja) * 1994-12-14 1996-09-03 E I Du Pont De Nemours & Co 接着剤不要の芳香族ポリイミド積層体およびその製造方法
JP2000096010A (ja) * 1998-09-22 2000-04-04 Toray Ind Inc 半導体装置用接着テープ
JP2001004850A (ja) * 1999-06-17 2001-01-12 Nippon Telegr & Teleph Corp <Ntt> 光部品用基板とその製造方法、および該基板の熱膨張率制御方法
JPWO2012133594A1 (ja) * 2011-03-30 2014-07-28 宇部興産株式会社 ポリイミドフィルムおよびそれを用いた金属積層板
JP2017008311A (ja) * 2015-06-17 2017-01-12 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． ポリイミド樹脂及びこれを含むメタルクラッド積層板
JP2022071513A (ja) * 2020-10-28 2022-05-16 河村産業株式会社 積層ポリイミド系フィルムの製造方法及び積層ポリイミド系フィルム

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021129A (en) * 1989-09-25 1991-06-04 International Business Machines Corporation Multilayer structures of different electroactive materials and methods of fabrication thereof
JP2761655B2 (ja) * 1989-11-17 1998-06-04 鐘淵化学工業株式会社 フレキシブルプリント基板の製造方法
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
US5372891A (en) * 1990-08-22 1994-12-13 Industrial Technology Research Institute Flexible copper/polyimide and barbituric acid modified bismaleimide blend/polyimide laminate
US5156710A (en) * 1991-05-06 1992-10-20 International Business Machines Corporation Method of laminating polyimide to thin sheet metal
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
US5264534A (en) * 1991-10-31 1993-11-23 Foster-Miller, Inc. Oriented semicrystalline polymer films
EP0659553A1 (en) * 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Coextruded multi-layer aromatic polyimide film and preparation thereof
US6379784B1 (en) * 1999-09-28 2002-04-30 Ube Industries, Ltd. Aromatic polyimide laminate
KR100947257B1 (ko) * 2001-02-27 2010-03-11 가부시키가이샤 가네카 폴리이미드 필름 및 그 제조방법
JP6721041B2 (ja) 2016-04-28 2020-07-08 東洋紡株式会社 ポリイミドフィルム積層体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4543295A (en) * 1980-09-22 1985-09-24 The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration High temperature polyimide film laminates and process for preparation thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01245586A (ja) * 1988-03-28 1989-09-29 Nippon Steel Chem Co Ltd フレキシブルプリント基板
JPH03180343A (ja) * 1989-12-08 1991-08-06 Ube Ind Ltd 多層押出ポリイミドフィルムの製法
JPH08224845A (ja) * 1994-12-14 1996-09-03 E I Du Pont De Nemours & Co 接着剤不要の芳香族ポリイミド積層体およびその製造方法
JP2000096010A (ja) * 1998-09-22 2000-04-04 Toray Ind Inc 半導体装置用接着テープ
JP2001004850A (ja) * 1999-06-17 2001-01-12 Nippon Telegr & Teleph Corp <Ntt> 光部品用基板とその製造方法、および該基板の熱膨張率制御方法
JPWO2012133594A1 (ja) * 2011-03-30 2014-07-28 宇部興産株式会社 ポリイミドフィルムおよびそれを用いた金属積層板
JP2017008311A (ja) * 2015-06-17 2017-01-12 長興材料工業股▲ふん▼有限公司Ｅｔｅｒｎａｌ Ｍａｔｅｒｉａｌｓ Ｃｏ．，Ｌｔｄ． ポリイミド樹脂及びこれを含むメタルクラッド積層板
JP2022071513A (ja) * 2020-10-28 2022-05-16 河村産業株式会社 積層ポリイミド系フィルムの製造方法及び積層ポリイミド系フィルム

Also Published As

Publication number Publication date
US4788098A (en) 1988-11-29
JPH0559815B2 (enExample) 1993-09-01

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