JPS6210190B2 - - Google Patents
Info
- Publication number
- JPS6210190B2 JPS6210190B2 JP55050939A JP5093980A JPS6210190B2 JP S6210190 B2 JPS6210190 B2 JP S6210190B2 JP 55050939 A JP55050939 A JP 55050939A JP 5093980 A JP5093980 A JP 5093980A JP S6210190 B2 JPS6210190 B2 JP S6210190B2
- Authority
- JP
- Japan
- Prior art keywords
- resin content
- prepreg
- inner layer
- laminate
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5093980A JPS56144957A (en) | 1980-04-15 | 1980-04-15 | Manufacture of laminated board for multilayer printed wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5093980A JPS56144957A (en) | 1980-04-15 | 1980-04-15 | Manufacture of laminated board for multilayer printed wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56144957A JPS56144957A (en) | 1981-11-11 |
| JPS6210190B2 true JPS6210190B2 (OSRAM) | 1987-03-04 |
Family
ID=12872786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5093980A Granted JPS56144957A (en) | 1980-04-15 | 1980-04-15 | Manufacture of laminated board for multilayer printed wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56144957A (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58202582A (ja) * | 1982-05-21 | 1983-11-25 | 新神戸電機株式会社 | 片面金属箔張り積層板の製造法 |
| JPS60257591A (ja) * | 1984-06-04 | 1985-12-19 | 松下電工株式会社 | 多層プリント配線板の製法 |
| JPS63111698A (ja) * | 1986-10-30 | 1988-05-16 | 新神戸電機株式会社 | 金属箔張積層板の製造法 |
| JPH07109940B2 (ja) * | 1990-12-14 | 1995-11-22 | 松下電工株式会社 | 多層回路板の製造方法 |
| JP3239716B2 (ja) * | 1995-10-23 | 2001-12-17 | 松下電工株式会社 | 積層板の製造方法 |
| JP4819033B2 (ja) * | 2005-01-27 | 2011-11-16 | パナソニック株式会社 | 多層回路基板の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5431519B2 (OSRAM) * | 1973-01-24 | 1979-10-08 | ||
| JPS505482A (OSRAM) * | 1973-05-17 | 1975-01-21 | ||
| JPS54143474A (en) * | 1978-04-29 | 1979-11-08 | Matsushita Electric Works Ltd | Manufacture of laminate clad with metal foil on one side |
-
1980
- 1980-04-15 JP JP5093980A patent/JPS56144957A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56144957A (en) | 1981-11-11 |
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