JPS62100577A - 熱伝導性組成物 - Google Patents
熱伝導性組成物Info
- Publication number
- JPS62100577A JPS62100577A JP60241098A JP24109885A JPS62100577A JP S62100577 A JPS62100577 A JP S62100577A JP 60241098 A JP60241098 A JP 60241098A JP 24109885 A JP24109885 A JP 24109885A JP S62100577 A JPS62100577 A JP S62100577A
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- conductive composition
- acid
- titanate
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60241098A JPS62100577A (ja) | 1985-10-28 | 1985-10-28 | 熱伝導性組成物 |
KR1019860009040A KR920009540B1 (ko) | 1985-10-28 | 1986-10-28 | 전기 전도성 조성물 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60241098A JPS62100577A (ja) | 1985-10-28 | 1985-10-28 | 熱伝導性組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62100577A true JPS62100577A (ja) | 1987-05-11 |
JPH0571630B2 JPH0571630B2 (enrdf_load_stackoverflow) | 1993-10-07 |
Family
ID=17069258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60241098A Granted JPS62100577A (ja) | 1985-10-28 | 1985-10-28 | 熱伝導性組成物 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS62100577A (enrdf_load_stackoverflow) |
KR (1) | KR920009540B1 (enrdf_load_stackoverflow) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01163257A (ja) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | 低応力封止材 |
JPH04311758A (ja) * | 1991-04-10 | 1992-11-04 | Toray Ind Inc | 液晶ポリマ樹脂組成物 |
US6261481B1 (en) * | 1998-03-19 | 2001-07-17 | Hitachi, Ltd | Insulating composition |
EP1384567A1 (en) | 2002-07-22 | 2004-01-28 | Polymatech Co., Ltd. | Thermally conductive polymer molded article and method for producing the same |
US7079405B2 (en) | 2002-07-11 | 2006-07-18 | Polymatech Co., Ltd. | Thermal conductive polymer molded article and method for producing the same |
JP2010065179A (ja) * | 2008-09-12 | 2010-03-25 | Sumitomo Chemical Co Ltd | 液晶ポリエステル樹脂組成物及びそれを用いてなる成形体 |
US8258209B2 (en) | 2007-09-12 | 2012-09-04 | Sumitomo Chemical Company, Limited | Insulating resin composition and application thereof |
US8519042B2 (en) | 2006-07-24 | 2013-08-27 | Sumitomo Chemical Company, Limited | Thermal conductive resin composition |
US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
JP2014511922A (ja) * | 2011-04-06 | 2014-05-19 | サムスン ファイン ケミカルズ カンパニー リミテッド | 熱伝導性高分子複合素材及びそれを含む物品 |
US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102574992B (zh) * | 2009-09-30 | 2015-03-11 | 宝理塑料株式会社 | 液晶性高分子以及成型体 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5985733A (ja) * | 1982-09-30 | 1984-05-17 | ヘキスト・セラニーズ・コーポレーション | サーモトロピック液晶ポリマーからなる配合物、その成形方法および成形品 |
-
1985
- 1985-10-28 JP JP60241098A patent/JPS62100577A/ja active Granted
-
1986
- 1986-10-28 KR KR1019860009040A patent/KR920009540B1/ko not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5985733A (ja) * | 1982-09-30 | 1984-05-17 | ヘキスト・セラニーズ・コーポレーション | サーモトロピック液晶ポリマーからなる配合物、その成形方法および成形品 |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01163257A (ja) * | 1987-09-11 | 1989-06-27 | Polyplastics Co | 低応力封止材 |
JPH04311758A (ja) * | 1991-04-10 | 1992-11-04 | Toray Ind Inc | 液晶ポリマ樹脂組成物 |
US6261481B1 (en) * | 1998-03-19 | 2001-07-17 | Hitachi, Ltd | Insulating composition |
US7079405B2 (en) | 2002-07-11 | 2006-07-18 | Polymatech Co., Ltd. | Thermal conductive polymer molded article and method for producing the same |
EP1384567A1 (en) | 2002-07-22 | 2004-01-28 | Polymatech Co., Ltd. | Thermally conductive polymer molded article and method for producing the same |
US7189778B2 (en) | 2002-07-22 | 2007-03-13 | Polymatech Co., Ltd. | Thermally conductive polymer molded article and method for producing the same |
US8519042B2 (en) | 2006-07-24 | 2013-08-27 | Sumitomo Chemical Company, Limited | Thermal conductive resin composition |
US8258209B2 (en) | 2007-09-12 | 2012-09-04 | Sumitomo Chemical Company, Limited | Insulating resin composition and application thereof |
JP2010065179A (ja) * | 2008-09-12 | 2010-03-25 | Sumitomo Chemical Co Ltd | 液晶ポリエステル樹脂組成物及びそれを用いてなる成形体 |
US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
JP2014511922A (ja) * | 2011-04-06 | 2014-05-19 | サムスン ファイン ケミカルズ カンパニー リミテッド | 熱伝導性高分子複合素材及びそれを含む物品 |
EP2695914A4 (en) * | 2011-04-06 | 2015-06-03 | Shenzhen Wote Advanced Materials Co Ltd | HEAT-LEADING POLYMER COMPOSITE AND ARTICLES THEREWITH |
Also Published As
Publication number | Publication date |
---|---|
JPH0571630B2 (enrdf_load_stackoverflow) | 1993-10-07 |
KR870004094A (ko) | 1987-05-07 |
KR920009540B1 (ko) | 1992-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |